Global and United States Chip Packaging & Testing Market Report & Forecast 2022-2028

Table of Contents

1 Study Coverage

• 1.1 Chip Packaging & Testing Revenue in Chip Packaging & Testing Business (2017-2022) & (US$ Million) Introduction
• 1.2 Global Chip Packaging & Testing Outlook 2017 VS 2022 VS 2028
  • 1.2.1 Global Chip Packaging & Testing Market Size for the Year 2017-2028
  • 1.2.2 Global Chip Packaging & Testing Market Size for the Year 2017-2028
• 1.3 Chip Packaging & Testing Market Size, United States VS Global, 2017 VS 2022 VS 2028
  • 1.3.1 The Market Share of United States Chip Packaging & Testing in Global, 2017 VS 2022 VS 2028
  • 1.3.2 The Growth Rate of Chip Packaging & Testing Market Size, United States VS Global, 2017 VS 2022 VS 2028
• 1.4 Chip Packaging & Testing Market Dynamics
  • 1.4.1 Chip Packaging & Testing Industry Trends
  • 1.4.2 Chip Packaging & Testing Market Drivers
  • 1.4.3 Chip Packaging & Testing Market Challenges
  • 1.4.4 Chip Packaging & Testing Market Restraints
• 1.5 Study Objectives
• 1.6 Years Considered

2 Chip Packaging & Testing by Type

• 2.1 Chip Packaging & Testing Market Segment by Type
  • 2.1.1 Packaging
  • 2.1.2 Testing
• 2.2 Global Chip Packaging & Testing Market Size by Type (2017, 2022 & 2028)
• 2.3 Global Chip Packaging & Testing Market Size by Type (2017-2028)
• 2.4 United States Chip Packaging & Testing Market Size by Type (2017, 2022 & 2028)
• 2.5 United States Chip Packaging & Testing Market Size by Type (2017-2028)

3 Chip Packaging & Testing by Application

• 3.1 Chip Packaging & Testing Market Segment by Application
  • 3.1.1 Telecommunications
  • 3.1.2 Automotive
  • 3.1.3 Aerospace and Defense
  • 3.1.4 Medical Devices
  • 3.1.5 Consumer Electronics
  • 3.1.6 Other
• 3.2 Global Chip Packaging & Testing Market Size by Application (2017, 2022 & 2028)
• 3.3 Global Chip Packaging & Testing Market Size by Application (2017-2028)
• 3.4 United States Chip Packaging & Testing Market Size by Application (2017, 2022 & 2028)
• 3.5 United States Chip Packaging & Testing Market Size by Application (2017-2028)

4 Global Chip Packaging & Testing Competitor Landscape by Company

• 4.1 Global Chip Packaging & Testing Market Size by Company
  • 4.1.1 Top Global Chip Packaging & Testing Companies Ranked by Revenue (2021)
  • 4.1.2 Global Chip Packaging & Testing Revenue by Player (2017-2022)
• 4.2 Global Chip Packaging & Testing Concentration Ratio (CR)
  • 4.2.1 Chip Packaging & Testing Market Concentration Ratio (CR) (2017-2022)
  • 4.2.2 Global Top 5 and Top 10 Largest Companies of Chip Packaging & Testing in 2021
  • 4.2.3 Global Chip Packaging & Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
• 4.3 Global Chip Packaging & Testing Headquarters, Revenue in Chip Packaging & Testing Business (2017-2022) & (US$ Million) Type
  • 4.3.1 Global Chip Packaging & Testing Headquarters and Area Served
  • 4.3.2 Global Chip Packaging & Testing Companies Revenue in Chip Packaging & Testing Business (2017-2022) & (US$ Million) Type
  • 4.3.3 Date of International Companies Enter into Chip Packaging & Testing Market
• 4.4 Companies Mergers & Acquisitions, Expansion Plans
• 4.5 United States Chip Packaging & Testing Market Size by Company
  • 4.5.1 Top Chip Packaging & Testing Players in United States, Ranked by Revenue (2021)
  • 4.5.2 United States Chip Packaging & Testing Revenue by Players (2020, 2021 & 2022)

5 Global Chip Packaging & Testing Market Size by Region

• 5.1 Global Chip Packaging & Testing Market Size by Region: 2017 VS 2022 VS 2028
• 5.2 Global Chip Packaging & Testing Market Size by Region (2017-2028)
  • 5.2.1 Global Chip Packaging & Testing Market Size by Region: 2017-2022
  • 5.2.2 Global Chip Packaging & Testing Market Size by Region (2023-2028)

6 Segment in Region Level & Country Level

• 6.1 North America
  • 6.1.1 North America Chip Packaging & Testing Market Size YoY Growth 2017-2028
  • 6.1.2 North America Chip Packaging & Testing Market Facts & Figures by Country (2017, 2022 & 2028)
  • 6.1.3 United States
  • 6.1.4 Canada
• 6.2 Asia-Pacific
  • 6.2.1 Asia-Pacific Chip Packaging & Testing Market Size YoY Growth 2017-2028
  • 6.2.2 Asia-Pacific Chip Packaging & Testing Market Facts & Figures by Region (2017, 2022 & 2028)
  • 6.2.3 China
  • 6.2.4 Japan
  • 6.2.5 South Korea
  • 6.2.6 India
  • 6.2.7 Australia
  • 6.2.8 China Taiwan
  • 6.2.9 Indonesia
  • 6.2.10 Thailand
  • 6.2.11 Malaysia
• 6.3 Europe
  • 6.3.1 Europe Chip Packaging & Testing Market Size YoY Growth 2017-2028
  • 6.3.2 Europe Chip Packaging & Testing Market Facts & Figures by Country (2017, 2022 & 2028)
  • 6.3.3 Germany
  • 6.3.4 France
  • 6.3.5 U.K.
  • 6.3.6 Italy
  • 6.3.7 Russia
• 6.4 Latin America
  • 6.4.1 Latin America Chip Packaging & Testing Market Size YoY Growth 2017-2028
  • 6.4.2 Latin America Chip Packaging & Testing Market Facts & Figures by Country (2017, 2022 & 2028)
  • 6.4.3 Mexico
  • 6.4.4 Brazil
  • 6.4.5 Argentina
• 6.5 Middle East and Africa
  • 6.5.1 Middle East and Africa Chip Packaging & Testing Market Size YoY Growth 2017-2028
  • 6.5.2 Middle East and Africa Chip Packaging & Testing Market Facts & Figures by Country (2017, 2022 & 2028)
  • 6.5.3 Turkey
  • 6.5.4 Saudi Arabia
  • 6.5.5 UAE

7 Company Profiles

• 7.1 ASE Technology Holding
  • 7.1.1 ASE Technology Holding Company Details
  • 7.1.2 ASE Technology Holding Business Overview
  • 7.1.3 ASE Technology Holding Chip Packaging & Testing Introduction
  • 7.1.4 ASE Technology Holding Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.1.5 ASE Technology Holding Recent Development
• 7.2 Amkor Technology
  • 7.2.1 Amkor Technology Company Details
  • 7.2.2 Amkor Technology Business Overview
  • 7.2.3 Amkor Technology Chip Packaging & Testing Introduction
  • 7.2.4 Amkor Technology Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.2.5 Amkor Technology Recent Development
• 7.3 JCET Group
  • 7.3.1 JCET Group Company Details
  • 7.3.2 JCET Group Business Overview
  • 7.3.3 JCET Group Chip Packaging & Testing Introduction
  • 7.3.4 JCET Group Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.3.5 JCET Group Recent Development
• 7.4 Siliconware Precision Industries
  • 7.4.1 Siliconware Precision Industries Company Details
  • 7.4.2 Siliconware Precision Industries Business Overview
  • 7.4.3 Siliconware Precision Industries Chip Packaging & Testing Introduction
  • 7.4.4 Siliconware Precision Industries Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.4.5 Siliconware Precision Industries Recent Development
• 7.5 Powertech Technology
  • 7.5.1 Powertech Technology Company Details
  • 7.5.2 Powertech Technology Business Overview
  • 7.5.3 Powertech Technology Chip Packaging & Testing Introduction
  • 7.5.4 Powertech Technology Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.5.5 Powertech Technology Recent Development
• 7.6 Tongfu Microelectronics
  • 7.6.1 Tongfu Microelectronics Company Details
  • 7.6.2 Tongfu Microelectronics Business Overview
  • 7.6.3 Tongfu Microelectronics Chip Packaging & Testing Introduction
  • 7.6.4 Tongfu Microelectronics Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.6.5 Tongfu Microelectronics Recent Development
• 7.7 Tianshui Huatian Technology
  • 7.7.1 Tianshui Huatian Technology Company Details
  • 7.7.2 Tianshui Huatian Technology Business Overview
  • 7.7.3 Tianshui Huatian Technology Chip Packaging & Testing Introduction
  • 7.7.4 Tianshui Huatian Technology Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.7.5 Tianshui Huatian Technology Recent Development
• 7.8 King Yuan ELECTRONICS
  • 7.8.1 King Yuan ELECTRONICS Company Details
  • 7.8.2 King Yuan ELECTRONICS Business Overview
  • 7.8.3 King Yuan ELECTRONICS Chip Packaging & Testing Introduction
  • 7.8.4 King Yuan ELECTRONICS Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.8.5 King Yuan ELECTRONICS Recent Development
• 7.9 ChipMOS TECHNOLOGIES
  • 7.9.1 ChipMOS TECHNOLOGIES Company Details
  • 7.9.2 ChipMOS TECHNOLOGIES Business Overview
  • 7.9.3 ChipMOS TECHNOLOGIES Chip Packaging & Testing Introduction
  • 7.9.4 ChipMOS TECHNOLOGIES Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.9.5 ChipMOS TECHNOLOGIES Recent Development
• 7.10 Chipbond Technology
  • 7.10.1 Chipbond Technology Company Details
  • 7.10.2 Chipbond Technology Business Overview
  • 7.10.3 Chipbond Technology Chip Packaging & Testing Introduction
  • 7.10.4 Chipbond Technology Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.10.5 Chipbond Technology Recent Development
• 7.11 Sino Ic Technology
  • 7.11.1 Sino Ic Technology Company Details
  • 7.11.2 Sino Ic Technology Business Overview
  • 7.11.3 Sino Ic Technology Chip Packaging & Testing Introduction
  • 7.11.4 Sino Ic Technology Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.11.5 Sino Ic Technology Recent Development
• 7.12 Leadyo IC Testing
  • 7.12.1 Leadyo IC Testing Company Details
  • 7.12.2 Leadyo IC Testing Business Overview
  • 7.12.3 Leadyo IC Testing Chip Packaging & Testing Introduction
  • 7.12.4 Leadyo IC Testing Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.12.5 Leadyo IC Testing Recent Development
• 7.13 Applied Materials
  • 7.13.1 Applied Materials Company Details
  • 7.13.2 Applied Materials Business Overview
  • 7.13.3 Applied Materials Chip Packaging & Testing Introduction
  • 7.13.4 Applied Materials Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.13.5 Applied Materials Recent Development
• 7.14 ASM Pacific Technology
  • 7.14.1 ASM Pacific Technology Company Details
  • 7.14.2 ASM Pacific Technology Business Overview
  • 7.14.3 ASM Pacific Technology Chip Packaging & Testing Introduction
  • 7.14.4 ASM Pacific Technology Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.14.5 ASM Pacific Technology Recent Development
• 7.15 Kulicke & Soffa Industries
  • 7.15.1 Kulicke & Soffa Industries Company Details
  • 7.15.2 Kulicke & Soffa Industries Business Overview
  • 7.15.3 Kulicke & Soffa Industries Chip Packaging & Testing Introduction
  • 7.15.4 Kulicke & Soffa Industries Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.15.5 Kulicke & Soffa Industries Recent Development
• 7.16 TEL
  • 7.16.1 TEL Company Details
  • 7.16.2 TEL Business Overview
  • 7.16.3 TEL Chip Packaging & Testing Introduction
  • 7.16.4 TEL Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.16.5 TEL Recent Development
• 7.17 Tokyo Seimitsu
  • 7.17.1 Tokyo Seimitsu Company Details
  • 7.17.2 Tokyo Seimitsu Business Overview
  • 7.17.3 Tokyo Seimitsu Chip Packaging & Testing Introduction
  • 7.17.4 Tokyo Seimitsu Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.17.5 Tokyo Seimitsu Recent Development
• 7.18 UTAC
  • 7.18.1 UTAC Company Details
  • 7.18.2 UTAC Business Overview
  • 7.18.3 UTAC Chip Packaging & Testing Introduction
  • 7.18.4 UTAC Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.18.5 UTAC Recent Development
• 7.19 Hana Micron
  • 7.19.1 Hana Micron Company Details
  • 7.19.2 Hana Micron Business Overview
  • 7.19.3 Hana Micron Chip Packaging & Testing Introduction
  • 7.19.4 Hana Micron Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.19.5 Hana Micron Recent Development
• 7.20 OSE
  • 7.20.1 OSE Company Details
  • 7.20.2 OSE Business Overview
  • 7.20.3 OSE Chip Packaging & Testing Introduction
  • 7.20.4 OSE Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.20.5 OSE Recent Development
• 7.21 NEPES
  • 7.21.1 NEPES Company Details
  • 7.21.2 NEPES Business Overview
  • 7.21.3 NEPES Chip Packaging & Testing Introduction
  • 7.21.4 NEPES Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.21.5 NEPES Recent Development
• 7.22 Unisem
  • 7.22.1 Unisem Company Details
  • 7.22.2 Unisem Business Overview
  • 7.22.3 Unisem Chip Packaging & Testing Introduction
  • 7.22.4 Unisem Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.22.5 Unisem Recent Development
• 7.23 Signetics
  • 7.23.1 Signetics Company Details
  • 7.23.2 Signetics Business Overview
  • 7.23.3 Signetics Chip Packaging & Testing Introduction
  • 7.23.4 Signetics Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.23.5 Signetics Recent Development
• 7.24 Carsem
  • 7.24.1 Carsem Company Details
  • 7.24.2 Carsem Business Overview
  • 7.24.3 Carsem Chip Packaging & Testing Introduction
  • 7.24.4 Carsem Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.24.5 Carsem Recent Development
• 7.25 Teradyne
  • 7.25.1 Teradyne Company Details
  • 7.25.2 Teradyne Business Overview
  • 7.25.3 Teradyne Chip Packaging & Testing Introduction
  • 7.25.4 Teradyne Revenue in Chip Packaging & Testing Business (2017-2022)
  • 7.25.5 Teradyne Recent Development

8 Research Findings and Conclusion

9 Appendix

• 9.1 Research Methodology
  • 9.1.1 Methodology/Research Approach
  • 9.1.2 Data Source
• 9.2 Author Details