Global Electronic Printed Circuit Board (PCB) Market Research Report 2012-2024

Table of Contents

1 Market Overview

• 1.1 Objectives of Research
  • 1.1.1 Definition
  • 1.1.2 Specifications
• 1.2 Market Segment
  • 1.2.1 by Type
    • 1.2.1.1 Rigid 1-2Sided
    • 1.2.1.2 Standard Multilayer
    • 1.2.1.3 HDI/Microvia/Build-Up
    • 1.2.1.4 IC Substrate
    • 1.2.1.5 Flexible Circuits
    • 1.2.1.6 Rigid Flex
  • 1.2.2 by Application
    • 1.2.2.1 Consumer electronics
    • 1.2.2.2 Computer
    • 1.2.2.3 Communications
    • 1.2.2.4 Industrial/Medical
    • 1.2.2.5 Automotive
    • 1.2.2.6 Military/Aerospace
  • 1.2.3 by Regions

2 Industry Chain

• 2.1 Industry Chain Structure
• 2.2 Upstream
• 2.3 Market
  • 2.3.1 SWOT
  • 2.3.2 Dynamics

3 Environmental Analysis

• 3.1 Policy
• 3.2 Economic
• 3.3 Technology
• 3.4 Market Entry

4 Market Segmentation by Type

• 4.1 Market Size
  • 4.1.1 Rigid 1-2Sided Market, 2013-2018
  • 4.1.2 Standard Multilayer Market, 2013-2018
  • 4.1.3 HDI/Microvia/Build-Up Market, 2013-2018
  • 4.1.4 IC Substrate Market, 2013-2018
  • 4.1.5 Flexible Circuits Market, 2013-2018
  • 4.1.6 Rigid Flex Market, 2013-2018
• 4.2 Market Forecast
  • 4.2.1 Rigid 1-2Sided Market Forecast, 2019-2024
  • 4.2.2 Standard Multilayer Market Forecast, 2019-2024
  • 4.2.3 HDI/Microvia/Build-Up Market Forecast, 2019-2024
  • 4.2.4 IC Substrate Market Forecast, 2019-2024
  • 4.2.5 Flexible Circuits Market Forecast, 2019-2024
  • 4.2.6 Rigid Flex Market Forecast, 2019-2024

5 Market Segmentation by Application

• 5.1 Market Size
  • 5.1.1 Consumer electronics Market, 2013-2018
  • 5.1.2 Computer Market, 2013-2018
  • 5.1.3 Communications Market, 2013-2018
  • 5.1.4 Industrial/Medical Market, 2013-2018
  • 5.1.5 Automotive Market, 2013-2018
  • 5.1.6 Military/Aerospace Market, 2013-2018
• 5.2 Market Forecast
  • 5.2.1 Consumer electronics Market Forecast, 2019-2024
  • 5.2.2 Computer Market Forecast, 2019-2024
  • 5.2.3 Communications Market Forecast, 2019-2024
  • 5.2.4 Industrial/Medical Market Forecast, 2019-2024
  • 5.2.5 Automotive Market Forecast, 2019-2024
  • 5.2.6 Military/Aerospace Market Forecast, 2019-2024

6 Market Segmentation by Region

• 6.1 Market Size
  • 6.1.1 Asia-Pacific
    • 6.1.1.1 Asia-Pacific Market, 2012-2018
    • 6.1.1.2 Asia-Pacific Market by Type
    • 6.1.1.3 Asia-Pacific Market by Application
  • 6.1.2 North America
    • 6.1.2.1 North America Market, 2012-2018
    • 6.1.2.2 North America Market by Type
    • 6.1.2.3 North America Market by Application
  • 6.1.3 Europe
    • 6.1.3.1 Europe Market, 2012-2018
    • 6.1.3.2 Europe Market by Type
    • 6.1.3.3 Europe Market by Application
  • 6.1.4 South America
    • 6.1.4.1 South America Market, 2012-2018
    • 6.1.4.2 South America Market by Type
    • 6.1.4.3 South America Market by Application
  • 6.1.5 Middle East & Africa
    • 6.1.5.1 Middle East & Africa Market, 2012-2018
    • 6.1.5.2 Middle East & Africa Market by Type
    • 6.1.5.3 Middle East & Africa Market by Application
• 6.2 Market Forecast
  • 6.2.1 Asia-Pacific Market Forecast, 2019-2024
  • 6.2.2 North America Market Forecast, 2019-2024
  • 6.2.3 Europe Market Forecast, 2019-2024
  • 6.2.4 South America Market Forecast, 2019-2024
  • 6.2.5 Middle East & Africa Market Forecast, 2019-2024

7 Market Competitive

• 7.1 Global Market by Vendors
• 7.2 Market Concentration
• 7.3 Price & Factors
• 7.4 Marketing Channel

8 Major Vendors

• 8.1 Nippon Mektron
• 8.2 Unimicron
• 8.3 SEMCO
• 8.4 Young Poong Group.
• 8.5 Ibiden
• 8.6 ZDT
• 8.7 Tripod
• 8.8 TTM
• 8.9 SEI
• 8.10 Daeduck Group
• 8.11 HannStar Board (GBM)
• 8.12 Viasystems
• 8.13 Nanya PCB
• 8.14 CMK Corporation
• 8.15 Shinko Electric Ind
• 8.16 Compeq
• 8.17 AT&S
• 8.18 Kingboard
• 8.19 Ellington
• 8.20 Junda Electronic
• 8.21 CCTC
• 8.22 Redboard
• 8.23 Wuzhou Group
• 8.24 Kinwong
• 8.25 Aoshikang
• 8.26 Shennan Circuits

9 Conclusion