Global 3D IC and 2.5D IC Market Size, Status and Forecast 2020-2026

1 Report Overview

• 1.1 Study Scope
• 1.2 Key Market Segments
• 1.3 Players Covered: Ranking by 3D IC and 2.5D IC Revenue
• 1.4 Market by Type
  • 1.4.1 Global 3D IC and 2.5D IC Market Size Growth Rate by Type: 2020 VS 2026
  • 1.4.2 3D wafer-level chip-scale packaging
  • 1.4.3 3D TSV
  • 1.4.4 2.5D
• 1.5 Market by Application
  • 1.5.1 Global 3D IC and 2.5D IC Market Share by Application: 2020 VS 2026
  • 1.5.2 Consumer electronics
  • 1.5.3 Telecommunication
  • 1.5.4 Industry sector
  • 1.5.5 Automotive
  • 1.5.6 Military and Aerospace
  • 1.5.7 Smart technologies
  • 1.5.8 Medical devices
• 1.6 Study Objectives
• 1.7 Years Considered

2 Global Growth Trends

• 2.1 Global 3D IC and 2.5D IC Market Perspective (2015-2026)
• 2.2 Global 3D IC and 2.5D IC Growth Trends by Regions
  • 2.2.1 3D IC and 2.5D IC Market Size by Regions: 2015 VS 2020 VS 2026
  • 2.2.2 3D IC and 2.5D IC Historic Market Share by Regions (2015-2020)
  • 2.2.3 3D IC and 2.5D IC Forecasted Market Size by Regions (2021-2026)
• 2.3 Industry Trends and Growth Strategy
  • 2.3.1 Market Top Trends
  • 2.3.2 Market Drivers
  • 2.3.3 Market Challenges
  • 2.3.4 Porter’s Five Forces Analysis
  • 2.3.5 3D IC and 2.5D IC Market Growth Strategy
  • 2.3.6 Primary Interviews with Key 3D IC and 2.5D IC Players (Opinion Leaders)

3 Competition Landscape by Key Players

• 3.1 Global Top 3D IC and 2.5D IC Players by Market Size
  • 3.1.1 Global Top 3D IC and 2.5D IC Players by Revenue (2015-2020)
  • 3.1.2 Global 3D IC and 2.5D IC Revenue Market Share by Players (2015-2020)
  • 3.1.3 Global 3D IC and 2.5D IC Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
• 3.2 Global 3D IC and 2.5D IC Market Concentration Ratio
  • 3.2.1 Global 3D IC and 2.5D IC Market Concentration Ratio (CR5 and HHI)
  • 3.2.2 Global Top 10 and Top 5 Companies by 3D IC and 2.5D IC Revenue in 2019
• 3.3 3D IC and 2.5D IC Key Players Head office and Area Served
• 3.4 Key Players 3D IC and 2.5D IC Product Solution and Service
• 3.5 Date of Enter into 3D IC and 2.5D IC Market
• 3.6 Mergers & Acquisitions, Expansion Plans

4 Market Size by Type (2015-2026)

• 4.1 Global 3D IC and 2.5D IC Historic Market Size by Type (2015-2020)
• 4.2 Global 3D IC and 2.5D IC Forecasted Market Size by Type (2021-2026)

5 Market Size by Application (2015-2026)

• 5.1 Global 3D IC and 2.5D IC Market Size by Application (2015-2020)
• 5.2 Global 3D IC and 2.5D IC Forecasted Market Size by Application (2021-2026)

6 North America

• 6.1 North America 3D IC and 2.5D IC Market Size (2015-2020)
• 6.2 3D IC and 2.5D IC Key Players in North America (2019-2020)
• 6.3 North America 3D IC and 2.5D IC Market Size by Type (2015-2020)
• 6.4 North America 3D IC and 2.5D IC Market Size by Application (2015-2020)

7 Europe

• 7.1 Europe 3D IC and 2.5D IC Market Size (2015-2020)
• 7.2 3D IC and 2.5D IC Key Players in Europe (2019-2020)
• 7.3 Europe 3D IC and 2.5D IC Market Size by Type (2015-2020)
• 7.4 Europe 3D IC and 2.5D IC Market Size by Application (2015-2020)

8 China

• 8.1 China 3D IC and 2.5D IC Market Size (2015-2020)
• 8.2 3D IC and 2.5D IC Key Players in China (2019-2020)
• 8.3 China 3D IC and 2.5D IC Market Size by Type (2015-2020)
• 8.4 China 3D IC and 2.5D IC Market Size by Application (2015-2020)

9 Japan

• 9.1 Japan 3D IC and 2.5D IC Market Size (2015-2020)
• 9.2 3D IC and 2.5D IC Key Players in Japan (2019-2020)
• 9.3 Japan 3D IC and 2.5D IC Market Size by Type (2015-2020)
• 9.4 Japan 3D IC and 2.5D IC Market Size by Application (2015-2020)

10 Southeast Asia

• 10.1 Southeast Asia 3D IC and 2.5D IC Market Size (2015-2020)
• 10.2 3D IC and 2.5D IC Key Players in Southeast Asia (2019-2020)
• 10.3 Southeast Asia 3D IC and 2.5D IC Market Size by Type (2015-2020)
• 10.4 Southeast Asia 3D IC and 2.5D IC Market Size by Application (2015-2020)

11 India

• 11.1 India 3D IC and 2.5D IC Market Size (2015-2020)
• 11.2 3D IC and 2.5D IC Key Players in India (2019-2020)
• 11.3 India 3D IC and 2.5D IC Market Size by Type (2015-2020)
• 11.4 India 3D IC and 2.5D IC Market Size by Application (2015-2020)

12 Central & South America

• 12.1 Central & South America 3D IC and 2.5D IC Market Size (2015-2020)
• 12.2 3D IC and 2.5D IC Key Players in Central & South America (2019-2020)
• 12.3 Central & South America 3D IC and 2.5D IC Market Size by Type (2015-2020)
• 12.4 Central & South America 3D IC and 2.5D IC Market Size by Application (2015-2020)

13 Key Players Profiles

• 13.1 TSMC (Taiwan)
  • 13.1.1 TSMC (Taiwan) Company Details
  • 13.1.2 TSMC (Taiwan) Business Overview
  • 13.1.3 TSMC (Taiwan) 3D IC and 2.5D IC Introduction
  • 13.1.4 TSMC (Taiwan) Revenue in 3D IC and 2.5D IC Business (2015-2020))
  • 13.1.5 TSMC (Taiwan) Recent Development
• 13.2 Samsung (South Korea)
  • 13.2.1 Samsung (South Korea) Company Details
  • 13.2.2 Samsung (South Korea) Business Overview
  • 13.2.3 Samsung (South Korea) 3D IC and 2.5D IC Introduction
  • 13.2.4 Samsung (South Korea) Revenue in 3D IC and 2.5D IC Business (2015-2020)
  • 13.2.5 Samsung (South Korea) Recent Development
• 13.3 Toshiba (Japan)
  • 13.3.1 Toshiba (Japan) Company Details
  • 13.3.2 Toshiba (Japan) Business Overview
  • 13.3.3 Toshiba (Japan) 3D IC and 2.5D IC Introduction
  • 13.3.4 Toshiba (Japan) Revenue in 3D IC and 2.5D IC Business (2015-2020)
  • 13.3.5 Toshiba (Japan) Recent Development
• 13.4 ASE Group (Taiwan)
  • 13.4.1 ASE Group (Taiwan) Company Details
  • 13.4.2 ASE Group (Taiwan) Business Overview
  • 13.4.3 ASE Group (Taiwan) 3D IC and 2.5D IC Introduction
  • 13.4.4 ASE Group (Taiwan) Revenue in 3D IC and 2.5D IC Business (2015-2020)
  • 13.4.5 ASE Group (Taiwan) Recent Development
• 13.5 Amkor (U.S.)
  • 13.5.1 Amkor (U.S.) Company Details
  • 13.5.2 Amkor (U.S.) Business Overview
  • 13.5.3 Amkor (U.S.) 3D IC and 2.5D IC Introduction
  • 13.5.4 Amkor (U.S.) Revenue in 3D IC and 2.5D IC Business (2015-2020)
  • 13.5.5 Amkor (U.S.) Recent Development
• 13.6 UMC (Taiwan)
  • 13.6.1 UMC (Taiwan) Company Details
  • 13.6.2 UMC (Taiwan) Business Overview
  • 13.6.3 UMC (Taiwan) 3D IC and 2.5D IC Introduction
  • 13.6.4 UMC (Taiwan) Revenue in 3D IC and 2.5D IC Business (2015-2020)
  • 13.6.5 UMC (Taiwan) Recent Development
• 13.7 Stmicroelectronics (Switzerland)
  • 13.7.1 Stmicroelectronics (Switzerland) Company Details
  • 13.7.2 Stmicroelectronics (Switzerland) Business Overview
  • 13.7.3 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Introduction
  • 13.7.4 Stmicroelectronics (Switzerland) Revenue in 3D IC and 2.5D IC Business (2015-2020)
  • 13.7.5 Stmicroelectronics (Switzerland) Recent Development
• 13.8 Broadcom (U.S.)
  • 13.8.1 Broadcom (U.S.) Company Details
  • 13.8.2 Broadcom (U.S.) Business Overview
  • 13.8.3 Broadcom (U.S.) 3D IC and 2.5D IC Introduction
  • 13.8.4 Broadcom (U.S.) Revenue in 3D IC and 2.5D IC Business (2015-2020)
  • 13.8.5 Broadcom (U.S.) Recent Development
• 13.9 Intel (U.S.)
  • 13.9.1 Intel (U.S.) Company Details
  • 13.9.2 Intel (U.S.) Business Overview
  • 13.9.3 Intel (U.S.) 3D IC and 2.5D IC Introduction
  • 13.9.4 Intel (U.S.) Revenue in 3D IC and 2.5D IC Business (2015-2020)
  • 13.9.5 Intel (U.S.) Recent Development
• 13.10 Jiangsu Changjiang Electronics (China)
  • 13.10.1 Jiangsu Changjiang Electronics (China) Company Details
  • 13.10.2 Jiangsu Changjiang Electronics (China) Business Overview
  • 13.10.3 Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Introduction
  • 13.10.4 Jiangsu Changjiang Electronics (China) Revenue in 3D IC and 2.5D IC Business (2015-2020)
  • 13.10.5 Jiangsu Changjiang Electronics (China) Recent Development

14 Analyst's Viewpoints/Conclusions

15 Appendix

• 15.1 Research Methodology
  • 15.1.1 Methodology/Research Approach
  • 15.1.2 Data Source
• 15.2 Disclaimer