IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%
Scope of the Report:
Japan, Korea and Taiwan are dominating the global IC-Substrate market and have strong voices in high end market. China is also an important producer, but most of the products are low end products. Currently there are four Taiwanese producers have manufacturing bases in China mainland, mainly located in Suzhou, Kunshan and Shanghai; and there also four local producers located in Shenzhen, Chongqin, Zhuhai and Wuxi.
Currently, Ibiden, Shinko, Kyocera, Eastern, TTM Technologies, Unimicron, Kinsus, Nanya, ASE, Semco, LG Innotek, Simmtech, Daeduck, KCC (Korea Circuit Company), Zhen Ding Technology, AT&S, Shennan Circuit, ACCESS and Shenzhen Fastprint Circuit Tech are the well-known players in the global IC-Substrate market, and the top 10 players took up about 80% of the global market in 2018. Ibiden, Shinko, Kyocera are the Japanese well-known producers of IC-Substrate at present.
The worldwide market for IC Substrate is expected to grow at a CAGR of roughly 1.6% over the next five years, will reach 8200 million US$ in 2024, from 7590 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the IC Substrate in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
Shinko Electric Industries
Nan Ya PCB
Zhen Ding Technology
Shenzhen Fastprint Circuit Tech
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
WB BGA Substrate
WB CSP Substrate
FC BGA Substrate
FC CSP Substrate
Market Segment by Applications, can be divided into
PC (Tablet, Laptop)
Wearable Devices (smart watch)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe IC Substrate product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of IC Substrate, with price, sales, revenue and global market share of IC Substrate in 2017 and 2018.
Chapter 3, the IC Substrate competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the IC Substrate breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, IC Substrate market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe IC Substrate sales channel, distributors, customers, research findings and conclusion, appendix and data source.