Report Detail

Electronics & Semiconductor Global (United States, European Union and China) E-Chuck for Wafer Market Research Report 2019-2025

  • RnM3664471
  • |
  • 13 August, 2019
  • |
  • Global
  • |
  • 116 Pages
  • |
  • QYResearch
  • |
  • Electronics & Semiconductor

E-Chuck for Wafer is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc.
In 2019, the market size of E-Chuck for Wafer is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for E-Chuck for Wafer.

This report studies the global market size of E-Chuck for Wafer, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the E-Chuck for Wafer production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

In global market, the following companies are covered:
SHINKO
TOTO
Creative Technology Corporation
Kyocera
FM Industries
NTK CERATEC
Tsukuba Seiko
Applied Materials
II-VI M Cubed

Market Segment by Product Type
Coulomb Type E-Chuck for Wafer
Johnsen-Rahbek (JR) Type E-Chuck for Wafer

Market Segment by Application
300 mm Wafer
200 mm Wafer
Others

Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)

The study objectives are:
To analyze and research the E-Chuck for Wafer status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key E-Chuck for Wafer manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

In this study, the years considered to estimate the market size of E-Chuck for Wafer are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025


Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global E-Chuck for Wafer Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 Coulomb Type E-Chuck for Wafer
      • 1.3.3 Johnsen-Rahbek (JR) Type E-Chuck for Wafer
    • 1.4 Market Segment by Application
      • 1.4.1 Global E-Chuck for Wafer Market Share by Application (2019-2025)
      • 1.4.2 300 mm Wafer
      • 1.4.3 200 mm Wafer
      • 1.4.4 Others
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global E-Chuck for Wafer Production Value 2014-2025
      • 2.1.2 Global E-Chuck for Wafer Production 2014-2025
      • 2.1.3 Global E-Chuck for Wafer Capacity 2014-2025
      • 2.1.4 Global E-Chuck for Wafer Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global E-Chuck for Wafer Market Size CAGR of Key Regions
      • 2.2.2 Global E-Chuck for Wafer Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global E-Chuck for Wafer Capacity by Manufacturers
      • 3.1.2 Global E-Chuck for Wafer Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 E-Chuck for Wafer Revenue by Manufacturers (2014-2019)
      • 3.2.2 E-Chuck for Wafer Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global E-Chuck for Wafer Market Concentration Ratio (CR5 and HHI)
    • 3.3 E-Chuck for Wafer Price by Manufacturers
    • 3.4 Key Manufacturers E-Chuck for Wafer Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into E-Chuck for Wafer Market
    • 3.6 Key Manufacturers E-Chuck for Wafer Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 Coulomb Type E-Chuck for Wafer Production and Production Value (2014-2019)
      • 4.1.2 Johnsen-Rahbek (JR) Type E-Chuck for Wafer Production and Production Value (2014-2019)
    • 4.2 Global E-Chuck for Wafer Production Market Share by Type
    • 4.3 Global E-Chuck for Wafer Production Value Market Share by Type
    • 4.4 E-Chuck for Wafer Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global E-Chuck for Wafer Consumption by Application

    6 Production by Regions

    • 6.1 Global E-Chuck for Wafer Production (History Data) by Regions 2014-2019
    • 6.2 Global E-Chuck for Wafer Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States E-Chuck for Wafer Production Growth Rate 2014-2019
      • 6.3.2 United States E-Chuck for Wafer Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States E-Chuck for Wafer Import & Export
    • 6.4 European Union
      • 6.4.1 European Union E-Chuck for Wafer Production Growth Rate 2014-2019
      • 6.4.2 European Union E-Chuck for Wafer Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union E-Chuck for Wafer Import & Export
    • 6.5 China
      • 6.5.1 China E-Chuck for Wafer Production Growth Rate 2014-2019
      • 6.5.2 China E-Chuck for Wafer Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China E-Chuck for Wafer Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 E-Chuck for Wafer Consumption by Regions

    • 7.1 Global E-Chuck for Wafer Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States E-Chuck for Wafer Consumption by Type
      • 7.2.2 United States E-Chuck for Wafer Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union E-Chuck for Wafer Consumption by Type
      • 7.3.2 European Union E-Chuck for Wafer Consumption by Application
    • 7.4 China
      • 7.4.1 China E-Chuck for Wafer Consumption by Type
      • 7.4.2 China E-Chuck for Wafer Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World E-Chuck for Wafer Consumption by Type
      • 7.5.2 Rest of World E-Chuck for Wafer Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 SHINKO
      • 8.1.1 SHINKO Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of E-Chuck for Wafer
      • 8.1.4 E-Chuck for Wafer Product Introduction
      • 8.1.5 SHINKO Recent Development
    • 8.2 TOTO
      • 8.2.1 TOTO Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of E-Chuck for Wafer
      • 8.2.4 E-Chuck for Wafer Product Introduction
      • 8.2.5 TOTO Recent Development
    • 8.3 Creative Technology Corporation
      • 8.3.1 Creative Technology Corporation Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of E-Chuck for Wafer
      • 8.3.4 E-Chuck for Wafer Product Introduction
      • 8.3.5 Creative Technology Corporation Recent Development
    • 8.4 Kyocera
      • 8.4.1 Kyocera Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of E-Chuck for Wafer
      • 8.4.4 E-Chuck for Wafer Product Introduction
      • 8.4.5 Kyocera Recent Development
    • 8.5 FM Industries
      • 8.5.1 FM Industries Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of E-Chuck for Wafer
      • 8.5.4 E-Chuck for Wafer Product Introduction
      • 8.5.5 FM Industries Recent Development
    • 8.6 NTK CERATEC
      • 8.6.1 NTK CERATEC Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of E-Chuck for Wafer
      • 8.6.4 E-Chuck for Wafer Product Introduction
      • 8.6.5 NTK CERATEC Recent Development
    • 8.7 Tsukuba Seiko
      • 8.7.1 Tsukuba Seiko Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of E-Chuck for Wafer
      • 8.7.4 E-Chuck for Wafer Product Introduction
      • 8.7.5 Tsukuba Seiko Recent Development
    • 8.8 Applied Materials
      • 8.8.1 Applied Materials Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of E-Chuck for Wafer
      • 8.8.4 E-Chuck for Wafer Product Introduction
      • 8.8.5 Applied Materials Recent Development
    • 8.9 II-VI M Cubed
      • 8.9.1 II-VI M Cubed Company Details
      • 8.9.2 Company Description and Business Overview
      • 8.9.3 Production and Revenue of E-Chuck for Wafer
      • 8.9.4 E-Chuck for Wafer Product Introduction
      • 8.9.5 II-VI M Cubed Recent Development

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global E-Chuck for Wafer Capacity, Production Forecast 2019-2025
      • 9.1.2 Global E-Chuck for Wafer Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global E-Chuck for Wafer Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global E-Chuck for Wafer Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global E-Chuck for Wafer Production Forecast by Type
      • 9.7.2 Global E-Chuck for Wafer Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 E-Chuck for Wafer Sales Channels
      • 10.2.2 E-Chuck for Wafer Distributors
    • 10.3 E-Chuck for Wafer Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      Summary:
      Get latest Market Research Reports on E-Chuck for Wafer. Industry analysis & Market Report on E-Chuck for Wafer is a syndicated market report, published as Global (United States, European Union and China) E-Chuck for Wafer Market Research Report 2019-2025. It is complete Research Study and Industry Analysis of E-Chuck for Wafer market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

      Last updated on

      REPORT YOU MIGHT BE INTERESTED

      Purchase this Report

      $3,280.00
      $4,920.00
      $6,560.00
      2,584.64
      3,876.96
      5,169.28
      3,017.60
      4,526.40
      6,035.20
      510,433.60
      765,650.40
      1,020,867.20
      273,486.40
      410,229.60
      546,972.80
      Credit card Logo

      Related Reports


      Reason to Buy

      Request for Sample of this report