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Electronics & Semiconductor Global 2.5D and 3D IC Packaging Market 2023 by Company, Regions, Type and Application, Forecast to 2029

  • RnM4530498
    • |
  • 26 April, 2023
    • |
  • Global
    • |
  • 111 Pages
    • |
  • GIR (Global Info Research)
    • |
  • Electronics & Semiconductor

According to our (Global Info Research) latest study, the global 2.5D and 3D IC Packaging market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for shortest interconnect and smallest package footprint.
This report is a detailed and comprehensive analysis for global 2.5D and 3D IC Packaging market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global 2.5D and 3D IC Packaging market size and forecasts, in consumption value ($ Million), 2018-2029
Global 2.5D and 3D IC Packaging market size and forecasts by region and country, in consumption value ($ Million), 2018-2029
Global 2.5D and 3D IC Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), 2018-2029
Global 2.5D and 3D IC Packaging market shares of main players, in revenue ($ Million), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for 2.5D and 3D IC Packaging
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global 2.5D and 3D IC Packaging market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE Technology, Samsung Electronics, Toshiba, STMicroelectronics and Xilinx, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market segmentation
2.5D and 3D IC Packaging market is split by Type and by Application. For the period 2018-2029, the growth among segments provide accurate calculations and forecasts for consumption value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
2.5D
3D TSV
3D Wafer-level Chip-scale Packaging
Market segment by Application
Consumer Electronics
Medical Devices
Communications and Telecom
Automotive
Other
Market segment by players, this report covers
ASE Technology
Samsung Electronics
Toshiba
STMicroelectronics
Xilinx
Intel
Micron Technology
TSMC
SK Hynix
Amkor Technology
GlobalFoundries
SanDisk (Western Digital)
Synopsys
Invensas
Siliconware Precision Industries
Jiangsu Changjiang Electronics
Powertech Technology
Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)
South America (Brazil, Argentina and Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe 2.5D and 3D IC Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of 2.5D and 3D IC Packaging, with revenue, gross margin and global market share of 2.5D and 3D IC Packaging from 2018 to 2023.
Chapter 3, the 2.5D and 3D IC Packaging competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and application, with consumption value and growth rate by Type, application, from 2018 to 2029.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2018 to 2023.and 2.5D and 3D IC Packaging market forecast, by regions, type and application, with consumption value, from 2024 to 2029.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War
Chapter 12, the key raw materials and key suppliers, and industry chain of 2.5D and 3D IC Packaging.
Chapter 13, to describe 2.5D and 3D IC Packaging research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope of 2.5D and 3D IC Packaging
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Classification of 2.5D and 3D IC Packaging by Type
    • 1.3.1 Overview: Global 2.5D and 3D IC Packaging Market Size by Type: 2018 Versus 2022 Versus 2029
    • 1.3.2 Global 2.5D and 3D IC Packaging Consumption Value Market Share by Type in 2022
    • 1.3.3 2.5D
    • 1.3.4 3D TSV
    • 1.3.5 3D Wafer-level Chip-scale Packaging
  • 1.4 Global 2.5D and 3D IC Packaging Market by Application
    • 1.4.1 Overview: Global 2.5D and 3D IC Packaging Market Size by Application: 2018 Versus 2022 Versus 2029
    • 1.4.2 Consumer Electronics
    • 1.4.3 Medical Devices
    • 1.4.4 Communications and Telecom
    • 1.4.5 Automotive
    • 1.4.6 Other
  • 1.5 Global 2.5D and 3D IC Packaging Market Size & Forecast
  • 1.6 Global 2.5D and 3D IC Packaging Market Size and Forecast by Region
    • 1.6.1 Global 2.5D and 3D IC Packaging Market Size by Region: 2018 VS 2022 VS 2029
    • 1.6.2 Global 2.5D and 3D IC Packaging Market Size by Region, (2018-2029)
    • 1.6.3 North America 2.5D and 3D IC Packaging Market Size and Prospect (2018-2029)
    • 1.6.4 Europe 2.5D and 3D IC Packaging Market Size and Prospect (2018-2029)
    • 1.6.5 Asia-Pacific 2.5D and 3D IC Packaging Market Size and Prospect (2018-2029)
    • 1.6.6 South America 2.5D and 3D IC Packaging Market Size and Prospect (2018-2029)
    • 1.6.7 Middle East and Africa 2.5D and 3D IC Packaging Market Size and Prospect (2018-2029)

2 Company Profiles

  • 2.1 ASE Technology
    • 2.1.1 ASE Technology Details
    • 2.1.2 ASE Technology Major Business
    • 2.1.3 ASE Technology 2.5D and 3D IC Packaging Product and Solutions
    • 2.1.4 ASE Technology 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.1.5 ASE Technology Recent Developments and Future Plans
  • 2.2 Samsung Electronics
    • 2.2.1 Samsung Electronics Details
    • 2.2.2 Samsung Electronics Major Business
    • 2.2.3 Samsung Electronics 2.5D and 3D IC Packaging Product and Solutions
    • 2.2.4 Samsung Electronics 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.2.5 Samsung Electronics Recent Developments and Future Plans
  • 2.3 Toshiba
    • 2.3.1 Toshiba Details
    • 2.3.2 Toshiba Major Business
    • 2.3.3 Toshiba 2.5D and 3D IC Packaging Product and Solutions
    • 2.3.4 Toshiba 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.3.5 Toshiba Recent Developments and Future Plans
  • 2.4 STMicroelectronics
    • 2.4.1 STMicroelectronics Details
    • 2.4.2 STMicroelectronics Major Business
    • 2.4.3 STMicroelectronics 2.5D and 3D IC Packaging Product and Solutions
    • 2.4.4 STMicroelectronics 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.4.5 STMicroelectronics Recent Developments and Future Plans
  • 2.5 Xilinx
    • 2.5.1 Xilinx Details
    • 2.5.2 Xilinx Major Business
    • 2.5.3 Xilinx 2.5D and 3D IC Packaging Product and Solutions
    • 2.5.4 Xilinx 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.5.5 Xilinx Recent Developments and Future Plans
  • 2.6 Intel
    • 2.6.1 Intel Details
    • 2.6.2 Intel Major Business
    • 2.6.3 Intel 2.5D and 3D IC Packaging Product and Solutions
    • 2.6.4 Intel 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.6.5 Intel Recent Developments and Future Plans
  • 2.7 Micron Technology
    • 2.7.1 Micron Technology Details
    • 2.7.2 Micron Technology Major Business
    • 2.7.3 Micron Technology 2.5D and 3D IC Packaging Product and Solutions
    • 2.7.4 Micron Technology 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.7.5 Micron Technology Recent Developments and Future Plans
  • 2.8 TSMC
    • 2.8.1 TSMC Details
    • 2.8.2 TSMC Major Business
    • 2.8.3 TSMC 2.5D and 3D IC Packaging Product and Solutions
    • 2.8.4 TSMC 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.8.5 TSMC Recent Developments and Future Plans
  • 2.9 SK Hynix
    • 2.9.1 SK Hynix Details
    • 2.9.2 SK Hynix Major Business
    • 2.9.3 SK Hynix 2.5D and 3D IC Packaging Product and Solutions
    • 2.9.4 SK Hynix 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.9.5 SK Hynix Recent Developments and Future Plans
  • 2.10 Amkor Technology
    • 2.10.1 Amkor Technology Details
    • 2.10.2 Amkor Technology Major Business
    • 2.10.3 Amkor Technology 2.5D and 3D IC Packaging Product and Solutions
    • 2.10.4 Amkor Technology 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.10.5 Amkor Technology Recent Developments and Future Plans
  • 2.11 GlobalFoundries
    • 2.11.1 GlobalFoundries Details
    • 2.11.2 GlobalFoundries Major Business
    • 2.11.3 GlobalFoundries 2.5D and 3D IC Packaging Product and Solutions
    • 2.11.4 GlobalFoundries 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.11.5 GlobalFoundries Recent Developments and Future Plans
  • 2.12 SanDisk (Western Digital)
    • 2.12.1 SanDisk (Western Digital) Details
    • 2.12.2 SanDisk (Western Digital) Major Business
    • 2.12.3 SanDisk (Western Digital) 2.5D and 3D IC Packaging Product and Solutions
    • 2.12.4 SanDisk (Western Digital) 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.12.5 SanDisk (Western Digital) Recent Developments and Future Plans
  • 2.13 Synopsys
    • 2.13.1 Synopsys Details
    • 2.13.2 Synopsys Major Business
    • 2.13.3 Synopsys 2.5D and 3D IC Packaging Product and Solutions
    • 2.13.4 Synopsys 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.13.5 Synopsys Recent Developments and Future Plans
  • 2.14 Invensas
    • 2.14.1 Invensas Details
    • 2.14.2 Invensas Major Business
    • 2.14.3 Invensas 2.5D and 3D IC Packaging Product and Solutions
    • 2.14.4 Invensas 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.14.5 Invensas Recent Developments and Future Plans
  • 2.15 Siliconware Precision Industries
    • 2.15.1 Siliconware Precision Industries Details
    • 2.15.2 Siliconware Precision Industries Major Business
    • 2.15.3 Siliconware Precision Industries 2.5D and 3D IC Packaging Product and Solutions
    • 2.15.4 Siliconware Precision Industries 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.15.5 Siliconware Precision Industries Recent Developments and Future Plans
  • 2.16 Jiangsu Changjiang Electronics
    • 2.16.1 Jiangsu Changjiang Electronics Details
    • 2.16.2 Jiangsu Changjiang Electronics Major Business
    • 2.16.3 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Product and Solutions
    • 2.16.4 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.16.5 Jiangsu Changjiang Electronics Recent Developments and Future Plans
  • 2.17 Powertech Technology
    • 2.17.1 Powertech Technology Details
    • 2.17.2 Powertech Technology Major Business
    • 2.17.3 Powertech Technology 2.5D and 3D IC Packaging Product and Solutions
    • 2.17.4 Powertech Technology 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
    • 2.17.5 Powertech Technology Recent Developments and Future Plans

3 Market Competition, by Players

  • 3.1 Global 2.5D and 3D IC Packaging Revenue and Share by Players (2018-2023)
  • 3.2 Market Share Analysis (2022)
    • 3.2.1 Market Share of 2.5D and 3D IC Packaging by Company Revenue
    • 3.2.2 Top 3 2.5D and 3D IC Packaging Players Market Share in 2022
    • 3.2.3 Top 6 2.5D and 3D IC Packaging Players Market Share in 2022
  • 3.3 2.5D and 3D IC Packaging Market: Overall Company Footprint Analysis
    • 3.3.1 2.5D and 3D IC Packaging Market: Region Footprint
    • 3.3.2 2.5D and 3D IC Packaging Market: Company Product Type Footprint
    • 3.3.3 2.5D and 3D IC Packaging Market: Company Product Application Footprint
  • 3.4 New Market Entrants and Barriers to Market Entry
  • 3.5 Mergers, Acquisition, Agreements, and Collaborations

4 Market Size Segment by Type

  • 4.1 Global 2.5D and 3D IC Packaging Consumption Value and Market Share by Type (2018-2023)
  • 4.2 Global 2.5D and 3D IC Packaging Market Forecast by Type (2024-2029)

5 Market Size Segment by Application

  • 5.1 Global 2.5D and 3D IC Packaging Consumption Value Market Share by Application (2018-2023)
  • 5.2 Global 2.5D and 3D IC Packaging Market Forecast by Application (2024-2029)

6 North America

  • 6.1 North America 2.5D and 3D IC Packaging Consumption Value by Type (2018-2029)
  • 6.2 North America 2.5D and 3D IC Packaging Consumption Value by Application (2018-2029)
  • 6.3 North America 2.5D and 3D IC Packaging Market Size by Country
    • 6.3.1 North America 2.5D and 3D IC Packaging Consumption Value by Country (2018-2029)
    • 6.3.2 United States 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 6.3.3 Canada 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 6.3.4 Mexico 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)

7 Europe

  • 7.1 Europe 2.5D and 3D IC Packaging Consumption Value by Type (2018-2029)
  • 7.2 Europe 2.5D and 3D IC Packaging Consumption Value by Application (2018-2029)
  • 7.3 Europe 2.5D and 3D IC Packaging Market Size by Country
    • 7.3.1 Europe 2.5D and 3D IC Packaging Consumption Value by Country (2018-2029)
    • 7.3.2 Germany 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 7.3.3 France 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 7.3.4 United Kingdom 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 7.3.5 Russia 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 7.3.6 Italy 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)

8 Asia-Pacific

  • 8.1 Asia-Pacific 2.5D and 3D IC Packaging Consumption Value by Type (2018-2029)
  • 8.2 Asia-Pacific 2.5D and 3D IC Packaging Consumption Value by Application (2018-2029)
  • 8.3 Asia-Pacific 2.5D and 3D IC Packaging Market Size by Region
    • 8.3.1 Asia-Pacific 2.5D and 3D IC Packaging Consumption Value by Region (2018-2029)
    • 8.3.2 China 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 8.3.3 Japan 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 8.3.4 South Korea 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 8.3.5 India 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 8.3.6 Southeast Asia 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 8.3.7 Australia 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)

9 South America

  • 9.1 South America 2.5D and 3D IC Packaging Consumption Value by Type (2018-2029)
  • 9.2 South America 2.5D and 3D IC Packaging Consumption Value by Application (2018-2029)
  • 9.3 South America 2.5D and 3D IC Packaging Market Size by Country
    • 9.3.1 South America 2.5D and 3D IC Packaging Consumption Value by Country (2018-2029)
    • 9.3.2 Brazil 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 9.3.3 Argentina 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)

10 Middle East & Africa

  • 10.1 Middle East & Africa 2.5D and 3D IC Packaging Consumption Value by Type (2018-2029)
  • 10.2 Middle East & Africa 2.5D and 3D IC Packaging Consumption Value by Application (2018-2029)
  • 10.3 Middle East & Africa 2.5D and 3D IC Packaging Market Size by Country
    • 10.3.1 Middle East & Africa 2.5D and 3D IC Packaging Consumption Value by Country (2018-2029)
    • 10.3.2 Turkey 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 10.3.3 Saudi Arabia 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
    • 10.3.4 UAE 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)

11 Market Dynamics

  • 11.1 2.5D and 3D IC Packaging Market Drivers
  • 11.2 2.5D and 3D IC Packaging Market Restraints
  • 11.3 2.5D and 3D IC Packaging Trends Analysis
  • 11.4 Porters Five Forces Analysis
    • 11.4.1 Threat of New Entrants
    • 11.4.2 Bargaining Power of Suppliers
    • 11.4.3 Bargaining Power of Buyers
    • 11.4.4 Threat of Substitutes
    • 11.4.5 Competitive Rivalry
  • 11.5 Influence of COVID-19 and Russia-Ukraine War
    • 11.5.1 Influence of COVID-19
    • 11.5.2 Influence of Russia-Ukraine War

12 Industry Chain Analysis

  • 12.1 2.5D and 3D IC Packaging Industry Chain
  • 12.2 2.5D and 3D IC Packaging Upstream Analysis
  • 12.3 2.5D and 3D IC Packaging Midstream Analysis
  • 12.4 2.5D and 3D IC Packaging Downstream Analysis

13 Research Findings and Conclusion

    14 Appendix

    • 14.1 Methodology
    • 14.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on 2.5D and 3D IC Packaging. Industry analysis & Market Report on 2.5D and 3D IC Packaging is a syndicated market report, published as Global 2.5D and 3D IC Packaging Market 2023 by Company, Regions, Type and Application, Forecast to 2029. It is complete Research Study and Industry Analysis of 2.5D and 3D IC Packaging market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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