Report Detail

Electronics & Semiconductor Global IC Package Substrates Market Research Report 2020

  • RnM4275310
  • |
  • 31 December, 2020
  • |
  • Global
  • |
  • 123 Pages
  • |
  • QYResearch
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  • Electronics & Semiconductor

1 IC Package Substrates Market Overview

  • 1.1 Product Overview and Scope of IC Package Substrates
  • 1.2 IC Package Substrates Segment by Type
    • 1.2.1 Global IC Package Substrates Production Growth Rate Comparison by Type 2020 VS 2026
    • 1.2.2 WB BGA Substrate
    • 1.2.3 WB CSP Substrate
    • 1.2.4 FC BGA Substrate
    • 1.2.5 FC CSP Substrate
    • 1.2.6 Other Types
  • 1.3 IC Package Substrates Segment by Application
    • 1.3.1 IC Package Substrates Consumption Comparison by Application: 2020 VS 2026
    • 1.3.2 PC (Tablet, Laptop)
    • 1.3.3 Smart Phone
    • 1.3.4 Wearable Devices (smart watch)
    • 1.3.5 Other Applications
  • 1.4 Global IC Package Substrates Market by Region
    • 1.4.1 Global IC Package Substrates Market Size Estimates and Forecasts by Region: 2020 VS 2026
    • 1.4.2 North America Estimates and Forecasts (2015-2026)
    • 1.4.3 Europe Estimates and Forecasts (2015-2026)
    • 1.4.4 China Estimates and Forecasts (2015-2026)
    • 1.4.5 Japan Estimates and Forecasts (2015-2026)
    • 1.4.6 South Korea Estimates and Forecasts (2015-2026)
    • 1.4.7 Taiwan Estimates and Forecasts (2015-2026)
  • 1.5 Global IC Package Substrates Growth Prospects
    • 1.5.1 Global IC Package Substrates Revenue Estimates and Forecasts (2015-2026)
    • 1.5.2 Global IC Package Substrates Production Capacity Estimates and Forecasts (2015-2026)
    • 1.5.3 Global IC Package Substrates Production Estimates and Forecasts (2015-2026)
  • 1.6 IC Package Substrates Industry
  • 1.7 IC Package Substrates Market Trends

2 Market Competition by Manufacturers

  • 2.1 Global IC Package Substrates Production Capacity Market Share by Manufacturers (2015-2020)
  • 2.2 Global IC Package Substrates Revenue Share by Manufacturers (2015-2020)
  • 2.3 Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
  • 2.4 Global IC Package Substrates Average Price by Manufacturers (2015-2020)
  • 2.5 Manufacturers IC Package Substrates Production Sites, Area Served, Product Types
  • 2.6 IC Package Substrates Market Competitive Situation and Trends
    • 2.6.1 IC Package Substrates Market Concentration Rate
    • 2.6.2 Global Top 3 and Top 5 Players Market Share by Revenue
    • 2.6.3 Mergers & Acquisitions, Expansion

3 Production and Capacity by Region

  • 3.1 Global Production Capacity of IC Package Substrates Market Share by Regions (2015-2020)
  • 3.2 Global IC Package Substrates Revenue Market Share by Regions (2015-2020)
  • 3.3 Global IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
  • 3.4 North America IC Package Substrates Production
    • 3.4.1 North America IC Package Substrates Production Growth Rate (2015-2020)
    • 3.4.2 North America IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
  • 3.5 Europe IC Package Substrates Production
    • 3.5.1 Europe IC Package Substrates Production Growth Rate (2015-2020)
    • 3.5.2 Europe IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
  • 3.6 China IC Package Substrates Production
    • 3.6.1 China IC Package Substrates Production Growth Rate (2015-2020)
    • 3.6.2 China IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
  • 3.7 Japan IC Package Substrates Production
    • 3.7.1 Japan IC Package Substrates Production Growth Rate (2015-2020)
    • 3.7.2 Japan IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
  • 3.8 South Korea IC Package Substrates Production
    • 3.8.1 South Korea IC Package Substrates Production Growth Rate (2015-2020)
    • 3.8.2 South Korea IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
  • 3.9 Taiwan IC Package Substrates Production
    • 3.9.1 Taiwan IC Package Substrates Production Growth Rate (2015-2020)
    • 3.9.2 Taiwan IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)

4 Global IC Package Substrates Consumption by Regions

  • 4.1 Global IC Package Substrates Consumption by Regions
    • 4.1.1 Global IC Package Substrates Consumption by Region
    • 4.1.2 Global IC Package Substrates Consumption Market Share by Region
  • 4.2 North America
    • 4.2.1 North America IC Package Substrates Consumption by Countries
    • 4.2.2 U.S.
    • 4.2.3 Canada
  • 4.3 Europe
    • 4.3.1 Europe IC Package Substrates Consumption by Countries
    • 4.3.2 Germany
    • 4.3.3 France
    • 4.3.4 U.K.
    • 4.3.5 Italy
    • 4.3.6 Russia
  • 4.4 Asia Pacific
    • 4.4.1 Asia Pacific IC Package Substrates Consumption by Region
    • 4.4.2 China
    • 4.4.3 Japan
    • 4.4.4 South Korea
    • 4.4.5 Taiwan
    • 4.4.6 Southeast Asia
    • 4.4.7 India
    • 4.4.8 Australia
  • 4.5 Latin America
    • 4.5.1 Latin America IC Package Substrates Consumption by Countries
    • 4.5.2 Mexico
    • 4.5.3 Brazil

5 IC Package Substrates Production, Revenue, Price Trend by Type

  • 5.1 Global IC Package Substrates Production Market Share by Type (2015-2020)
  • 5.2 Global IC Package Substrates Revenue Market Share by Type (2015-2020)
  • 5.3 Global IC Package Substrates Price by Type (2015-2020)
  • 5.4 Global IC Package Substrates Market Share by Price Tier (2015-2020): Low-End, Mid-Range and High-End

6 Global IC Package Substrates Market Analysis by Application

  • 6.1 Global IC Package Substrates Consumption Market Share by Application (2015-2020)
  • 6.2 Global IC Package Substrates Consumption Growth Rate by Application (2015-2020)

7 Company Profiles and Key Figures in IC Package Substrates Business

  • 7.1 Ibiden
    • 7.1.1 Ibiden IC Package Substrates Production Sites and Area Served
    • 7.1.2 Ibiden IC Package Substrates Product Introduction, Application and Specification
    • 7.1.3 Ibiden IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.1.4 Ibiden Main Business and Markets Served
  • 7.2 Kyocera
    • 7.2.1 Kyocera IC Package Substrates Production Sites and Area Served
    • 7.2.2 Kyocera IC Package Substrates Product Introduction, Application and Specification
    • 7.2.3 Kyocera IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.2.4 Kyocera Main Business and Markets Served
  • 7.3 ASE Group
    • 7.3.1 ASE Group IC Package Substrates Production Sites and Area Served
    • 7.3.2 ASE Group IC Package Substrates Product Introduction, Application and Specification
    • 7.3.3 ASE Group IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.3.4 ASE Group Main Business and Markets Served
  • 7.4 TTM Technologies
    • 7.4.1 TTM Technologies IC Package Substrates Production Sites and Area Served
    • 7.4.2 TTM Technologies IC Package Substrates Product Introduction, Application and Specification
    • 7.4.3 TTM Technologies IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.4.4 TTM Technologies Main Business and Markets Served
  • 7.5 NTK
    • 7.5.1 NTK IC Package Substrates Production Sites and Area Served
    • 7.5.2 NTK IC Package Substrates Product Introduction, Application and Specification
    • 7.5.3 NTK IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.5.4 NTK Main Business and Markets Served
  • 7.6 Shinko
    • 7.6.1 Shinko IC Package Substrates Production Sites and Area Served
    • 7.6.2 Shinko IC Package Substrates Product Introduction, Application and Specification
    • 7.6.3 Shinko IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.6.4 Shinko Main Business and Markets Served
  • 7.7 Fujitsu Global
    • 7.7.1 Fujitsu Global IC Package Substrates Production Sites and Area Served
    • 7.7.2 Fujitsu Global IC Package Substrates Product Introduction, Application and Specification
    • 7.7.3 Fujitsu Global IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.7.4 Fujitsu Global Main Business and Markets Served
  • 7.8 Doosan Electronic
    • 7.8.1 Doosan Electronic IC Package Substrates Production Sites and Area Served
    • 7.8.2 Doosan Electronic IC Package Substrates Product Introduction, Application and Specification
    • 7.8.3 Doosan Electronic IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.8.4 Doosan Electronic Main Business and Markets Served
  • 7.9 Toppan Printing
    • 7.9.1 Toppan Printing IC Package Substrates Production Sites and Area Served
    • 7.9.2 Toppan Printing IC Package Substrates Product Introduction, Application and Specification
    • 7.9.3 Toppan Printing IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.9.4 Toppan Printing Main Business and Markets Served
  • 7.10 Unimicron
    • 7.10.1 Unimicron IC Package Substrates Production Sites and Area Served
    • 7.10.2 Unimicron IC Package Substrates Product Introduction, Application and Specification
    • 7.10.3 Unimicron IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.10.4 Unimicron Main Business and Markets Served
  • 7.11 Kinsus
    • 7.11.1 Kinsus IC Package Substrates Production Sites and Area Served
    • 7.11.2 Kinsus IC Package Substrates Product Introduction, Application and Specification
    • 7.11.3 Kinsus IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.11.4 Kinsus Main Business and Markets Served
  • 7.12 Nanya
    • 7.12.1 Nanya IC Package Substrates Production Sites and Area Served
    • 7.12.2 Nanya IC Package Substrates Product Introduction, Application and Specification
    • 7.12.3 Nanya IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.12.4 Nanya Main Business and Markets Served
  • 7.13 Semco
    • 7.13.1 Semco IC Package Substrates Production Sites and Area Served
    • 7.13.2 Semco IC Package Substrates Product Introduction, Application and Specification
    • 7.13.3 Semco IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.13.4 Semco Main Business and Markets Served
  • 7.14 LG Innotek
    • 7.14.1 LG Innotek IC Package Substrates Production Sites and Area Served
    • 7.14.2 LG Innotek IC Package Substrates Product Introduction, Application and Specification
    • 7.14.3 LG Innotek IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.14.4 LG Innotek Main Business and Markets Served
  • 7.15 Simmtech
    • 7.15.1 Simmtech IC Package Substrates Production Sites and Area Served
    • 7.15.2 Simmtech IC Package Substrates Product Introduction, Application and Specification
    • 7.15.3 Simmtech IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.15.4 Simmtech Main Business and Markets Served
  • 7.16 Daeduck
    • 7.16.1 Daeduck IC Package Substrates Production Sites and Area Served
    • 7.16.2 Daeduck IC Package Substrates Product Introduction, Application and Specification
    • 7.16.3 Daeduck IC Package Substrates Production Capacity, Revenue, Price and Gross Margin (2015-2020)
    • 7.16.4 Daeduck Main Business and Markets Served

8 IC Package Substrates Manufacturing Cost Analysis

  • 8.1 IC Package Substrates Key Raw Materials Analysis
    • 8.1.1 Key Raw Materials
    • 8.1.2 Key Raw Materials Price Trend
    • 8.1.3 Key Suppliers of Raw Materials
  • 8.2 Proportion of Manufacturing Cost Structure
  • 8.3 Manufacturing Process Analysis of IC Package Substrates
  • 8.4 IC Package Substrates Industrial Chain Analysis

9 Marketing Channel, Distributors and Customers

  • 9.1 Marketing Channel
  • 9.2 IC Package Substrates Distributors List
  • 9.3 IC Package Substrates Customers

10 Market Dynamics

  • 10.1 Market Trends
  • 10.2 Opportunities and Drivers
  • 10.3 Challenges
  • 10.4 Porter's Five Forces Analysis

11 Production and Supply Forecast

  • 11.1 Global Forecasted Production of IC Package Substrates (2021-2026)
  • 11.2 Global Forecasted Revenue of IC Package Substrates (2021-2026)
  • 11.3 Global Forecasted Price of IC Package Substrates (2021-2026)
  • 11.4 Global IC Package Substrates Production Forecast by Regions (2021-2026)
    • 11.4.1 North America IC Package Substrates Production, Revenue Forecast (2021-2026)
    • 11.4.2 Europe IC Package Substrates Production, Revenue Forecast (2021-2026)
    • 11.4.3 China IC Package Substrates Production, Revenue Forecast (2021-2026)
    • 11.4.4 Japan IC Package Substrates Production, Revenue Forecast (2021-2026)
    • 11.4.5 South Korea IC Package Substrates Production, Revenue Forecast (2021-2026)
    • 11.4.6 Taiwan IC Package Substrates Production, Revenue Forecast (2021-2026)

12 Consumption and Demand Forecast

  • 12.1 Global Forecasted and Consumption Demand Analysis of IC Package Substrates
  • 12.2 North America Forecasted Consumption of IC Package Substrates by Country
  • 12.3 Europe Market Forecasted Consumption of IC Package Substrates by Country
  • 12.4 Asia Pacific Market Forecasted Consumption of IC Package Substrates by Regions
  • 12.5 Latin America Forecasted Consumption of IC Package Substrates

13 Forecast by Type and by Application (2021-2026)

  • 13.1 Global Production, Revenue and Price Forecast by Type (2021-2026)
    • 13.1.1 Global Forecasted Production of IC Package Substrates by Type (2021-2026)
    • 13.1.2 Global Forecasted Revenue of IC Package Substrates by Type (2021-2026)
    • 13.1.3 Global Forecasted Price of IC Package Substrates by Type (2021-2026)
  • 13.2 Global Forecasted Consumption of IC Package Substrates by Application (2021-2026)

14 Research Finding and Conclusion

    15 Methodology and Data Source

    • 15.1 Methodology/Research Approach
      • 15.1.1 Research Programs/Design
      • 15.1.2 Market Size Estimation
      • 15.1.3 Market Breakdown and Data Triangulation
    • 15.2 Data Source
      • 15.2.1 Secondary Sources
      • 15.2.2 Primary Sources
    • 15.3 Author List

    The research report includes specific segments by region (country), by company, by Type and by Application. This study provides information about the sales and revenue during the historic and forecasted period of 2015 to 2026. Understanding the segments helps in identifying the importance of different factors that aid the market growth.

    Segment by Type
    WB BGA Substrate
    WB CSP Substrate
    FC BGA Substrate
    FC CSP Substrate
    Other Types

    Segment by Application
    PC (Tablet, Laptop)
    Smart Phone
    Wearable Devices (smart watch)
    Other Applications

    Global IC Package Substrates Market: Regional Analysis
    The report offers in-depth assessment of the growth and other aspects of the IC Package Substrates market in important regions, including the U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, Taiwan, Southeast Asia, Mexico, and Brazil, etc. Key regions covered in the report are North America, Europe, Asia-Pacific and Latin America.
    The report has been curated after observing and studying various factors that determine regional growth such as economic, environmental, social, technological, and political status of the particular region. Analysts have studied the data of revenue, production, and manufacturers of each region. This section analyses region-wise revenue and volume for the forecast period of 2015 to 2026. These analyses will help the reader to understand the potential worth of investment in a particular region.

    Global IC Package Substrates Market: Competitive Landscape
    This section of the report identifies various key manufacturers of the market. It helps the reader understand the strategies and collaborations that players are focusing on combat competition in the market. The comprehensive report provides a significant microscopic look at the market. The reader can identify the footprints of the manufacturers by knowing about the global revenue of manufacturers, the global price of manufacturers, and production by manufacturers during the forecast period of 2015 to 2019.
    The major players in the market include Ibiden, Kyocera, ASE Group, TTM Technologies, NTK, Shinko, Fujitsu Global, Doosan Electronic, Toppan Printing, Unimicron, Kinsus, Nanya, Semco, LG Innotek, Simmtech, Daeduck, etc.


    Summary:
    Get latest Market Research Reports on IC Package Substrates. Industry analysis & Market Report on IC Package Substrates is a syndicated market report, published as Global IC Package Substrates Market Research Report 2020. It is complete Research Study and Industry Analysis of IC Package Substrates market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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