Global IC Package Substrates Market Research Report 2021

1 IC Package Substrates Market Overview

• 1.1 Product Overview and Scope of IC Package Substrates
• 1.2 IC Package Substrates Segment by Type
  • 1.2.1 Global IC Package Substrates Market Size Growth Rate Analysis by Type 2021 VS 2027
  • 1.2.2 WB BGA Substrate
  • 1.2.3 WB CSP Substrate
  • 1.2.4 FC BGA Substrate
  • 1.2.5 FC CSP Substrate
  • 1.2.6 Other Types
• 1.3 IC Package Substrates Segment by Application
  • 1.3.1 Global IC Package Substrates Consumption Comparison by Application: 2016 VS 2021 VS 2027
  • 1.3.2 PC (Tablet, Laptop)
  • 1.3.3 Smart Phone
  • 1.3.4 Wearable Devices (smart watch)
  • 1.3.5 Other Applications
• 1.4 Global Market Growth Prospects
  • 1.4.1 Global IC Package Substrates Revenue Estimates and Forecasts (2016-2027)
  • 1.4.2 Global IC Package Substrates Production Estimates and Forecasts (2016-2027)
• 1.5 Global IC Package Substrates Market by Region
  • 1.5.1 Global IC Package Substrates Market Size Estimates and Forecasts by Region: 2016 VS 2021 VS 2027
  • 1.5.2 North America IC Package Substrates Estimates and Forecasts (2016-2027)
  • 1.5.3 Europe IC Package Substrates Estimates and Forecasts (2016-2027)
  • 1.5.5 China IC Package Substrates Estimates and Forecasts (2016-2027)
  • 1.5.5 Japan IC Package Substrates Estimates and Forecasts (2016-2027)
  • 1.5.6 South Korea IC Package Substrates Estimates and Forecasts (2016-2027)
  • 1.5.7 Taiwan IC Package Substrates Estimates and Forecasts (2016-2027)

2 Market Competition by Manufacturers

• 2.1 Global IC Package Substrates Production Market Share by Manufacturers (2016-2021)
• 2.2 Global IC Package Substrates Revenue Market Share by Manufacturers (2016-2021)
• 2.3 IC Package Substrates Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
• 2.4 Global IC Package Substrates Average Price by Manufacturers (2016-2021)
• 2.5 Manufacturers IC Package Substrates Production Sites, Area Served, Product Types
• 2.6 IC Package Substrates Market Competitive Situation and Trends
  • 2.6.1 IC Package Substrates Market Concentration Rate
  • 2.6.2 Global 5 and 10 Largest IC Package Substrates Players Market Share by Revenue
  • 2.6.3 Mergers & Acquisitions, Expansion

3 Production and Capacity by Region

• 3.1 Global Production of IC Package Substrates Market Share by Region (2016-2021)
• 3.2 Global IC Package Substrates Revenue Market Share by Region (2016-2021)
• 3.3 Global IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
• 3.4 North America IC Package Substrates Production
  • 3.4.1 North America IC Package Substrates Production Growth Rate (2016-2021)
  • 3.4.2 North America IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
• 3.5 Europe IC Package Substrates Production
  • 3.5.1 Europe IC Package Substrates Production Growth Rate (2016-2021)
  • 3.5.2 Europe IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
• 3.6 China IC Package Substrates Production
  • 3.6.1 China IC Package Substrates Production Growth Rate (2016-2021)
  • 3.6.2 China IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
• 3.7 Japan IC Package Substrates Production
  • 3.7.1 Japan IC Package Substrates Production Growth Rate (2016-2021)
  • 3.7.2 Japan IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
• 3.8 South Korea IC Package Substrates Production
  • 3.8.1 South Korea IC Package Substrates Production Growth Rate (2016-2021)
  • 3.8.2 South Korea IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
• 3.9 Taiwan IC Package Substrates Production
  • 3.9.1 Taiwan IC Package Substrates Production Growth Rate (2016-2021)
  • 3.9.2 Taiwan IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)

4 Global IC Package Substrates Consumption by Region

• 4.1 Global IC Package Substrates Consumption by Region
  • 4.1.1 Global IC Package Substrates Consumption by Region
  • 4.1.2 Global IC Package Substrates Consumption Market Share by Region
• 4.2 North America
  • 4.2.1 North America IC Package Substrates Consumption by Country
  • 4.2.2 U.S.
  • 4.2.3 Canada
• 4.3 Europe
  • 4.3.1 Europe IC Package Substrates Consumption by Country
  • 4.3.2 Germany
  • 4.3.3 France
  • 4.3.4 U.K.
  • 4.3.5 Italy
  • 4.3.6 Russia
• 4.4 Asia Pacific
  • 4.4.1 Asia Pacific IC Package Substrates Consumption by Region
  • 4.4.2 China
  • 4.4.3 Japan
  • 4.4.4 South Korea
  • 4.4.5 Taiwan
  • 4.4.6 Southeast Asia
  • 4.4.7 India
  • 4.4.8 Australia
• 4.5 Latin America
  • 4.5.1 Latin America IC Package Substrates Consumption by Country
  • 4.5.2 Mexico
  • 4.5.3 Brazil

5 Production, Revenue, Price Trend by Type

• 5.1 Global IC Package Substrates Production Market Share by Type (2016-2021)
• 5.2 Global IC Package Substrates Revenue Market Share by Type (2016-2021)
• 5.3 Global IC Package Substrates Price by Type (2016-2021)

6 Consumption Analysis by Application

• 6.1 Global IC Package Substrates Consumption Market Share by Application (2016-2021)
• 6.2 Global IC Package Substrates Consumption Growth Rate by Application (2016-2021)

7 Key Companies Profiled

• 7.1 Ibiden
  • 7.1.1 Ibiden IC Package Substrates Corporation Information
  • 7.1.2 Ibiden IC Package Substrates Product Portfolio
  • 7.1.3 Ibiden IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.1.4 Ibiden Main Business and Markets Served
  • 7.1.5 Ibiden Recent Developments/Updates
• 7.2 Kyocera
  • 7.2.1 Kyocera IC Package Substrates Corporation Information
  • 7.2.2 Kyocera IC Package Substrates Product Portfolio
  • 7.2.3 Kyocera IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.2.4 Kyocera Main Business and Markets Served
  • 7.2.5 Kyocera Recent Developments/Updates
• 7.3 ASE Group
  • 7.3.1 ASE Group IC Package Substrates Corporation Information
  • 7.3.2 ASE Group IC Package Substrates Product Portfolio
  • 7.3.3 ASE Group IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.3.4 ASE Group Main Business and Markets Served
  • 7.3.5 ASE Group Recent Developments/Updates
• 7.4 TTM Technologies
  • 7.4.1 TTM Technologies IC Package Substrates Corporation Information
  • 7.4.2 TTM Technologies IC Package Substrates Product Portfolio
  • 7.4.3 TTM Technologies IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.4.4 TTM Technologies Main Business and Markets Served
  • 7.4.5 TTM Technologies Recent Developments/Updates
• 7.5 NTK
  • 7.5.1 NTK IC Package Substrates Corporation Information
  • 7.5.2 NTK IC Package Substrates Product Portfolio
  • 7.5.3 NTK IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.5.4 NTK Main Business and Markets Served
  • 7.5.5 NTK Recent Developments/Updates
• 7.6 Shinko
  • 7.6.1 Shinko IC Package Substrates Corporation Information
  • 7.6.2 Shinko IC Package Substrates Product Portfolio
  • 7.6.3 Shinko IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.6.4 Shinko Main Business and Markets Served
  • 7.6.5 Shinko Recent Developments/Updates
• 7.7 Fujitsu Global
  • 7.7.1 Fujitsu Global IC Package Substrates Corporation Information
  • 7.7.2 Fujitsu Global IC Package Substrates Product Portfolio
  • 7.7.3 Fujitsu Global IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.7.4 Fujitsu Global Main Business and Markets Served
  • 7.7.5 Fujitsu Global Recent Developments/Updates
• 7.8 Doosan Electronic
  • 7.8.1 Doosan Electronic IC Package Substrates Corporation Information
  • 7.8.2 Doosan Electronic IC Package Substrates Product Portfolio
  • 7.8.3 Doosan Electronic IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.8.4 Doosan Electronic Main Business and Markets Served
  • 7.7.5 Doosan Electronic Recent Developments/Updates
• 7.9 Toppan Printing
  • 7.9.1 Toppan Printing IC Package Substrates Corporation Information
  • 7.9.2 Toppan Printing IC Package Substrates Product Portfolio
  • 7.9.3 Toppan Printing IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.9.4 Toppan Printing Main Business and Markets Served
  • 7.9.5 Toppan Printing Recent Developments/Updates
• 7.10 Unimicron
  • 7.10.1 Unimicron IC Package Substrates Corporation Information
  • 7.10.2 Unimicron IC Package Substrates Product Portfolio
  • 7.10.3 Unimicron IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.10.4 Unimicron Main Business and Markets Served
  • 7.10.5 Unimicron Recent Developments/Updates
• 7.11 Kinsus
  • 7.11.1 Kinsus IC Package Substrates Corporation Information
  • 7.11.2 Kinsus IC Package Substrates Product Portfolio
  • 7.11.3 Kinsus IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.11.4 Kinsus Main Business and Markets Served
  • 7.11.5 Kinsus Recent Developments/Updates
• 7.12 Nanya
  • 7.12.1 Nanya IC Package Substrates Corporation Information
  • 7.12.2 Nanya IC Package Substrates Product Portfolio
  • 7.12.3 Nanya IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.12.4 Nanya Main Business and Markets Served
  • 7.12.5 Nanya Recent Developments/Updates
• 7.13 Semco
  • 7.13.1 Semco IC Package Substrates Corporation Information
  • 7.13.2 Semco IC Package Substrates Product Portfolio
  • 7.13.3 Semco IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.13.4 Semco Main Business and Markets Served
  • 7.13.5 Semco Recent Developments/Updates
• 7.14 LG Innotek
  • 7.14.1 LG Innotek IC Package Substrates Corporation Information
  • 7.14.2 LG Innotek IC Package Substrates Product Portfolio
  • 7.14.3 LG Innotek IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.14.4 LG Innotek Main Business and Markets Served
  • 7.14.5 LG Innotek Recent Developments/Updates
• 7.15 Simmtech
  • 7.15.1 Simmtech IC Package Substrates Corporation Information
  • 7.15.2 Simmtech IC Package Substrates Product Portfolio
  • 7.15.3 Simmtech IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.15.4 Simmtech Main Business and Markets Served
  • 7.15.5 Simmtech Recent Developments/Updates
• 7.16 Daeduck
  • 7.16.1 Daeduck IC Package Substrates Corporation Information
  • 7.16.2 Daeduck IC Package Substrates Product Portfolio
  • 7.16.3 Daeduck IC Package Substrates Production, Revenue, Price and Gross Margin (2016-2021)
  • 7.16.4 Daeduck Main Business and Markets Served
  • 7.16.5 Daeduck Recent Developments/Updates

8 IC Package Substrates Manufacturing Cost Analysis

• 8.1 IC Package Substrates Key Raw Materials Analysis
  • 8.1.1 Key Raw Materials
  • 8.1.2 Key Raw Materials Price Trend
  • 8.1.3 Key Suppliers of Raw Materials
• 8.2 Proportion of Manufacturing Cost Structure
• 8.3 Manufacturing Process Analysis of IC Package Substrates
• 8.4 IC Package Substrates Industrial Chain Analysis

9 Marketing Channel, Distributors and Customers

• 9.1 Marketing Channel
• 9.2 IC Package Substrates Distributors List
• 9.3 IC Package Substrates Customers

10 Market Dynamics

• 10.1 IC Package Substrates Industry Trends
• 10.2 IC Package Substrates Growth Drivers
• 10.3 IC Package Substrates Market Challenges
• 10.4 IC Package Substrates Market Restraints

11 Production and Supply Forecast

• 11.1 Global Forecasted Production of IC Package Substrates by Region (2022-2027)
• 11.2 North America IC Package Substrates Production, Revenue Forecast (2022-2027)
• 11.3 Europe IC Package Substrates Production, Revenue Forecast (2022-2027)
• 11.4 China IC Package Substrates Production, Revenue Forecast (2022-2027)
• 11.5 Japan IC Package Substrates Production, Revenue Forecast (2022-2027)
• 11.6 South Korea IC Package Substrates Production, Revenue Forecast (2022-2027)
• 11.7 Taiwan IC Package Substrates Production, Revenue Forecast (2022-2027)

12 Consumption and Demand Forecast

• 12.1 Global Forecasted Demand Analysis of IC Package Substrates
• 12.2 North America Forecasted Consumption of IC Package Substrates by Country
• 12.3 Europe Market Forecasted Consumption of IC Package Substrates by Country
• 12.4 Asia Pacific Market Forecasted Consumption of IC Package Substrates by Region
• 12.5 Latin America Forecasted Consumption of IC Package Substrates by Country

13 Forecast by Type and by Application (2022-2027)

• 13.1 Global Production, Revenue and Price Forecast by Type (2022-2027)
  • 13.1.1 Global Forecasted Production of IC Package Substrates by Type (2022-2027)
  • 13.1.2 Global Forecasted Revenue of IC Package Substrates by Type (2022-2027)
  • 13.1.3 Global Forecasted Price of IC Package Substrates by Type (2022-2027)
• 13.2 Global Forecasted Consumption of IC Package Substrates by Application (2022-2027)

14 Research Finding and Conclusion

15 Methodology and Data Source

• 15.1 Methodology/Research Approach
  • 15.1.1 Research Programs/Design
  • 15.1.2 Market Size Estimation
  • 15.1.3 Market Breakdown and Data Triangulation
• 15.2 Data Source
  • 15.2.1 Secondary Sources
  • 15.2.2 Primary Sources
• 15.3 Author List