According to our (Global Info Research) latest study, the global Electroplating Grade PC/ABS Alloy market size was valued at US$ 2002 million in 2024 and is forecast to a readjusted size of USD 2734 million by 2031 with a CAGR of 4.4% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Electroplating grade PC/ABS alloy requires good adhesion between the metal coating and the substrate. Electroplating grade PC/ABS alloy is an alloy made by blending polycarbonate (PC) and acrylonitrile-butadiene-styrene copolymer (ABS). PC is a very common substrate in engineering plastics. Its advantages are high mechanical strength and strong impact resistance, but poor fluidity and easy cracking. As one of the general plastics, ABS has good electroplating performance and strong corrosion resistance, but low impact resistance. Therefore, the composite of PC and ABS provides a new direction for the modification of engineering plastics. The mixed PC/ABS material not only has the good impact resistance and formability of ABS material, but also has excellent impact resistance and heat resistance of PC, and is widely used in automotive accessories, electronics and other products. The reason why PC/ABS can be electroplated is that the rubber component (B) is etched by chromic acid/concentrated sulfuric acid, which makes the surface of the material present microscopic roughness, increases the contact area between the coating and the plastic substrate, and thus forms a large number of holes, which play an anchoring role, so as to facilitate the subsequent sensitization activation and chemical nickel or copper plating. Therefore, generally speaking, the rubber content in electroplating grade PC/ABS will be significantly higher than that in ordinary grade PC/ABS.
This report is a detailed and comprehensive analysis for global Electroplating Grade PC/ABS Alloy market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Electroplating Grade PC/ABS Alloy market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Electroplating Grade PC/ABS Alloy market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Electroplating Grade PC/ABS Alloy market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Electroplating Grade PC/ABS Alloy market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Electroplating Grade PC/ABS Alloy
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Electroplating Grade PC/ABS Alloy market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Techno-UMG, LOTTE Chemical, SABIC, Covestro, Teijin, Trinseo, CHIMEI, PRET, HEGLY, Zhonglei New Material Science, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Electroplating Grade PC/ABS Alloy market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Density Greater than 1.10g/cm3
Density Less than 1.10g/cm3
Market segment by Application
Auto Parts
Consumer Electronic Components
Household Appliance Housings
Toys
Other
Major players covered
Techno-UMG
LOTTE Chemical
SABIC
Covestro
Teijin
Trinseo
CHIMEI
PRET
HEGLY
Zhonglei New Material Science
FCFC
KUMHO-SUNNY
Jinyoung
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Electroplating Grade PC/ABS Alloy product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Electroplating Grade PC/ABS Alloy, with price, sales quantity, revenue, and global market share of Electroplating Grade PC/ABS Alloy from 2020 to 2025.
Chapter 3, the Electroplating Grade PC/ABS Alloy competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Electroplating Grade PC/ABS Alloy breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Electroplating Grade PC/ABS Alloy market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Electroplating Grade PC/ABS Alloy.
Chapter 14 and 15, to describe Electroplating Grade PC/ABS Alloy sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Electroplating Grade PC/ABS Alloy. Industry analysis & Market Report on Electroplating Grade PC/ABS Alloy is a syndicated market report, published as Global Electroplating Grade PC/ABS Alloy Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of Electroplating Grade PC/ABS Alloy market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.