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Electronics & Semiconductor Global 300 mm Wafer FOUP and FOSB Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

  • RnM4628002
    • |
  • 26 September, 2025
    • |
  • Global
    • |
  • 106 Pages
    • |
  • GIR
    • |
  • Electronics & Semiconductor

According to our (Global Info Research) latest study, the global 300 mm Wafer FOUP and FOSB market size was valued at US$ 767 million in 2024 and is forecast to a readjusted size of USD 1205 million by 2031 with a CAGR of 6.4% during review period.
FOUP and FOSB are terms used in semiconductor manufacturing to refer to containers used for transporting and storing silicon wafers, particularly 300 mm wafers, which are the standard size used in modern semiconductor fabrication processes. FOUP (Front Opening Unified Pod): A FOUP is a specialized container designed to safely transport, store, and protect silicon wafers during various stages of the semiconductor manufacturing process. It has a front-opening mechanism that allows wafers to be loaded and unloaded robotically without exposing the wafers to the surrounding environment. FOUPs are used to maintain the cleanliness and integrity of wafers, protecting them from contamination, particles, and other factors that could negatively affect the quality of the manufactured chips. FOUPs often have sophisticated features, such as interlocks, sensors, and RFID (Radio-Frequency Identification) tags, that help ensure the proper handling and tracking of wafers within the cleanroom environment. These containers are an integral part of automated material handling systems within semiconductor fabrication facilities. FOSB (Front Opening Shipping Box): Similar to FOUPs, FOSBs are also containers designed to transport and store silicon wafers. However, FOSBs are typically used for shipping wafers between different facilities or locations, such as from a wafer manufacturer to a semiconductor fabrication plant. They are designed to provide extra protection during transportation to prevent damage to wafers. FOSBs often have additional packaging materials inside, such as foam or other cushioning materials, to absorb shock and vibrations during transit. They may also include mechanisms to secure the wafers within the container to prevent movement that could lead to breakage. Both FOUPs and FOSBs are critical components of the semiconductor supply chain, ensuring that wafers are handled, transported, and stored in a controlled and protected environment to maintain their quality and usability.
The main participants in the FOUP and FOSB wafer box market include Entegris, Shin-Etsu Polymer, Miraial, Chuang King Enterprise, Gudeng Precision, 3S Korea, and Dainichi Shoji. The top five global companies collectively account for over 95% of the market share. The global major manufacturers are primarily located in the United States, Japan, South Korea, and Taiwan, China.The driving forces in the wafer box industry mainly come from the semiconductor manufacturing and supply chain's demand for efficient, safe, and clean production and transportation environments. With the continuous advancement of semiconductor technology, the increasing wafer size and shrinking process nodes have led to higher requirements for the protection and cleanliness of wafers during manufacturing and transportation. FOUP and FOSB, as key equipment, meet the needs of in-factory automated production lines and inter-factory transportation, respectively, ensuring that wafers are protected from contamination and physical damage during manufacturing and transportation. Additionally, the expansion and complexity of the global semiconductor supply chain have driven the demand for efficient and reliable wafer box solutions to improve production efficiency and yield, while reducing transportation risks.
In terms of future trends, the wafer box industry is moving towards material innovation, intelligence, and environmental sustainability. In terms of materials, high-purity polymers with low outgassing and low moisture absorption will be more widely used to reduce contamination risks. On the intelligence front, the integration of tracking technologies such as RFID will become standard, enabling more efficient wafer management and traceability. Environmental trends will drive the design of wafer boxes towards reusable and sustainable materials to reduce costs and environmental impact. Meanwhile, customization and multifunctional designs will also become important trends to meet different process and transportation needs. Overall, the driving forces and trends in the wafer box industry collectively reflect the semiconductor industry's pursuit of efficient, safe, and sustainable solutions.
This report is a detailed and comprehensive analysis for global 300 mm Wafer FOUP and FOSB market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global 300 mm Wafer FOUP and FOSB market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031
Global 300 mm Wafer FOUP and FOSB market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031
Global 300 mm Wafer FOUP and FOSB market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031
Global 300 mm Wafer FOUP and FOSB market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for 300 mm Wafer FOUP and FOSB
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global 300 mm Wafer FOUP and FOSB market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Entegris, Shin-Etsu Polymer, Miraial, Chuang King Enterprise, Gudeng Precision, 3S Korea, Dainichi Shoji, ePak, E-SUN, Anhui XingYuhong Semiconductor Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
300 mm Wafer FOUP and FOSB market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
FOUP
FOSB
Market segment by Application
Foundry
IDM
Fabless
Major players covered
Entegris
Shin-Etsu Polymer
Miraial
Chuang King Enterprise
Gudeng Precision
3S Korea
Dainichi Shoji
ePak
E-SUN
Anhui XingYuhong Semiconductor Technology
SANG-A FRONTEC
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe 300 mm Wafer FOUP and FOSB product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of 300 mm Wafer FOUP and FOSB, with price, sales quantity, revenue, and global market share of 300 mm Wafer FOUP and FOSB from 2020 to 2025.
Chapter 3, the 300 mm Wafer FOUP and FOSB competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the 300 mm Wafer FOUP and FOSB breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and 300 mm Wafer FOUP and FOSB market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of 300 mm Wafer FOUP and FOSB.
Chapter 14 and 15, to describe 300 mm Wafer FOUP and FOSB sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global 300 mm Wafer FOUP and FOSB Consumption Value by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 FOUP
    • 1.3.3 FOSB
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global 300 mm Wafer FOUP and FOSB Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 Foundry
    • 1.4.3 IDM
    • 1.4.4 Fabless
  • 1.5 Global 300 mm Wafer FOUP and FOSB Market Size & Forecast
    • 1.5.1 Global 300 mm Wafer FOUP and FOSB Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global 300 mm Wafer FOUP and FOSB Sales Quantity (2020-2031)
    • 1.5.3 Global 300 mm Wafer FOUP and FOSB Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 Entegris
    • 2.1.1 Entegris Details
    • 2.1.2 Entegris Major Business
    • 2.1.3 Entegris 300 mm Wafer FOUP and FOSB Product and Services
    • 2.1.4 Entegris 300 mm Wafer FOUP and FOSB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 Entegris Recent Developments/Updates
  • 2.2 Shin-Etsu Polymer
    • 2.2.1 Shin-Etsu Polymer Details
    • 2.2.2 Shin-Etsu Polymer Major Business
    • 2.2.3 Shin-Etsu Polymer 300 mm Wafer FOUP and FOSB Product and Services
    • 2.2.4 Shin-Etsu Polymer 300 mm Wafer FOUP and FOSB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 Shin-Etsu Polymer Recent Developments/Updates
  • 2.3 Miraial
    • 2.3.1 Miraial Details
    • 2.3.2 Miraial Major Business
    • 2.3.3 Miraial 300 mm Wafer FOUP and FOSB Product and Services
    • 2.3.4 Miraial 300 mm Wafer FOUP and FOSB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 Miraial Recent Developments/Updates
  • 2.4 Chuang King Enterprise
    • 2.4.1 Chuang King Enterprise Details
    • 2.4.2 Chuang King Enterprise Major Business
    • 2.4.3 Chuang King Enterprise 300 mm Wafer FOUP and FOSB Product and Services
    • 2.4.4 Chuang King Enterprise 300 mm Wafer FOUP and FOSB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 Chuang King Enterprise Recent Developments/Updates
  • 2.5 Gudeng Precision
    • 2.5.1 Gudeng Precision Details
    • 2.5.2 Gudeng Precision Major Business
    • 2.5.3 Gudeng Precision 300 mm Wafer FOUP and FOSB Product and Services
    • 2.5.4 Gudeng Precision 300 mm Wafer FOUP and FOSB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 Gudeng Precision Recent Developments/Updates
  • 2.6 3S Korea
    • 2.6.1 3S Korea Details
    • 2.6.2 3S Korea Major Business
    • 2.6.3 3S Korea 300 mm Wafer FOUP and FOSB Product and Services
    • 2.6.4 3S Korea 300 mm Wafer FOUP and FOSB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 3S Korea Recent Developments/Updates
  • 2.7 Dainichi Shoji
    • 2.7.1 Dainichi Shoji Details
    • 2.7.2 Dainichi Shoji Major Business
    • 2.7.3 Dainichi Shoji 300 mm Wafer FOUP and FOSB Product and Services
    • 2.7.4 Dainichi Shoji 300 mm Wafer FOUP and FOSB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 Dainichi Shoji Recent Developments/Updates
  • 2.8 ePak
    • 2.8.1 ePak Details
    • 2.8.2 ePak Major Business
    • 2.8.3 ePak 300 mm Wafer FOUP and FOSB Product and Services
    • 2.8.4 ePak 300 mm Wafer FOUP and FOSB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 ePak Recent Developments/Updates
  • 2.9 E-SUN
    • 2.9.1 E-SUN Details
    • 2.9.2 E-SUN Major Business
    • 2.9.3 E-SUN 300 mm Wafer FOUP and FOSB Product and Services
    • 2.9.4 E-SUN 300 mm Wafer FOUP and FOSB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 E-SUN Recent Developments/Updates
  • 2.10 Anhui XingYuhong Semiconductor Technology
    • 2.10.1 Anhui XingYuhong Semiconductor Technology Details
    • 2.10.2 Anhui XingYuhong Semiconductor Technology Major Business
    • 2.10.3 Anhui XingYuhong Semiconductor Technology 300 mm Wafer FOUP and FOSB Product and Services
    • 2.10.4 Anhui XingYuhong Semiconductor Technology 300 mm Wafer FOUP and FOSB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 Anhui XingYuhong Semiconductor Technology Recent Developments/Updates
  • 2.11 SANG-A FRONTEC
    • 2.11.1 SANG-A FRONTEC Details
    • 2.11.2 SANG-A FRONTEC Major Business
    • 2.11.3 SANG-A FRONTEC 300 mm Wafer FOUP and FOSB Product and Services
    • 2.11.4 SANG-A FRONTEC 300 mm Wafer FOUP and FOSB Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.11.5 SANG-A FRONTEC Recent Developments/Updates

3 Competitive Environment: 300 mm Wafer FOUP and FOSB by Manufacturer

  • 3.1 Global 300 mm Wafer FOUP and FOSB Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global 300 mm Wafer FOUP and FOSB Revenue by Manufacturer (2020-2025)
  • 3.3 Global 300 mm Wafer FOUP and FOSB Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of 300 mm Wafer FOUP and FOSB by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 300 mm Wafer FOUP and FOSB Manufacturer Market Share in 2024
    • 3.4.3 Top 6 300 mm Wafer FOUP and FOSB Manufacturer Market Share in 2024
  • 3.5 300 mm Wafer FOUP and FOSB Market: Overall Company Footprint Analysis
    • 3.5.1 300 mm Wafer FOUP and FOSB Market: Region Footprint
    • 3.5.2 300 mm Wafer FOUP and FOSB Market: Company Product Type Footprint
    • 3.5.3 300 mm Wafer FOUP and FOSB Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global 300 mm Wafer FOUP and FOSB Market Size by Region
    • 4.1.1 Global 300 mm Wafer FOUP and FOSB Sales Quantity by Region (2020-2031)
    • 4.1.2 Global 300 mm Wafer FOUP and FOSB Consumption Value by Region (2020-2031)
    • 4.1.3 Global 300 mm Wafer FOUP and FOSB Average Price by Region (2020-2031)
  • 4.2 North America 300 mm Wafer FOUP and FOSB Consumption Value (2020-2031)
  • 4.3 Europe 300 mm Wafer FOUP and FOSB Consumption Value (2020-2031)
  • 4.4 Asia-Pacific 300 mm Wafer FOUP and FOSB Consumption Value (2020-2031)
  • 4.5 South America 300 mm Wafer FOUP and FOSB Consumption Value (2020-2031)
  • 4.6 Middle East & Africa 300 mm Wafer FOUP and FOSB Consumption Value (2020-2031)

5 Market Segment by Type

  • 5.1 Global 300 mm Wafer FOUP and FOSB Sales Quantity by Type (2020-2031)
  • 5.2 Global 300 mm Wafer FOUP and FOSB Consumption Value by Type (2020-2031)
  • 5.3 Global 300 mm Wafer FOUP and FOSB Average Price by Type (2020-2031)

6 Market Segment by Application

  • 6.1 Global 300 mm Wafer FOUP and FOSB Sales Quantity by Application (2020-2031)
  • 6.2 Global 300 mm Wafer FOUP and FOSB Consumption Value by Application (2020-2031)
  • 6.3 Global 300 mm Wafer FOUP and FOSB Average Price by Application (2020-2031)

7 North America

  • 7.1 North America 300 mm Wafer FOUP and FOSB Sales Quantity by Type (2020-2031)
  • 7.2 North America 300 mm Wafer FOUP and FOSB Sales Quantity by Application (2020-2031)
  • 7.3 North America 300 mm Wafer FOUP and FOSB Market Size by Country
    • 7.3.1 North America 300 mm Wafer FOUP and FOSB Sales Quantity by Country (2020-2031)
    • 7.3.2 North America 300 mm Wafer FOUP and FOSB Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe 300 mm Wafer FOUP and FOSB Sales Quantity by Type (2020-2031)
  • 8.2 Europe 300 mm Wafer FOUP and FOSB Sales Quantity by Application (2020-2031)
  • 8.3 Europe 300 mm Wafer FOUP and FOSB Market Size by Country
    • 8.3.1 Europe 300 mm Wafer FOUP and FOSB Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe 300 mm Wafer FOUP and FOSB Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific 300 mm Wafer FOUP and FOSB Sales Quantity by Type (2020-2031)
  • 9.2 Asia-Pacific 300 mm Wafer FOUP and FOSB Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific 300 mm Wafer FOUP and FOSB Market Size by Region
    • 9.3.1 Asia-Pacific 300 mm Wafer FOUP and FOSB Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific 300 mm Wafer FOUP and FOSB Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America 300 mm Wafer FOUP and FOSB Sales Quantity by Type (2020-2031)
  • 10.2 South America 300 mm Wafer FOUP and FOSB Sales Quantity by Application (2020-2031)
  • 10.3 South America 300 mm Wafer FOUP and FOSB Market Size by Country
    • 10.3.1 South America 300 mm Wafer FOUP and FOSB Sales Quantity by Country (2020-2031)
    • 10.3.2 South America 300 mm Wafer FOUP and FOSB Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa 300 mm Wafer FOUP and FOSB Sales Quantity by Type (2020-2031)
  • 11.2 Middle East & Africa 300 mm Wafer FOUP and FOSB Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa 300 mm Wafer FOUP and FOSB Market Size by Country
    • 11.3.1 Middle East & Africa 300 mm Wafer FOUP and FOSB Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa 300 mm Wafer FOUP and FOSB Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 300 mm Wafer FOUP and FOSB Market Drivers
  • 12.2 300 mm Wafer FOUP and FOSB Market Restraints
  • 12.3 300 mm Wafer FOUP and FOSB Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of 300 mm Wafer FOUP and FOSB and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of 300 mm Wafer FOUP and FOSB
  • 13.3 300 mm Wafer FOUP and FOSB Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 300 mm Wafer FOUP and FOSB Typical Distributors
  • 14.3 300 mm Wafer FOUP and FOSB Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on 300 mm Wafer FOUP and FOSB. Industry analysis & Market Report on 300 mm Wafer FOUP and FOSB is a syndicated market report, published as Global 300 mm Wafer FOUP and FOSB Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of 300 mm Wafer FOUP and FOSB market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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