According to our (Global Info Research) latest study, the global Chip Power Inductor market size was valued at US$ 4721 million in 2025 and is forecast to a readjusted size of US$ 7722 million by 2032 with a CAGR of 7.2% during review period.
A chip power inductor is a surface-mount power inductor designed for PCB assembly, typically built with wire-wound, multilayer, co-fired, or molded constructions to provide energy storage, power filtering, and EMI suppression. It is widely used in DC-DC converters, voltage regulation modules, power decoupling, and EMI filtering within automotive and other electronic power-management circuits, where compact size, low DCR, high saturation current, reliability, and thermal stability are key requirements. In 2025, global chip power inductor production reached 73.358 billion units, with an average price of USD 62.54 per thousand units.
Chip power inductors are surface-mount power inductors designed for PCB assembly, primarily used in DC-DC conversion, voltage regulation, and power filtering. They are among the most representative foundational magnetic components in the upgrade cycle of power architectures and rising power density. Industry growth is driven by higher switching frequencies, greater integration, and multi-rail power designs that lift both unit consumption and specification requirements. Consumer electronics and PCs continue to provide a stable demand base, while automotive electronics including cockpit, ADAS, domain controllers, and electrified power systems and industrial controls steadily raise the share of products requiring high reliability, wide operating temperature ranges, and long lifecycle supply consistency. This shift is accelerating the industry transition from general-purpose supply toward higher-end products, platform-based selection, and scenario-oriented co-design. From a regional perspective, capacity and upstream supporting ecosystems are highly concentrated in East Asia, forming manufacturing and materials clusters centered on Japan, mainland China, Taiwan, and South Korea, with further expansion into Southeast Asia to diversify capacity and strengthen delivery resilience. On the demand side, the pattern is Asian manufacturing with global installations. Automotive and industrial customers in North America and Europe are more sensitive to localization requirements and qualification lead times, pushing suppliers to build multi-site qualification capabilities and dual-sourcing systems. Along the value chain, upstream inputs include ferrite powders, metal composite magnetic powders, copper wire and flat copper strips, electrode materials, ceramic dielectrics, and encapsulation resins. Midstream processes cover inductor design, winding or forming, sintering or curing, termination electrodes and plating, testing and binning, and packaging. Downstream customers span consumer electronics and PC OEMs and EMS providers, telecom equipment and server power chains, automotive Tier 1s and OEMs, and joint development ecosystems with power module and PMIC suppliers. In terms of product structure and application structure, chip power inductors can be classified by construction and process into wire-wound coated types, molded one-piece types, multilayer or co-fired types, and assembled types, and they form a tiered portfolio across package sizes such as 0201, 0402, 0603, 0805, and 1210 and across current ratings. Multilayer and co-fired approaches are stronger in small-size and high-consistency scenarios, while molded and flat-wire winding approaches are penetrating faster in medium-to-high current, low DCR, and thermal management-sensitive scenarios. On the application side, demand is pulled in two directions, from miniaturized devices such as smartphones and wearables and from high-current, high-reliability systems such as automotive and AI or edge computing. The primary opportunity is driven by specification upgrades and rising value per device rather than sheer unit growth. On the cost side, materials typically account for 40% to 60% of total cost, with magnetic materials, copper, and terminations and plating as the main contributors. Manufacturing overhead and depreciation represent 15% to 25%, largely tied to automated forming, sintering or curing, plating, and test equipment. Labor, operating expenses, and yield losses together represent 15% to 30%. Profitability is highly sensitive to raw material price fluctuations and yield stability. For mainstream chip packages such as 0402 and 0603, a typical automated production line delivers a single-line monthly capacity in the range of 20 to 80 million units. Bottlenecks most often sit in sintering or curing takt time, plating consistency, and final test and binning capacity. Gross margin varies materially by product mix: general-purpose products commonly fall in the 15% to 25% range, while high-current molded products, flat-wire designs, and automotive-grade products can reach 25% to 40%, depending on qualification barriers, customer concentration, and pricing power. Competition shows a pattern of high concentration at the top and tiered rivalry across segments. Global leaders hold advantages in material systems, process windows, automotive qualification, and global delivery capabilities. Chinese and broader Asian suppliers are strengthening competitiveness through scale manufacturing, cost control, and local responsiveness, and are upgrading through automotive program wins and co-development with power IC and module partners. Key technology and market trends include the wider adoption of metal composite magnetic materials, molded structures, flat-wire windings, low DCR and low-loss designs, and tighter consistency management linked to AEC-Q200 and functional safety expectations. At the same time, supply chain resilience and multi-site manufacturing qualification are becoming increasingly important, and the industry is evolving from single-spec component supply toward scenario-based power-chain solutions, shifting competition from individual parts to integrated capabilities spanning materials, processes, validation, and delivery.
This report is a detailed and comprehensive analysis for global Chip Power Inductor market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Chip Power Inductor market size and forecasts, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (US$/Unit), 2021-2032
Global Chip Power Inductor market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (US$/Unit), 2021-2032
Global Chip Power Inductor market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (US$/Unit), 2021-2032
Global Chip Power Inductor market shares of main players, shipments in revenue ($ Million), sales quantity (Million Units), and ASP (US$/Unit), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Chip Power Inductor
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Chip Power Inductor market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Delta Electronics, TDK, Murata, YAGEO, Taiyo Yuden, Sunlord Electronics, Vishay, Sumida, Coilcraft, Shenzhen Microgate Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Chip Power Inductor market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Non-Shielded Chip Power Inductor
Shielded Chip Power Inductor
Market segment by Manufacturing Process
Wound & Coated Power Inductor
Molded (One-piece) Power Inductor
Multilayer Power Inductor
Assembled Power Inductor
Co-fired Power Inductor
Market segment by Sales Channel
Direct Sales
Distribution
Market segment by Application
Smartphones
Consumer Electronics
Computers
Automotive
Industrial Control Equipment
Home Appliances
Security & Surveillance Systems
Servers & Data Centers
Networking & Communications
Others
Major players covered
Delta Electronics
TDK
Murata
YAGEO
Taiyo Yuden
Sunlord Electronics
Vishay
Sumida
Coilcraft
Shenzhen Microgate Technology
Tai-Tech Advanced Electronics
Lianzhen Electronics
Panasonic
MinebeaMitsumi
Kun Shan Mazo Tech
TRIO Technology International
Eaton
3L Electronic
Laird Technologies
Shenzhen Yigan Technology
KYOCERA
ABC Taiwan Electronics
INPAQ
Würth Elektronik
Tongyou Group
Bourns
Samsung Electro-Mechanics
Fenghua Advanced
Sagami Elec
Littelfuse
Zhenhua Fu Electronics
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Chip Power Inductor product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Chip Power Inductor, with price, sales quantity, revenue, and global market share of Chip Power Inductor from 2021 to 2026.
Chapter 3, the Chip Power Inductor competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Chip Power Inductor breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and Chip Power Inductor market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Chip Power Inductor.
Chapter 14 and 15, to describe Chip Power Inductor sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Chip Power Inductor. Industry analysis & Market Report on Chip Power Inductor is a syndicated market report, published as Global Chip Power Inductor Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032. It is complete Research Study and Industry Analysis of Chip Power Inductor market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.