Report Detail
Global 3D IC and 2.5D IC Packaging Market Insights, Forecast to 2025
- RnM3302521 |
- 11 April, 2019 |
- Global |
- 111 Pages |
- QYResearch |
- Electronics & Semiconductor
The 3D IC and 2.5D IC Packaging market was valued at Million US$ in 2018 and is projected to reach Million US$ by 2025, at a CAGR of during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D IC and 2.5D IC Packaging.
This report presents the worldwide 3D IC and 2.5D IC Packaging market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The following manufacturers are covered in this report:
Taiwan Semiconductor
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology
3D IC and 2.5D IC Packaging Breakdown Data by Type
3D wafer-level chip-scale packaging
3D TSV
2.5D
3D IC and 2.5D IC Packaging Breakdown Data by Application
Logic
Imaging & optoelectronics
Memory
MEMS/sensors
LED
Power
3D IC and 2.5D IC Packaging Production by Region
United States
Europe
China
Japan
South Korea
Other Regions
3D IC and 2.5D IC Packaging Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa
The study objectives are:
To analyze and research the global 3D IC and 2.5D IC Packaging status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key 3D IC and 2.5D IC Packaging manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
In this study, the years considered to estimate the market size of 3D IC and 2.5D IC Packaging :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025
This report includes the estimation of market size for value (million USD) and volume (Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of 3D IC and 2.5D IC Packaging market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Table of Contents
1 Study Coverage
- 1.1 3D IC and 2.5D IC Packaging Product
- 1.2 Key Market Segments in This Study
- 1.3 Key Manufacturers Covered
- 1.4 Market by Type
- 1.4.1 Global 3D IC and 2.5D IC Packaging Market Size Growth Rate by Type
- 1.4.2 3D wafer-level chip-scale packaging
- 1.4.3 3D TSV
- 1.4.4 2.5D
- 1.5 Market by Application
- 1.5.1 Global 3D IC and 2.5D IC Packaging Market Size Growth Rate by Application
- 1.5.2 Logic
- 1.5.3 Imaging & optoelectronics
- 1.5.4 Memory
- 1.5.5 MEMS/sensors
- 1.5.6 LED
- 1.5.7 Power
- 1.6 Study Objectives
- 1.7 Years Considered
2 Executive Summary
- 2.1 Global 3D IC and 2.5D IC Packaging Market Size
- 2.1.1 Global 3D IC and 2.5D IC Packaging Revenue 2014-2025
- 2.1.2 Global 3D IC and 2.5D IC Packaging Production 2014-2025
- 2.2 3D IC and 2.5D IC Packaging Growth Rate (CAGR) 2019-2025
- 2.3 Analysis of Competitive Landscape
- 2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
- 2.3.2 Key 3D IC and 2.5D IC Packaging Manufacturers
- 2.3.2.1 3D IC and 2.5D IC Packaging Manufacturing Base Distribution, Headquarters
- 2.3.2.2 Manufacturers 3D IC and 2.5D IC Packaging Product Offered
- 2.3.2.3 Date of Manufacturers Enter into 3D IC and 2.5D IC Packaging Market
- 2.4 Key Trends for 3D IC and 2.5D IC Packaging Markets & Products
3 Market Size by Manufacturers
- 3.1 3D IC and 2.5D IC Packaging Production by Manufacturers
- 3.1.1 3D IC and 2.5D IC Packaging Production by Manufacturers
- 3.1.2 3D IC and 2.5D IC Packaging Production Market Share by Manufacturers
- 3.2 3D IC and 2.5D IC Packaging Revenue by Manufacturers
- 3.2.1 3D IC and 2.5D IC Packaging Revenue by Manufacturers (2014-2019)
- 3.2.2 3D IC and 2.5D IC Packaging Revenue Share by Manufacturers (2014-2019)
- 3.3 3D IC and 2.5D IC Packaging Price by Manufacturers
- 3.4 Mergers & Acquisitions, Expansion Plans
4 3D IC and 2.5D IC Packaging Production by Regions
- 4.1 Global 3D IC and 2.5D IC Packaging Production by Regions
- 4.1.1 Global 3D IC and 2.5D IC Packaging Production Market Share by Regions
- 4.1.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Regions
- 4.2 United States
- 4.2.1 United States 3D IC and 2.5D IC Packaging Production
- 4.2.2 United States 3D IC and 2.5D IC Packaging Revenue
- 4.2.3 Key Players in United States
- 4.2.4 United States 3D IC and 2.5D IC Packaging Import & Export
- 4.3 Europe
- 4.3.1 Europe 3D IC and 2.5D IC Packaging Production
- 4.3.2 Europe 3D IC and 2.5D IC Packaging Revenue
- 4.3.3 Key Players in Europe
- 4.3.4 Europe 3D IC and 2.5D IC Packaging Import & Export
- 4.4 China
- 4.4.1 China 3D IC and 2.5D IC Packaging Production
- 4.4.2 China 3D IC and 2.5D IC Packaging Revenue
- 4.4.3 Key Players in China
- 4.4.4 China 3D IC and 2.5D IC Packaging Import & Export
- 4.5 Japan
- 4.5.1 Japan 3D IC and 2.5D IC Packaging Production
- 4.5.2 Japan 3D IC and 2.5D IC Packaging Revenue
- 4.5.3 Key Players in Japan
- 4.5.4 Japan 3D IC and 2.5D IC Packaging Import & Export
- 4.6 South Korea
- 4.6.1 South Korea 3D IC and 2.5D IC Packaging Production
- 4.6.2 South Korea 3D IC and 2.5D IC Packaging Revenue
- 4.6.3 Key Players in South Korea
- 4.6.4 South Korea 3D IC and 2.5D IC Packaging Import & Export
- 4.7 Other Regions
- 4.7.1 Taiwan
- 4.7.2 India
- 4.7.3 Southeast Asia
5 3D IC and 2.5D IC Packaging Consumption by Regions
- 5.1 Global 3D IC and 2.5D IC Packaging Consumption by Regions
- 5.1.1 Global 3D IC and 2.5D IC Packaging Consumption by Regions
- 5.1.2 Global 3D IC and 2.5D IC Packaging Consumption Market Share by Regions
- 5.2 North America
- 5.2.1 North America 3D IC and 2.5D IC Packaging Consumption by Application
- 5.2.2 North America 3D IC and 2.5D IC Packaging Consumption by Countries
- 5.2.3 United States
- 5.2.4 Canada
- 5.2.5 Mexico
- 5.3 Europe
- 5.3.1 Europe 3D IC and 2.5D IC Packaging Consumption by Application
- 5.3.2 Europe 3D IC and 2.5D IC Packaging Consumption by Countries
- 5.3.3 Germany
- 5.3.4 France
- 5.3.5 UK
- 5.3.6 Italy
- 5.3.7 Russia
- 5.4 Asia Pacific
- 5.4.1 Asia Pacific 3D IC and 2.5D IC Packaging Consumption by Application
- 5.4.2 Asia Pacific 3D IC and 2.5D IC Packaging Consumption by Countries
- 5.4.3 China
- 5.4.4 Japan
- 5.4.5 South Korea
- 5.4.6 India
- 5.4.7 Australia
- 5.4.8 Indonesia
- 5.4.9 Thailand
- 5.4.10 Malaysia
- 5.4.11 Philippines
- 5.4.12 Vietnam
- 5.5 Central & South America
- 5.5.1 Central & South America 3D IC and 2.5D IC Packaging Consumption by Application
- 5.5.2 Central & South America 3D IC and 2.5D IC Packaging Consumption by Country
- 5.5.3 Brazil
- 5.6 Middle East and Africa
- 5.6.1 Middle East and Africa 3D IC and 2.5D IC Packaging Consumption by Application
- 5.6.2 Middle East and Africa 3D IC and 2.5D IC Packaging Consumption by Countries
- 5.6.3 GCC Countries
- 5.6.4 Egypt
- 5.6.5 South Africa
6 Market Size by Type
- 6.1 Global 3D IC and 2.5D IC Packaging Production by Type
- 6.2 Global 3D IC and 2.5D IC Packaging Revenue by Type
- 6.3 3D IC and 2.5D IC Packaging Price by Type
7 Market Size by Application
- 7.1 Overview
- 7.2 Global 3D IC and 2.5D IC Packaging Breakdown Dada by Application
- 7.2.1 Global 3D IC and 2.5D IC Packaging Consumption by Application
- 7.2.2 Global 3D IC and 2.5D IC Packaging Consumption Market Share by Application (2014-2019)
8 Manufacturers Profiles
- 8.1 Taiwan Semiconductor
- 8.1.1 Taiwan Semiconductor Company Details
- 8.1.2 Company Overview
- 8.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Production Revenue and Gross Margin (2014-2019)
- 8.1.4 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product Description
- 8.1.5 Taiwan Semiconductor Recent Development
- 8.2 Samsung Electronics
- 8.2.1 Samsung Electronics Company Details
- 8.2.2 Company Overview
- 8.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Production Revenue and Gross Margin (2014-2019)
- 8.2.4 Samsung Electronics 3D IC and 2.5D IC Packaging Product Description
- 8.2.5 Samsung Electronics Recent Development
- 8.3 Toshiba Corp
- 8.3.1 Toshiba Corp Company Details
- 8.3.2 Company Overview
- 8.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Production Revenue and Gross Margin (2014-2019)
- 8.3.4 Toshiba Corp 3D IC and 2.5D IC Packaging Product Description
- 8.3.5 Toshiba Corp Recent Development
- 8.4 Advanced Semiconductor Engineering
- 8.4.1 Advanced Semiconductor Engineering Company Details
- 8.4.2 Company Overview
- 8.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Production Revenue and Gross Margin (2014-2019)
- 8.4.4 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product Description
- 8.4.5 Advanced Semiconductor Engineering Recent Development
- 8.5 Amkor Technology
- 8.5.1 Amkor Technology Company Details
- 8.5.2 Company Overview
- 8.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Production Revenue and Gross Margin (2014-2019)
- 8.5.4 Amkor Technology 3D IC and 2.5D IC Packaging Product Description
- 8.5.5 Amkor Technology Recent Development
9 Production Forecasts
- 9.1 3D IC and 2.5D IC Packaging Production and Revenue Forecast
- 9.1.1 Global 3D IC and 2.5D IC Packaging Production Forecast 2019-2025
- 9.1.2 Global 3D IC and 2.5D IC Packaging Revenue Forecast 2019-2025
- 9.2 3D IC and 2.5D IC Packaging Production and Revenue Forecast by Regions
- 9.2.1 Global 3D IC and 2.5D IC Packaging Revenue Forecast by Regions
- 9.2.2 Global 3D IC and 2.5D IC Packaging Production Forecast by Regions
- 9.3 3D IC and 2.5D IC Packaging Key Producers Forecast
- 9.3.1 United States
- 9.3.2 Europe
- 9.3.3 China
- 9.3.4 Japan
- 9.3.5 South Korea
- 9.4 Forecast by Type
- 9.4.1 Global 3D IC and 2.5D IC Packaging Production Forecast by Type
- 9.4.2 Global 3D IC and 2.5D IC Packaging Revenue Forecast by Type
10 Consumption Forecast
- 10.1 3D IC and 2.5D IC Packaging Consumption Forecast by Application
- 10.2 3D IC and 2.5D IC Packaging Consumption Forecast by Regions
- 10.3 North America Market Consumption Forecast
- 10.3.1 North America 3D IC and 2.5D IC Packaging Consumption Forecast by Regions 2019-2025
- 10.3.2 United States
- 10.3.3 Canada
- 10.3.4 Mexico
- 10.4 Europe Market Consumption Forecast
- 10.4.1 Europe 3D IC and 2.5D IC Packaging Consumption Forecast by Regions 2019-2025
- 10.4.2 Germany
- 10.4.3 France
- 10.4.4 UK
- 10.4.5 Italy
- 10.4.6 Russia
- 10.5 Asia Pacific Market Consumption Forecast
- 10.5.1 Asia Pacific 3D IC and 2.5D IC Packaging Consumption Forecast by Regions 2019-2025
- 10.5.2 China
- 10.5.3 Japan
- 10.5.4 South Korea
- 10.5.5 India
- 10.5.6 Australia
- 10.5.7 Indonesia
- 10.5.8 Thailand
- 10.5.9 Malaysia
- 10.5.10 Philippines
- 10.5.11 Vietnam
- 10.6 Central & South America Market Consumption Forecast
- 10.6.1 Central & South America 3D IC and 2.5D IC Packaging Consumption Forecast by Regions 2019-2025
- 10.6.2 Brazil
- 10.7 Middle East and Africa Market Consumption Forecast
- 10.7.1 Middle East and Africa 3D IC and 2.5D IC Packaging Consumption Forecast by Regions 2019-2025
- 10.7.2 GCC Countries
- 10.7.3 Egypt
- 10.7.4 South Africa
11 Value Chain and Sales Channels Analysis
- 11.1 Value Chain Analysis
- 11.2 Sales Channels Analysis
- 11.2.1 3D IC and 2.5D IC Packaging Sales Channels
- 11.2.2 3D IC and 2.5D IC Packaging Distributors
- 11.3 3D IC and 2.5D IC Packaging Customers
12 Market Opportunities & Challenges, Risks and Influences Factors Analysis
- 12.1 Market Opportunities and Drivers
- 12.2 Market Challenges
- 12.3 Market Risks/Restraints
13 Key Findings in the Global 3D IC and 2.5D IC Packaging Study
14 Appendix
- 14.1 Research Methodology
- 14.1.1 Methodology/Research Approach
- 14.1.1.1 Research Programs/Design
- 14.1.1.2 Market Size Estimation
- 14.1.1.3 Market Breakdown and Data Triangulation
- 14.1.2 Data Source
- 14.1.2.1 Secondary Sources
- 14.1.2.2 Primary Sources
- 14.1.1 Methodology/Research Approach
- 14.2 Author Details
Summary:
Get latest Market Research Reports on 3D IC and 2.5D IC Packaging . Industry analysis & Market Report on 3D IC and 2.5D IC Packaging is a syndicated market report, published as Global 3D IC and 2.5D IC Packaging Market Insights, Forecast to 2025. It is complete Research Study and Industry Analysis of 3D IC and 2.5D IC Packaging market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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