Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has an overall thickness of over 1.7mm.
In 2018, the global Plastic Ball Grid Array (PBGA) market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2019-2025.
This report focuses on the global Plastic Ball Grid Array (PBGA) status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Plastic Ball Grid Array (PBGA) development in United States, Europe and China.
The key players covered in this study
Advanced Interconnections Corp
Market segment by Type, the product can be split into
Market segment by Application, split into
Market segment by Regions/Countries, this report covers
Central & South America
The study objectives of this report are:
To analyze global Plastic Ball Grid Array (PBGA) status, future forecast, growth opportunity, key market and key players.
To present the Plastic Ball Grid Array (PBGA) development in United States, Europe and China.
To strategically profile the key players and comprehensively analyze their development plan and strategies.
To define, describe and forecast the market by product type, market and key regions.
In this study, the years considered to estimate the market size of Plastic Ball Grid Array (PBGA) are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.