Report Detail
Global 3D IC and 2.5D IC Market Insights, Forecast to 2025
- RnM3358165 |
- 27 April, 2019 |
- Global |
- 119 Pages |
- QYResearch |
- Electronics & Semiconductor
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period
In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.
The 3D IC and 2.5D IC market was valued at xx Million US$ in 2018 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D IC and 2.5D IC.
This report presents the worldwide 3D IC and 2.5D IC market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The following manufacturers are covered in this report:
TSMC (Taiwan)
Samsung (South Korea)
Toshiba (Japan)
ASE Group (Taiwan)
Amkor (U.S.)
UMC (Taiwan)
Stmicroelectronics (Switzerland)
Broadcom (U.S.)
Intel (U.S.)
Jiangsu Changjiang Electronics (China)
3D IC and 2.5D IC Breakdown Data by Type
3D wafer-level chip-scale packaging
3D TSV
2.5D
3D IC and 2.5D IC Breakdown Data by Application
Consumer electronics
Telecommunication
Industry sector
Automotive
Military and Aerospace
Smart technologies
Medical devices
3D IC and 2.5D IC Production by Region
United States
Europe
China
Japan
South Korea
Other Regions
3D IC and 2.5D IC Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa
The study objectives are:
To analyze and research the global 3D IC and 2.5D IC status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key 3D IC and 2.5D IC manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
In this study, the years considered to estimate the market size of 3D IC and 2.5D IC :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025
This report includes the estimation of market size for value (million USD) and volume (K Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of 3D IC and 2.5D IC market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Table of Contents
1 Study Coverage
- 1.1 3D IC and 2.5D IC Product
- 1.2 Key Market Segments in This Study
- 1.3 Key Manufacturers Covered
- 1.4 Market by Type
- 1.4.1 Global 3D IC and 2.5D IC Market Size Growth Rate by Type
- 1.4.2 3D wafer-level chip-scale packaging
- 1.4.3 3D TSV
- 1.4.4 2.5D
- 1.5 Market by Application
- 1.5.1 Global 3D IC and 2.5D IC Market Size Growth Rate by Application
- 1.5.2 Consumer electronics
- 1.5.3 Telecommunication
- 1.5.4 Industry sector
- 1.5.5 Automotive
- 1.5.6 Military and Aerospace
- 1.5.7 Smart technologies
- 1.5.8 Medical devices
- 1.6 Study Objectives
- 1.7 Years Considered
2 Executive Summary
- 2.1 Global 3D IC and 2.5D IC Market Size
- 2.1.1 Global 3D IC and 2.5D IC Revenue 2014-2025
- 2.1.2 Global 3D IC and 2.5D IC Production 2014-2025
- 2.2 3D IC and 2.5D IC Growth Rate (CAGR) 2019-2025
- 2.3 Analysis of Competitive Landscape
- 2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
- 2.3.2 Key 3D IC and 2.5D IC Manufacturers
- 2.3.2.1 3D IC and 2.5D IC Manufacturing Base Distribution, Headquarters
- 2.3.2.2 Manufacturers 3D IC and 2.5D IC Product Offered
- 2.3.2.3 Date of Manufacturers Enter into 3D IC and 2.5D IC Market
- 2.4 Key Trends for 3D IC and 2.5D IC Markets & Products
3 Market Size by Manufacturers
- 3.1 3D IC and 2.5D IC Production by Manufacturers
- 3.1.1 3D IC and 2.5D IC Production by Manufacturers
- 3.1.2 3D IC and 2.5D IC Production Market Share by Manufacturers
- 3.2 3D IC and 2.5D IC Revenue by Manufacturers
- 3.2.1 3D IC and 2.5D IC Revenue by Manufacturers (2014-2019)
- 3.2.2 3D IC and 2.5D IC Revenue Share by Manufacturers (2014-2019)
- 3.3 3D IC and 2.5D IC Price by Manufacturers
- 3.4 Mergers & Acquisitions, Expansion Plans
4 3D IC and 2.5D IC Production by Regions
- 4.1 Global 3D IC and 2.5D IC Production by Regions
- 4.1.1 Global 3D IC and 2.5D IC Production Market Share by Regions
- 4.1.2 Global 3D IC and 2.5D IC Revenue Market Share by Regions
- 4.2 United States
- 4.2.1 United States 3D IC and 2.5D IC Production
- 4.2.2 United States 3D IC and 2.5D IC Revenue
- 4.2.3 Key Players in United States
- 4.2.4 United States 3D IC and 2.5D IC Import & Export
- 4.3 Europe
- 4.3.1 Europe 3D IC and 2.5D IC Production
- 4.3.2 Europe 3D IC and 2.5D IC Revenue
- 4.3.3 Key Players in Europe
- 4.3.4 Europe 3D IC and 2.5D IC Import & Export
- 4.4 China
- 4.4.1 China 3D IC and 2.5D IC Production
- 4.4.2 China 3D IC and 2.5D IC Revenue
- 4.4.3 Key Players in China
- 4.4.4 China 3D IC and 2.5D IC Import & Export
- 4.5 Japan
- 4.5.1 Japan 3D IC and 2.5D IC Production
- 4.5.2 Japan 3D IC and 2.5D IC Revenue
- 4.5.3 Key Players in Japan
- 4.5.4 Japan 3D IC and 2.5D IC Import & Export
- 4.6 South Korea
- 4.6.1 South Korea 3D IC and 2.5D IC Production
- 4.6.2 South Korea 3D IC and 2.5D IC Revenue
- 4.6.3 Key Players in South Korea
- 4.6.4 South Korea 3D IC and 2.5D IC Import & Export
- 4.7 Other Regions
- 4.7.1 Taiwan
- 4.7.2 India
- 4.7.3 Southeast Asia
5 3D IC and 2.5D IC Consumption by Regions
- 5.1 Global 3D IC and 2.5D IC Consumption by Regions
- 5.1.1 Global 3D IC and 2.5D IC Consumption by Regions
- 5.1.2 Global 3D IC and 2.5D IC Consumption Market Share by Regions
- 5.2 North America
- 5.2.1 North America 3D IC and 2.5D IC Consumption by Application
- 5.2.2 North America 3D IC and 2.5D IC Consumption by Countries
- 5.2.3 United States
- 5.2.4 Canada
- 5.2.5 Mexico
- 5.3 Europe
- 5.3.1 Europe 3D IC and 2.5D IC Consumption by Application
- 5.3.2 Europe 3D IC and 2.5D IC Consumption by Countries
- 5.3.3 Germany
- 5.3.4 France
- 5.3.5 UK
- 5.3.6 Italy
- 5.3.7 Russia
- 5.4 Asia Pacific
- 5.4.1 Asia Pacific 3D IC and 2.5D IC Consumption by Application
- 5.4.2 Asia Pacific 3D IC and 2.5D IC Consumption by Countries
- 5.4.3 China
- 5.4.4 Japan
- 5.4.5 South Korea
- 5.4.6 India
- 5.4.7 Australia
- 5.4.8 Indonesia
- 5.4.9 Thailand
- 5.4.10 Malaysia
- 5.4.11 Philippines
- 5.4.12 Vietnam
- 5.5 Central & South America
- 5.5.1 Central & South America 3D IC and 2.5D IC Consumption by Application
- 5.5.2 Central & South America 3D IC and 2.5D IC Consumption by Country
- 5.5.3 Brazil
- 5.6 Middle East and Africa
- 5.6.1 Middle East and Africa 3D IC and 2.5D IC Consumption by Application
- 5.6.2 Middle East and Africa 3D IC and 2.5D IC Consumption by Countries
- 5.6.3 GCC Countries
- 5.6.4 Egypt
- 5.6.5 South Africa
6 Market Size by Type
- 6.1 Global 3D IC and 2.5D IC Production by Type
- 6.2 Global 3D IC and 2.5D IC Revenue by Type
- 6.3 3D IC and 2.5D IC Price by Type
7 Market Size by Application
- 7.1 Overview
- 7.2 Global 3D IC and 2.5D IC Breakdown Dada by Application
- 7.2.1 Global 3D IC and 2.5D IC Consumption by Application
- 7.2.2 Global 3D IC and 2.5D IC Consumption Market Share by Application (2014-2019)
8 Manufacturers Profiles
- 8.1 TSMC (Taiwan)
- 8.1.1 TSMC (Taiwan) Company Details
- 8.1.2 Company Overview
- 8.1.3 TSMC (Taiwan) 3D IC and 2.5D IC Production Revenue and Gross Margin (2014-2019)
- 8.1.4 TSMC (Taiwan) 3D IC and 2.5D IC Product Description
- 8.1.5 TSMC (Taiwan) Recent Development
- 8.2 Samsung (South Korea)
- 8.2.1 Samsung (South Korea) Company Details
- 8.2.2 Company Overview
- 8.2.3 Samsung (South Korea) 3D IC and 2.5D IC Production Revenue and Gross Margin (2014-2019)
- 8.2.4 Samsung (South Korea) 3D IC and 2.5D IC Product Description
- 8.2.5 Samsung (South Korea) Recent Development
- 8.3 Toshiba (Japan)
- 8.3.1 Toshiba (Japan) Company Details
- 8.3.2 Company Overview
- 8.3.3 Toshiba (Japan) 3D IC and 2.5D IC Production Revenue and Gross Margin (2014-2019)
- 8.3.4 Toshiba (Japan) 3D IC and 2.5D IC Product Description
- 8.3.5 Toshiba (Japan) Recent Development
- 8.4 ASE Group (Taiwan)
- 8.4.1 ASE Group (Taiwan) Company Details
- 8.4.2 Company Overview
- 8.4.3 ASE Group (Taiwan) 3D IC and 2.5D IC Production Revenue and Gross Margin (2014-2019)
- 8.4.4 ASE Group (Taiwan) 3D IC and 2.5D IC Product Description
- 8.4.5 ASE Group (Taiwan) Recent Development
- 8.5 Amkor (U.S.)
- 8.5.1 Amkor (U.S.) Company Details
- 8.5.2 Company Overview
- 8.5.3 Amkor (U.S.) 3D IC and 2.5D IC Production Revenue and Gross Margin (2014-2019)
- 8.5.4 Amkor (U.S.) 3D IC and 2.5D IC Product Description
- 8.5.5 Amkor (U.S.) Recent Development
- 8.6 UMC (Taiwan)
- 8.6.1 UMC (Taiwan) Company Details
- 8.6.2 Company Overview
- 8.6.3 UMC (Taiwan) 3D IC and 2.5D IC Production Revenue and Gross Margin (2014-2019)
- 8.6.4 UMC (Taiwan) 3D IC and 2.5D IC Product Description
- 8.6.5 UMC (Taiwan) Recent Development
- 8.7 Stmicroelectronics (Switzerland)
- 8.7.1 Stmicroelectronics (Switzerland) Company Details
- 8.7.2 Company Overview
- 8.7.3 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Production Revenue and Gross Margin (2014-2019)
- 8.7.4 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Product Description
- 8.7.5 Stmicroelectronics (Switzerland) Recent Development
- 8.8 Broadcom (U.S.)
- 8.8.1 Broadcom (U.S.) Company Details
- 8.8.2 Company Overview
- 8.8.3 Broadcom (U.S.) 3D IC and 2.5D IC Production Revenue and Gross Margin (2014-2019)
- 8.8.4 Broadcom (U.S.) 3D IC and 2.5D IC Product Description
- 8.8.5 Broadcom (U.S.) Recent Development
- 8.9 Intel (U.S.)
- 8.9.1 Intel (U.S.) Company Details
- 8.9.2 Company Overview
- 8.9.3 Intel (U.S.) 3D IC and 2.5D IC Production Revenue and Gross Margin (2014-2019)
- 8.9.4 Intel (U.S.) 3D IC and 2.5D IC Product Description
- 8.9.5 Intel (U.S.) Recent Development
- 8.10 Jiangsu Changjiang Electronics (China)
- 8.10.1 Jiangsu Changjiang Electronics (China) Company Details
- 8.10.2 Company Overview
- 8.10.3 Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Production Revenue and Gross Margin (2014-2019)
- 8.10.4 Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Product Description
- 8.10.5 Jiangsu Changjiang Electronics (China) Recent Development
9 Production Forecasts
- 9.1 3D IC and 2.5D IC Production and Revenue Forecast
- 9.1.1 Global 3D IC and 2.5D IC Production Forecast 2019-2025
- 9.1.2 Global 3D IC and 2.5D IC Revenue Forecast 2019-2025
- 9.2 3D IC and 2.5D IC Production and Revenue Forecast by Regions
- 9.2.1 Global 3D IC and 2.5D IC Revenue Forecast by Regions
- 9.2.2 Global 3D IC and 2.5D IC Production Forecast by Regions
- 9.3 3D IC and 2.5D IC Key Producers Forecast
- 9.3.1 United States
- 9.3.2 Europe
- 9.3.3 China
- 9.3.4 Japan
- 9.3.5 South Korea
- 9.4 Forecast by Type
- 9.4.1 Global 3D IC and 2.5D IC Production Forecast by Type
- 9.4.2 Global 3D IC and 2.5D IC Revenue Forecast by Type
10 Consumption Forecast
- 10.1 3D IC and 2.5D IC Consumption Forecast by Application
- 10.2 3D IC and 2.5D IC Consumption Forecast by Regions
- 10.3 North America Market Consumption Forecast
- 10.3.1 North America 3D IC and 2.5D IC Consumption Forecast by Regions 2019-2025
- 10.3.2 United States
- 10.3.3 Canada
- 10.3.4 Mexico
- 10.4 Europe Market Consumption Forecast
- 10.4.1 Europe 3D IC and 2.5D IC Consumption Forecast by Regions 2019-2025
- 10.4.2 Germany
- 10.4.3 France
- 10.4.4 UK
- 10.4.5 Italy
- 10.4.6 Russia
- 10.5 Asia Pacific Market Consumption Forecast
- 10.5.1 Asia Pacific 3D IC and 2.5D IC Consumption Forecast by Regions 2019-2025
- 10.5.2 China
- 10.5.3 Japan
- 10.5.4 South Korea
- 10.5.5 India
- 10.5.6 Australia
- 10.5.7 Indonesia
- 10.5.8 Thailand
- 10.5.9 Malaysia
- 10.5.10 Philippines
- 10.5.11 Vietnam
- 10.6 Central & South America Market Consumption Forecast
- 10.6.1 Central & South America 3D IC and 2.5D IC Consumption Forecast by Regions 2019-2025
- 10.6.2 Brazil
- 10.7 Middle East and Africa Market Consumption Forecast
- 10.7.1 Middle East and Africa 3D IC and 2.5D IC Consumption Forecast by Regions 2019-2025
- 10.7.2 GCC Countries
- 10.7.3 Egypt
- 10.7.4 South Africa
11 Value Chain and Sales Channels Analysis
- 11.1 Value Chain Analysis
- 11.2 Sales Channels Analysis
- 11.2.1 3D IC and 2.5D IC Sales Channels
- 11.2.2 3D IC and 2.5D IC Distributors
- 11.3 3D IC and 2.5D IC Customers
12 Market Opportunities & Challenges, Risks and Influences Factors Analysis
- 12.1 Market Opportunities and Drivers
- 12.2 Market Challenges
- 12.3 Market Risks/Restraints
13 Key Findings in the Global 3D IC and 2.5D IC Study
14 Appendix
- 14.1 Research Methodology
- 14.1.1 Methodology/Research Approach
- 14.1.1.1 Research Programs/Design
- 14.1.1.2 Market Size Estimation
- 14.1.1.3 Market Breakdown and Data Triangulation
- 14.1.2 Data Source
- 14.1.2.1 Secondary Sources
- 14.1.2.2 Primary Sources
- 14.1.1 Methodology/Research Approach
- 14.2 Author Details
Summary:
Get latest Market Research Reports on 3D IC and 2.5D IC. Industry analysis & Market Report on 3D IC and 2.5D IC is a syndicated market report, published as Global 3D IC and 2.5D IC Market Insights, Forecast to 2025. It is complete Research Study and Industry Analysis of 3D IC and 2.5D IC market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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