As the global economy mends, the 2021 growth of Embedded Multi Chip Package (eMCP) will have significant change from previous year. According to our (LP Information) latest study, the global Embedded Multi Chip Package (eMCP) market size is USD million in 2022 from USD million in 2021, with a change of % between 2021 and 2022. The global Embedded Multi Chip Package (eMCP) market size will reach USD million in 2028, growing at a CAGR of % over the analysis period 2022-2028.
The United States Embedded Multi Chip Package (eMCP) market is expected at value of US$ million in 2021 and grow at approximately % CAGR during forecast period 2022-2028. China constitutes a % market for the global Embedded Multi Chip Package (eMCP) market, reaching US$ million by the year 2028. As for the Europe Embedded Multi Chip Package (eMCP) landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 6-year period.
Global main Embedded Multi Chip Package (eMCP) players cover Micron Technology, Samsung Electro-Mechanics, Kingston Technology, and SK Hynix Semiconductor Inc., etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Embedded Multi Chip Package (eMCP) market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Middle East & Africa
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
SK Hynix Semiconductor Inc.
Shenzhen Longsys Electronics
Shenzhen Shichuangyi Electronics
Silicon Integrated Systems