3D time of flight (ToF) is a type of scanner-less LIDAR (light detection and ranging) that uses high power optical pulses in durations of nanoseconds to capture depth information (typically over short distances) from a scene of interest.
The global market for 3D Time-of-flight Chip is estimated to increase from US$ million in 2021 to reach US$ million by 2028, exhibiting a CAGR of % during 2022-2028. Keeping in mind the uncertainties of COVID-19 and Russia-Ukraine War, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemic on different end use sectors. These insights are included in the report as a major market contributor.
The APAC 3D Time-of-flight Chip market is expected at value of US$ million in 2022 and grow at approximately % CAGR during 2022 and 2028.
The United States 3D Time-of-flight Chip market is expected at value of US$ million in 2022 and grow at approximately % CAGR during 2022 and 2028.
The Europe 3D Time-of-flight Chip market is expected at value of US$ million in 2022 and grow at approximately % CAGR during 2022 and 2028.
The China 3D Time-of-flight Chip market is expected at value of US$ million in 2022 and grow at approximately % CAGR during 2022 and 2028.
Global key 3D Time-of-flight Chip players cover Melexis, Espros Photonics, Renesas, Texas Instruments and STMicroelectronics, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
Report Coverage
This latest report provides a deep insight into the global 3D Time-of-flight Chip market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, value chain analysis, etc.
This report aims to provide a comprehensive picture of the global 3D Time-of-flight Chip market, with both quantitative and qualitative data, to help readers understand how the 3D Time-of-flight Chip market scenario changed across the globe during the pandemic and Russia-Ukraine War.
The base year considered for analyses is 2021, while the market estimates and forecasts are given from 2022 to 2028. The market estimates are provided in terms of revenue in USD millions and volume in K Units.
Market Segmentation:
The study segments the 3D Time-of-flight Chip market and forecasts the market size by Type (Direct ToF and Indirect TOF,), by Application (Industrial, Automotive, Consumer and Other), and region (APAC, Americas, Europe, and Middle East & Africa).
Segmentation by type
Direct ToF
Indirect TOF
Segmentation by application
Industrial
Automotive
Consumer
Other
Segmentation by region
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
Major companies covered
Melexis
Espros Photonics
Renesas
Texas Instruments
STMicroelectronics
Infineon Technologies
Sony
Panasonic
AMS
Silicon Integrated
Adaps Photonics
Vzense
Orbbec
Opnous
Evisionics
Nephotonics
Chapter Introduction
Chapter 1: Scope of 3D Time-of-flight Chip, Research Methodology, etc.
Chapter 2: Executive Summary, global 3D Time-of-flight Chip market size (sales and revenue) and CAGR, 3D Time-of-flight Chip market size by region, by type, by application, historical data from 2017 to 2022, and forecast to 2028.
Chapter 3: 3D Time-of-flight Chip sales, revenue, average price, global market share, and industry ranking by company, 2017-2022
Chapter 4: Global 3D Time-of-flight Chip sales and revenue by region and by country. Country specific data and market value analysis for the U.S., Canada, Europe, China, Japan, South Korea, Southeast Asia, India, Latin America and Middle East & Africa.
Chapter 5, 6, 7, 8: Americas, APAC, Europe, Middle East & Africa, sales segment by country, by type, and type.
Chapter 9: Analysis of the current market trends, market forecast, opportunities and economic trends that are affecting the future marketplace
Chapter 10: Manufacturing cost structure analysis
Chapter 11: Sales channel, distributors, and customers
Chapter 12: Global 3D Time-of-flight Chip market size forecast by region, by country, by type, and application.
Chapter 13: Comprehensive company profiles of the leading players, including Melexis, Espros Photonics, Renesas, Texas Instruments, STMicroelectronics, Infineon Technologies, Sony, Panasonic and AMS, etc.
Chapter 14: Research Findings and Conclusion
Summary:
Get latest Market Research Reports on 3D Time-of-flight Chip. Industry analysis & Market Report on 3D Time-of-flight Chip is a syndicated market report, published as Global 3D Time-of-flight Chip Market Growth 2022-2028. It is complete Research Study and Industry Analysis of 3D Time-of-flight Chip market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.