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Service & Software Global Chip On Board (COB) Packaging Technology Market 2023 by Company, Regions, Type and Application, Forecast to 2029

  • RnM4571236
    • |
  • 08 December, 2023
    • |
  • Global
    • |
  • 103 Pages
    • |
  • GIR (Global Info Research)
    • |
  • Service & Software

According to our (Global Info Research) latest study, the global Chip On Board (COB) Packaging Technology market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period.
Chip On Board (COB) packaging technology is a packaging technique used in electronic devices, primarily for integrated circuits (ICs). In COB packaging, the bare semiconductor chip is directly mounted and electrically connected onto a printed circuit board (PCB) or a substrate.
COB technology eliminates the need for a traditional IC package, such as a plastic or ceramic package, by directly bonding the chip to the PCB. The chip is typically wire bonded to the PCB, and then covered with a protective resin or epoxy coating.
The Global Info Research report includes an overview of the development of the Chip On Board (COB) Packaging Technology industry chain, the market status of Lighting (Traditional COB Packaging Technology, Modular COB Packaging Technology), Electronics (Traditional COB Packaging Technology, Modular COB Packaging Technology), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Chip On Board (COB) Packaging Technology.
Regionally, the report analyzes the Chip On Board (COB) Packaging Technology markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Chip On Board (COB) Packaging Technology market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the Chip On Board (COB) Packaging Technology market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Chip On Board (COB) Packaging Technology industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the revenue generated, and market share of different by Type (e.g., Traditional COB Packaging Technology, Modular COB Packaging Technology).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Chip On Board (COB) Packaging Technology market.
Regional Analysis: The report involves examining the Chip On Board (COB) Packaging Technology market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Chip On Board (COB) Packaging Technology market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to Chip On Board (COB) Packaging Technology:
Company Analysis: Report covers individual Chip On Board (COB) Packaging Technology players, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Chip On Board (COB) Packaging Technology This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Lighting, Electronics).
Technology Analysis: Report covers specific technologies relevant to Chip On Board (COB) Packaging Technology. It assesses the current state, advancements, and potential future developments in Chip On Board (COB) Packaging Technology areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Chip On Board (COB) Packaging Technology market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
Chip On Board (COB) Packaging Technology market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Market segment by Type
Traditional COB Packaging Technology
Modular COB Packaging Technology
Others
Market segment by Application
Lighting
Electronics
Industrial
Displays
Automotive
Medical and Healthcare
Others
Market segment by players, this report covers
Cree, Inc.
Lumileds
Samsung Electronics Co., Ltd.
LG Innotek
OSRAM Opto Semiconductors
Bridgelux, Inc.
Everlight Electronics Co., Ltd.
Nichia Corporation
Epistar Corporation
Seoul Semiconductor Co., Ltd.
Sharp Corporation
Kingbright Electronic Co., Ltd.
Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)
South America (Brazil, Argentina and Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Chip On Board (COB) Packaging Technology product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Chip On Board (COB) Packaging Technology, with revenue, gross margin and global market share of Chip On Board (COB) Packaging Technology from 2018 to 2023.
Chapter 3, the Chip On Board (COB) Packaging Technology competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and application, with consumption value and growth rate by Type, application, from 2018 to 2029.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2018 to 2023.and Chip On Board (COB) Packaging Technology market forecast, by regions, type and application, with consumption value, from 2024 to 2029.
Chapter 11, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Chip On Board (COB) Packaging Technology.
Chapter 13, to describe Chip On Board (COB) Packaging Technology research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope of Chip On Board (COB) Packaging Technology
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Classification of Chip On Board (COB) Packaging Technology by Type
    • 1.3.1 Overview: Global Chip On Board (COB) Packaging Technology Market Size by Type: 2018 Versus 2022 Versus 2029
    • 1.3.2 Global Chip On Board (COB) Packaging Technology Consumption Value Market Share by Type in 2022
    • 1.3.3 Traditional COB Packaging Technology
    • 1.3.4 Modular COB Packaging Technology
    • 1.3.5 Others
  • 1.4 Global Chip On Board (COB) Packaging Technology Market by Application
    • 1.4.1 Overview: Global Chip On Board (COB) Packaging Technology Market Size by Application: 2018 Versus 2022 Versus 2029
    • 1.4.2 Lighting
    • 1.4.3 Electronics
    • 1.4.4 Industrial
    • 1.4.5 Displays
    • 1.4.6 Automotive
    • 1.4.7 Medical and Healthcare
    • 1.4.8 Others
  • 1.5 Global Chip On Board (COB) Packaging Technology Market Size & Forecast
  • 1.6 Global Chip On Board (COB) Packaging Technology Market Size and Forecast by Region
    • 1.6.1 Global Chip On Board (COB) Packaging Technology Market Size by Region: 2018 VS 2022 VS 2029
    • 1.6.2 Global Chip On Board (COB) Packaging Technology Market Size by Region, (2018-2029)
    • 1.6.3 North America Chip On Board (COB) Packaging Technology Market Size and Prospect (2018-2029)
    • 1.6.4 Europe Chip On Board (COB) Packaging Technology Market Size and Prospect (2018-2029)
    • 1.6.5 Asia-Pacific Chip On Board (COB) Packaging Technology Market Size and Prospect (2018-2029)
    • 1.6.6 South America Chip On Board (COB) Packaging Technology Market Size and Prospect (2018-2029)
    • 1.6.7 Middle East and Africa Chip On Board (COB) Packaging Technology Market Size and Prospect (2018-2029)

2 Company Profiles

  • 2.1 Cree, Inc.
    • 2.1.1 Cree, Inc. Details
    • 2.1.2 Cree, Inc. Major Business
    • 2.1.3 Cree, Inc. Chip On Board (COB) Packaging Technology Product and Solutions
    • 2.1.4 Cree, Inc. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
    • 2.1.5 Cree, Inc. Recent Developments and Future Plans
  • 2.2 Lumileds
    • 2.2.1 Lumileds Details
    • 2.2.2 Lumileds Major Business
    • 2.2.3 Lumileds Chip On Board (COB) Packaging Technology Product and Solutions
    • 2.2.4 Lumileds Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
    • 2.2.5 Lumileds Recent Developments and Future Plans
  • 2.3 Samsung Electronics Co., Ltd.
    • 2.3.1 Samsung Electronics Co., Ltd. Details
    • 2.3.2 Samsung Electronics Co., Ltd. Major Business
    • 2.3.3 Samsung Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Product and Solutions
    • 2.3.4 Samsung Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
    • 2.3.5 Samsung Electronics Co., Ltd. Recent Developments and Future Plans
  • 2.4 LG Innotek
    • 2.4.1 LG Innotek Details
    • 2.4.2 LG Innotek Major Business
    • 2.4.3 LG Innotek Chip On Board (COB) Packaging Technology Product and Solutions
    • 2.4.4 LG Innotek Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
    • 2.4.5 LG Innotek Recent Developments and Future Plans
  • 2.5 OSRAM Opto Semiconductors
    • 2.5.1 OSRAM Opto Semiconductors Details
    • 2.5.2 OSRAM Opto Semiconductors Major Business
    • 2.5.3 OSRAM Opto Semiconductors Chip On Board (COB) Packaging Technology Product and Solutions
    • 2.5.4 OSRAM Opto Semiconductors Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
    • 2.5.5 OSRAM Opto Semiconductors Recent Developments and Future Plans
  • 2.6 Bridgelux, Inc.
    • 2.6.1 Bridgelux, Inc. Details
    • 2.6.2 Bridgelux, Inc. Major Business
    • 2.6.3 Bridgelux, Inc. Chip On Board (COB) Packaging Technology Product and Solutions
    • 2.6.4 Bridgelux, Inc. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
    • 2.6.5 Bridgelux, Inc. Recent Developments and Future Plans
  • 2.7 Everlight Electronics Co., Ltd.
    • 2.7.1 Everlight Electronics Co., Ltd. Details
    • 2.7.2 Everlight Electronics Co., Ltd. Major Business
    • 2.7.3 Everlight Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Product and Solutions
    • 2.7.4 Everlight Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
    • 2.7.5 Everlight Electronics Co., Ltd. Recent Developments and Future Plans
  • 2.8 Nichia Corporation
    • 2.8.1 Nichia Corporation Details
    • 2.8.2 Nichia Corporation Major Business
    • 2.8.3 Nichia Corporation Chip On Board (COB) Packaging Technology Product and Solutions
    • 2.8.4 Nichia Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
    • 2.8.5 Nichia Corporation Recent Developments and Future Plans
  • 2.9 Epistar Corporation
    • 2.9.1 Epistar Corporation Details
    • 2.9.2 Epistar Corporation Major Business
    • 2.9.3 Epistar Corporation Chip On Board (COB) Packaging Technology Product and Solutions
    • 2.9.4 Epistar Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
    • 2.9.5 Epistar Corporation Recent Developments and Future Plans
  • 2.10 Seoul Semiconductor Co., Ltd.
    • 2.10.1 Seoul Semiconductor Co., Ltd. Details
    • 2.10.2 Seoul Semiconductor Co., Ltd. Major Business
    • 2.10.3 Seoul Semiconductor Co., Ltd. Chip On Board (COB) Packaging Technology Product and Solutions
    • 2.10.4 Seoul Semiconductor Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
    • 2.10.5 Seoul Semiconductor Co., Ltd. Recent Developments and Future Plans
  • 2.11 Sharp Corporation
    • 2.11.1 Sharp Corporation Details
    • 2.11.2 Sharp Corporation Major Business
    • 2.11.3 Sharp Corporation Chip On Board (COB) Packaging Technology Product and Solutions
    • 2.11.4 Sharp Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
    • 2.11.5 Sharp Corporation Recent Developments and Future Plans
  • 2.12 Kingbright Electronic Co., Ltd.
    • 2.12.1 Kingbright Electronic Co., Ltd. Details
    • 2.12.2 Kingbright Electronic Co., Ltd. Major Business
    • 2.12.3 Kingbright Electronic Co., Ltd. Chip On Board (COB) Packaging Technology Product and Solutions
    • 2.12.4 Kingbright Electronic Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
    • 2.12.5 Kingbright Electronic Co., Ltd. Recent Developments and Future Plans

3 Market Competition, by Players

  • 3.1 Global Chip On Board (COB) Packaging Technology Revenue and Share by Players (2018-2023)
  • 3.2 Market Share Analysis (2022)
    • 3.2.1 Market Share of Chip On Board (COB) Packaging Technology by Company Revenue
    • 3.2.2 Top 3 Chip On Board (COB) Packaging Technology Players Market Share in 2022
    • 3.2.3 Top 6 Chip On Board (COB) Packaging Technology Players Market Share in 2022
  • 3.3 Chip On Board (COB) Packaging Technology Market: Overall Company Footprint Analysis
    • 3.3.1 Chip On Board (COB) Packaging Technology Market: Region Footprint
    • 3.3.2 Chip On Board (COB) Packaging Technology Market: Company Product Type Footprint
    • 3.3.3 Chip On Board (COB) Packaging Technology Market: Company Product Application Footprint
  • 3.4 New Market Entrants and Barriers to Market Entry
  • 3.5 Mergers, Acquisition, Agreements, and Collaborations

4 Market Size Segment by Type

  • 4.1 Global Chip On Board (COB) Packaging Technology Consumption Value and Market Share by Type (2018-2023)
  • 4.2 Global Chip On Board (COB) Packaging Technology Market Forecast by Type (2024-2029)

5 Market Size Segment by Application

  • 5.1 Global Chip On Board (COB) Packaging Technology Consumption Value Market Share by Application (2018-2023)
  • 5.2 Global Chip On Board (COB) Packaging Technology Market Forecast by Application (2024-2029)

6 North America

  • 6.1 North America Chip On Board (COB) Packaging Technology Consumption Value by Type (2018-2029)
  • 6.2 North America Chip On Board (COB) Packaging Technology Consumption Value by Application (2018-2029)
  • 6.3 North America Chip On Board (COB) Packaging Technology Market Size by Country
    • 6.3.1 North America Chip On Board (COB) Packaging Technology Consumption Value by Country (2018-2029)
    • 6.3.2 United States Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 6.3.3 Canada Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 6.3.4 Mexico Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)

7 Europe

  • 7.1 Europe Chip On Board (COB) Packaging Technology Consumption Value by Type (2018-2029)
  • 7.2 Europe Chip On Board (COB) Packaging Technology Consumption Value by Application (2018-2029)
  • 7.3 Europe Chip On Board (COB) Packaging Technology Market Size by Country
    • 7.3.1 Europe Chip On Board (COB) Packaging Technology Consumption Value by Country (2018-2029)
    • 7.3.2 Germany Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 7.3.3 France Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 7.3.4 United Kingdom Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 7.3.5 Russia Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 7.3.6 Italy Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)

8 Asia-Pacific

  • 8.1 Asia-Pacific Chip On Board (COB) Packaging Technology Consumption Value by Type (2018-2029)
  • 8.2 Asia-Pacific Chip On Board (COB) Packaging Technology Consumption Value by Application (2018-2029)
  • 8.3 Asia-Pacific Chip On Board (COB) Packaging Technology Market Size by Region
    • 8.3.1 Asia-Pacific Chip On Board (COB) Packaging Technology Consumption Value by Region (2018-2029)
    • 8.3.2 China Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 8.3.3 Japan Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 8.3.4 South Korea Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 8.3.5 India Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 8.3.6 Southeast Asia Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 8.3.7 Australia Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)

9 South America

  • 9.1 South America Chip On Board (COB) Packaging Technology Consumption Value by Type (2018-2029)
  • 9.2 South America Chip On Board (COB) Packaging Technology Consumption Value by Application (2018-2029)
  • 9.3 South America Chip On Board (COB) Packaging Technology Market Size by Country
    • 9.3.1 South America Chip On Board (COB) Packaging Technology Consumption Value by Country (2018-2029)
    • 9.3.2 Brazil Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 9.3.3 Argentina Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)

10 Middle East & Africa

  • 10.1 Middle East & Africa Chip On Board (COB) Packaging Technology Consumption Value by Type (2018-2029)
  • 10.2 Middle East & Africa Chip On Board (COB) Packaging Technology Consumption Value by Application (2018-2029)
  • 10.3 Middle East & Africa Chip On Board (COB) Packaging Technology Market Size by Country
    • 10.3.1 Middle East & Africa Chip On Board (COB) Packaging Technology Consumption Value by Country (2018-2029)
    • 10.3.2 Turkey Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 10.3.3 Saudi Arabia Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)
    • 10.3.4 UAE Chip On Board (COB) Packaging Technology Market Size and Forecast (2018-2029)

11 Market Dynamics

  • 11.1 Chip On Board (COB) Packaging Technology Market Drivers
  • 11.2 Chip On Board (COB) Packaging Technology Market Restraints
  • 11.3 Chip On Board (COB) Packaging Technology Trends Analysis
  • 11.4 Porters Five Forces Analysis
    • 11.4.1 Threat of New Entrants
    • 11.4.2 Bargaining Power of Suppliers
    • 11.4.3 Bargaining Power of Buyers
    • 11.4.4 Threat of Substitutes
    • 11.4.5 Competitive Rivalry

12 Industry Chain Analysis

  • 12.1 Chip On Board (COB) Packaging Technology Industry Chain
  • 12.2 Chip On Board (COB) Packaging Technology Upstream Analysis
  • 12.3 Chip On Board (COB) Packaging Technology Midstream Analysis
  • 12.4 Chip On Board (COB) Packaging Technology Downstream Analysis

13 Research Findings and Conclusion

    14 Appendix

    • 14.1 Methodology
    • 14.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Chip On Board (COB) Packaging Technology. Industry analysis & Market Report on Chip On Board (COB) Packaging Technology is a syndicated market report, published as Global Chip On Board (COB) Packaging Technology Market 2023 by Company, Regions, Type and Application, Forecast to 2029. It is complete Research Study and Industry Analysis of Chip On Board (COB) Packaging Technology market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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