Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding.
Wedge bonding works by using a wedge bonder. A wire is passed through the wedge tool over the microchip. The capillary then settles over the area that need
Market research analysts at QYResearch predict that the global Wire Wedge Bonder Equipment market will grow steadily during the next five years and post a CAGR of nearly 1.04% by 2022. This market research analysis identifies the increasing design complexity of semiconductor devices as one of the primary growth factors for the global Wire Wedge Bonder Equipment market. The rise in design complexities such as slimmer version, use of metallic case, and larger displays in smartphones and other electronics has reduced the space for semiconductor components. This in turn, increases the complexity of the design and the development of semiconductor devices and increases the need for new processing tools and equipment to manufacture them. Moreover, the constant introduction of new electronics such as smartphones with improved features also compels vendors to modify the manufacturing process and design new products compatible with the existing and new standards, which will subsequently propel the market's growth.
The Wire Wedge Bonder Equipment market is a part of the overall semiconductor packaging and assembly equipment market. The shift in semiconductor packaging towards 3D IC technology will intensify the competition between the IDMs and OSATs. The packaging market has a huge potential and provides several growth opportunities to IDMs and OSATs. IDMs are working on expanding into the assembly business, while the OSATs are trying to make use of this opportunity to raise the profit margins. In 2016, IDMs held the maximum market shares during 2016 and this segment is projected to continue its market dominance during the forecasted period as well. The need to increase production capacity and the need to adhere to the constant technological innovation in packaging techniques will be the major factors fueling market growth. Furthermore, the rising R&D activities and the adoption of innovative technologies by the semiconductor packaging industry, will also drive the growth of the Wire Wedge Bonder Equipment market in this end-user segment.
Wire Wedge Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Europe, US and Asia. Among them, Singapore output volume accounted for more than 53.24% of the total output of global Wire Wedge Bonder Equipment in 2016. Kulicke & Soffa is the world leading manufacturer in global Wire Wedge Bonder Equipment market with the market share of 54.19%, in terms of revenue, followed by ASM Pacific Technology (ASMPT), Hesse, Cho-Onpa and F&K Delvotec Bondtechnik. It shows that the Wire Wedge Bonder Equipment market performance is positive, despite the weak economic environment.
According to this study, over the next five years the Wire Wedge Bonder Equipment market will register a 1.1% CAGR in terms of revenue, the global market size will reach US$ 100 million by 2024, from US$ 92 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Wire Wedge Bonder Equipment business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of Wire Wedge Bonder Equipment market by product type, application, key manufacturers and key regions and countries.
This study considers the Wire Wedge Bonder Equipment value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Middle East & Africa
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
Kulicke & Soffa
ASM Pacific Technology (ASMPT)
F&K Delvotec Bondtechnik
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
To study and analyze the global Wire Wedge Bonder Equipment consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of Wire Wedge Bonder Equipment market by identifying its various subsegments.
Focuses on the key global Wire Wedge Bonder Equipment manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Wire Wedge Bonder Equipment with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Wire Wedge Bonder Equipment submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.