Report Detail

Electronics & Semiconductor Global 3D IC and 2.5D IC Packaging Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

  • RnM4599804
  • |
  • 02 July, 2024
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  • Global
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  • 87 Pages
  • |
  • GIR (Global Info Research)
  • |
  • Electronics & Semiconductor

According to our (Global Info Research) latest study, the global 3D IC and 2.5D IC Packaging market size was valued at USD 102920 million in 2023 and is forecast to a readjusted size of USD 263040 million by 2030 with a CAGR of 14.3% during review period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
The Global Info Research report includes an overview of the development of the 3D IC and 2.5D IC Packaging industry chain, the market status of Logic (3D Wafer-level Chip-scale Packaging, 3D TSV), Imaging & Optoelectronics (3D Wafer-level Chip-scale Packaging, 3D TSV), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of 3D IC and 2.5D IC Packaging.
Regionally, the report analyzes the 3D IC and 2.5D IC Packaging markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global 3D IC and 2.5D IC Packaging market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the 3D IC and 2.5D IC Packaging market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the 3D IC and 2.5D IC Packaging industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (K Units), revenue generated, and market share of different by Type (e.g., 3D Wafer-level Chip-scale Packaging, 3D TSV).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the 3D IC and 2.5D IC Packaging market.
Regional Analysis: The report involves examining the 3D IC and 2.5D IC Packaging market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the 3D IC and 2.5D IC Packaging market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to 3D IC and 2.5D IC Packaging:
Company Analysis: Report covers individual 3D IC and 2.5D IC Packaging manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards 3D IC and 2.5D IC Packaging This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Logic, Imaging & Optoelectronics).
Technology Analysis: Report covers specific technologies relevant to 3D IC and 2.5D IC Packaging. It assesses the current state, advancements, and potential future developments in 3D IC and 2.5D IC Packaging areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the 3D IC and 2.5D IC Packaging market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
3D IC and 2.5D IC Packaging market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Market segment by Type
3D Wafer-level Chip-scale Packaging
3D TSV
2.5D
Market segment by Application
Logic
Imaging & Optoelectronics
Memory
MEMS/Sensors
LED
Power
Major players covered
Taiwan Semiconductor
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe 3D IC and 2.5D IC Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of 3D IC and 2.5D IC Packaging, with price, sales, revenue and global market share of 3D IC and 2.5D IC Packaging from 2019 to 2024.
Chapter 3, the 3D IC and 2.5D IC Packaging competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the 3D IC and 2.5D IC Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and 3D IC and 2.5D IC Packaging market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of 3D IC and 2.5D IC Packaging.
Chapter 14 and 15, to describe 3D IC and 2.5D IC Packaging sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope of 3D IC and 2.5D IC Packaging
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global 3D IC and 2.5D IC Packaging Consumption Value by Type: 2019 Versus 2023 Versus 2030
    • 1.3.2 3D Wafer-level Chip-scale Packaging
    • 1.3.3 3D TSV
    • 1.3.4 2.5D
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global 3D IC and 2.5D IC Packaging Consumption Value by Application: 2019 Versus 2023 Versus 2030
    • 1.4.2 Logic
    • 1.4.3 Imaging & Optoelectronics
    • 1.4.4 Memory
    • 1.4.5 MEMS/Sensors
    • 1.4.6 LED
    • 1.4.7 Power
  • 1.5 Global 3D IC and 2.5D IC Packaging Market Size & Forecast
    • 1.5.1 Global 3D IC and 2.5D IC Packaging Consumption Value (2019 & 2023 & 2030)
    • 1.5.2 Global 3D IC and 2.5D IC Packaging Sales Quantity (2019-2030)
    • 1.5.3 Global 3D IC and 2.5D IC Packaging Average Price (2019-2030)

2 Manufacturers Profiles

  • 2.1 Taiwan Semiconductor
    • 2.1.1 Taiwan Semiconductor Details
    • 2.1.2 Taiwan Semiconductor Major Business
    • 2.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product and Services
    • 2.1.4 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.1.5 Taiwan Semiconductor Recent Developments/Updates
  • 2.2 Samsung Electronics
    • 2.2.1 Samsung Electronics Details
    • 2.2.2 Samsung Electronics Major Business
    • 2.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Product and Services
    • 2.2.4 Samsung Electronics 3D IC and 2.5D IC Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.2.5 Samsung Electronics Recent Developments/Updates
  • 2.3 Toshiba Corp
    • 2.3.1 Toshiba Corp Details
    • 2.3.2 Toshiba Corp Major Business
    • 2.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Product and Services
    • 2.3.4 Toshiba Corp 3D IC and 2.5D IC Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.3.5 Toshiba Corp Recent Developments/Updates
  • 2.4 Advanced Semiconductor Engineering
    • 2.4.1 Advanced Semiconductor Engineering Details
    • 2.4.2 Advanced Semiconductor Engineering Major Business
    • 2.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product and Services
    • 2.4.4 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.4.5 Advanced Semiconductor Engineering Recent Developments/Updates
  • 2.5 Amkor Technology
    • 2.5.1 Amkor Technology Details
    • 2.5.2 Amkor Technology Major Business
    • 2.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Product and Services
    • 2.5.4 Amkor Technology 3D IC and 2.5D IC Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.5.5 Amkor Technology Recent Developments/Updates

3 Competitive Environment: 3D IC and 2.5D IC Packaging by Manufacturer

  • 3.1 Global 3D IC and 2.5D IC Packaging Sales Quantity by Manufacturer (2019-2024)
  • 3.2 Global 3D IC and 2.5D IC Packaging Revenue by Manufacturer (2019-2024)
  • 3.3 Global 3D IC and 2.5D IC Packaging Average Price by Manufacturer (2019-2024)
  • 3.4 Market Share Analysis (2023)
    • 3.4.1 Producer Shipments of 3D IC and 2.5D IC Packaging by Manufacturer Revenue ($MM) and Market Share (%): 2023
    • 3.4.2 Top 3 3D IC and 2.5D IC Packaging Manufacturer Market Share in 2023
    • 3.4.2 Top 6 3D IC and 2.5D IC Packaging Manufacturer Market Share in 2023
  • 3.5 3D IC and 2.5D IC Packaging Market: Overall Company Footprint Analysis
    • 3.5.1 3D IC and 2.5D IC Packaging Market: Region Footprint
    • 3.5.2 3D IC and 2.5D IC Packaging Market: Company Product Type Footprint
    • 3.5.3 3D IC and 2.5D IC Packaging Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global 3D IC and 2.5D IC Packaging Market Size by Region
    • 4.1.1 Global 3D IC and 2.5D IC Packaging Sales Quantity by Region (2019-2030)
    • 4.1.2 Global 3D IC and 2.5D IC Packaging Consumption Value by Region (2019-2030)
    • 4.1.3 Global 3D IC and 2.5D IC Packaging Average Price by Region (2019-2030)
  • 4.2 North America 3D IC and 2.5D IC Packaging Consumption Value (2019-2030)
  • 4.3 Europe 3D IC and 2.5D IC Packaging Consumption Value (2019-2030)
  • 4.4 Asia-Pacific 3D IC and 2.5D IC Packaging Consumption Value (2019-2030)
  • 4.5 South America 3D IC and 2.5D IC Packaging Consumption Value (2019-2030)
  • 4.6 Middle East and Africa 3D IC and 2.5D IC Packaging Consumption Value (2019-2030)

5 Market Segment by Type

  • 5.1 Global 3D IC and 2.5D IC Packaging Sales Quantity by Type (2019-2030)
  • 5.2 Global 3D IC and 2.5D IC Packaging Consumption Value by Type (2019-2030)
  • 5.3 Global 3D IC and 2.5D IC Packaging Average Price by Type (2019-2030)

6 Market Segment by Application

  • 6.1 Global 3D IC and 2.5D IC Packaging Sales Quantity by Application (2019-2030)
  • 6.2 Global 3D IC and 2.5D IC Packaging Consumption Value by Application (2019-2030)
  • 6.3 Global 3D IC and 2.5D IC Packaging Average Price by Application (2019-2030)

7 North America

  • 7.1 North America 3D IC and 2.5D IC Packaging Sales Quantity by Type (2019-2030)
  • 7.2 North America 3D IC and 2.5D IC Packaging Sales Quantity by Application (2019-2030)
  • 7.3 North America 3D IC and 2.5D IC Packaging Market Size by Country
    • 7.3.1 North America 3D IC and 2.5D IC Packaging Sales Quantity by Country (2019-2030)
    • 7.3.2 North America 3D IC and 2.5D IC Packaging Consumption Value by Country (2019-2030)
    • 7.3.3 United States Market Size and Forecast (2019-2030)
    • 7.3.4 Canada Market Size and Forecast (2019-2030)
    • 7.3.5 Mexico Market Size and Forecast (2019-2030)

8 Europe

  • 8.1 Europe 3D IC and 2.5D IC Packaging Sales Quantity by Type (2019-2030)
  • 8.2 Europe 3D IC and 2.5D IC Packaging Sales Quantity by Application (2019-2030)
  • 8.3 Europe 3D IC and 2.5D IC Packaging Market Size by Country
    • 8.3.1 Europe 3D IC and 2.5D IC Packaging Sales Quantity by Country (2019-2030)
    • 8.3.2 Europe 3D IC and 2.5D IC Packaging Consumption Value by Country (2019-2030)
    • 8.3.3 Germany Market Size and Forecast (2019-2030)
    • 8.3.4 France Market Size and Forecast (2019-2030)
    • 8.3.5 United Kingdom Market Size and Forecast (2019-2030)
    • 8.3.6 Russia Market Size and Forecast (2019-2030)
    • 8.3.7 Italy Market Size and Forecast (2019-2030)

9 Asia-Pacific

  • 9.1 Asia-Pacific 3D IC and 2.5D IC Packaging Sales Quantity by Type (2019-2030)
  • 9.2 Asia-Pacific 3D IC and 2.5D IC Packaging Sales Quantity by Application (2019-2030)
  • 9.3 Asia-Pacific 3D IC and 2.5D IC Packaging Market Size by Region
    • 9.3.1 Asia-Pacific 3D IC and 2.5D IC Packaging Sales Quantity by Region (2019-2030)
    • 9.3.2 Asia-Pacific 3D IC and 2.5D IC Packaging Consumption Value by Region (2019-2030)
    • 9.3.3 China Market Size and Forecast (2019-2030)
    • 9.3.4 Japan Market Size and Forecast (2019-2030)
    • 9.3.5 Korea Market Size and Forecast (2019-2030)
    • 9.3.6 India Market Size and Forecast (2019-2030)
    • 9.3.7 Southeast Asia Market Size and Forecast (2019-2030)
    • 9.3.8 Australia Market Size and Forecast (2019-2030)

10 South America

  • 10.1 South America 3D IC and 2.5D IC Packaging Sales Quantity by Type (2019-2030)
  • 10.2 South America 3D IC and 2.5D IC Packaging Sales Quantity by Application (2019-2030)
  • 10.3 South America 3D IC and 2.5D IC Packaging Market Size by Country
    • 10.3.1 South America 3D IC and 2.5D IC Packaging Sales Quantity by Country (2019-2030)
    • 10.3.2 South America 3D IC and 2.5D IC Packaging Consumption Value by Country (2019-2030)
    • 10.3.3 Brazil Market Size and Forecast (2019-2030)
    • 10.3.4 Argentina Market Size and Forecast (2019-2030)

11 Middle East & Africa

  • 11.1 Middle East & Africa 3D IC and 2.5D IC Packaging Sales Quantity by Type (2019-2030)
  • 11.2 Middle East & Africa 3D IC and 2.5D IC Packaging Sales Quantity by Application (2019-2030)
  • 11.3 Middle East & Africa 3D IC and 2.5D IC Packaging Market Size by Country
    • 11.3.1 Middle East & Africa 3D IC and 2.5D IC Packaging Sales Quantity by Country (2019-2030)
    • 11.3.2 Middle East & Africa 3D IC and 2.5D IC Packaging Consumption Value by Country (2019-2030)
    • 11.3.3 Turkey Market Size and Forecast (2019-2030)
    • 11.3.4 Egypt Market Size and Forecast (2019-2030)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2019-2030)
    • 11.3.6 South Africa Market Size and Forecast (2019-2030)

12 Market Dynamics

  • 12.1 3D IC and 2.5D IC Packaging Market Drivers
  • 12.2 3D IC and 2.5D IC Packaging Market Restraints
  • 12.3 3D IC and 2.5D IC Packaging Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of 3D IC and 2.5D IC Packaging and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of 3D IC and 2.5D IC Packaging
  • 13.3 3D IC and 2.5D IC Packaging Production Process
  • 13.4 3D IC and 2.5D IC Packaging Industrial Chain

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 3D IC and 2.5D IC Packaging Typical Distributors
  • 14.3 3D IC and 2.5D IC Packaging Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on 3D IC and 2.5D IC Packaging. Industry analysis & Market Report on 3D IC and 2.5D IC Packaging is a syndicated market report, published as Global 3D IC and 2.5D IC Packaging Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030. It is complete Research Study and Industry Analysis of 3D IC and 2.5D IC Packaging market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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