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Global Wafer Thinning Machine Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

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1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Wafer Thinning Machine Consumption Value by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 Fully Automatic Wafer Grinders
    • 1.3.3 Semi-Automatic Wafer Grinders
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Wafer Thinning Machine Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 Silicon Wafer
    • 1.4.3 Compound Semiconductors
  • 1.5 Global Wafer Thinning Machine Market Size & Forecast
    • 1.5.1 Global Wafer Thinning Machine Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global Wafer Thinning Machine Sales Quantity (2020-2031)
    • 1.5.3 Global Wafer Thinning Machine Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 Disco
    • 2.1.1 Disco Details
    • 2.1.2 Disco Major Business
    • 2.1.3 Disco Wafer Thinning Machine Product and Services
    • 2.1.4 Disco Wafer Thinning Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 Disco Recent Developments/Updates
  • 2.2 TOKYO SEIMITSU
    • 2.2.1 TOKYO SEIMITSU Details
    • 2.2.2 TOKYO SEIMITSU Major Business
    • 2.2.3 TOKYO SEIMITSU Wafer Thinning Machine Product and Services
    • 2.2.4 TOKYO SEIMITSU Wafer Thinning Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 TOKYO SEIMITSU Recent Developments/Updates
  • 2.3 G&N
    • 2.3.1 G&N Details
    • 2.3.2 G&N Major Business
    • 2.3.3 G&N Wafer Thinning Machine Product and Services
    • 2.3.4 G&N Wafer Thinning Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 G&N Recent Developments/Updates
  • 2.4 Okamoto Semiconductor Equipment Division
    • 2.4.1 Okamoto Semiconductor Equipment Division Details
    • 2.4.2 Okamoto Semiconductor Equipment Division Major Business
    • 2.4.3 Okamoto Semiconductor Equipment Division Wafer Thinning Machine Product and Services
    • 2.4.4 Okamoto Semiconductor Equipment Division Wafer Thinning Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates
  • 2.5 CETC
    • 2.5.1 CETC Details
    • 2.5.2 CETC Major Business
    • 2.5.3 CETC Wafer Thinning Machine Product and Services
    • 2.5.4 CETC Wafer Thinning Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 CETC Recent Developments/Updates
  • 2.6 Koyo Machinery
    • 2.6.1 Koyo Machinery Details
    • 2.6.2 Koyo Machinery Major Business
    • 2.6.3 Koyo Machinery Wafer Thinning Machine Product and Services
    • 2.6.4 Koyo Machinery Wafer Thinning Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 Koyo Machinery Recent Developments/Updates
  • 2.7 Revasum
    • 2.7.1 Revasum Details
    • 2.7.2 Revasum Major Business
    • 2.7.3 Revasum Wafer Thinning Machine Product and Services
    • 2.7.4 Revasum Wafer Thinning Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 Revasum Recent Developments/Updates
  • 2.8 WAIDA MFG
    • 2.8.1 WAIDA MFG Details
    • 2.8.2 WAIDA MFG Major Business
    • 2.8.3 WAIDA MFG Wafer Thinning Machine Product and Services
    • 2.8.4 WAIDA MFG Wafer Thinning Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 WAIDA MFG Recent Developments/Updates
  • 2.9 Hunan Yujing Machine Industrial
    • 2.9.1 Hunan Yujing Machine Industrial Details
    • 2.9.2 Hunan Yujing Machine Industrial Major Business
    • 2.9.3 Hunan Yujing Machine Industrial Wafer Thinning Machine Product and Services
    • 2.9.4 Hunan Yujing Machine Industrial Wafer Thinning Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 Hunan Yujing Machine Industrial Recent Developments/Updates
  • 2.10 SpeedFam
    • 2.10.1 SpeedFam Details
    • 2.10.2 SpeedFam Major Business
    • 2.10.3 SpeedFam Wafer Thinning Machine Product and Services
    • 2.10.4 SpeedFam Wafer Thinning Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 SpeedFam Recent Developments/Updates
  • 2.11 TSD
    • 2.11.1 TSD Details
    • 2.11.2 TSD Major Business
    • 2.11.3 TSD Wafer Thinning Machine Product and Services
    • 2.11.4 TSD Wafer Thinning Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.11.5 TSD Recent Developments/Updates
  • 2.12 Engis Corporation
    • 2.12.1 Engis Corporation Details
    • 2.12.2 Engis Corporation Major Business
    • 2.12.3 Engis Corporation Wafer Thinning Machine Product and Services
    • 2.12.4 Engis Corporation Wafer Thinning Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.12.5 Engis Corporation Recent Developments/Updates
  • 2.13 NTS
    • 2.13.1 NTS Details
    • 2.13.2 NTS Major Business
    • 2.13.3 NTS Wafer Thinning Machine Product and Services
    • 2.13.4 NTS Wafer Thinning Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.13.5 NTS Recent Developments/Updates

3 Competitive Environment: Wafer Thinning Machine by Manufacturer

  • 3.1 Global Wafer Thinning Machine Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global Wafer Thinning Machine Revenue by Manufacturer (2020-2025)
  • 3.3 Global Wafer Thinning Machine Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of Wafer Thinning Machine by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 Wafer Thinning Machine Manufacturer Market Share in 2024
    • 3.4.3 Top 6 Wafer Thinning Machine Manufacturer Market Share in 2024
  • 3.5 Wafer Thinning Machine Market: Overall Company Footprint Analysis
    • 3.5.1 Wafer Thinning Machine Market: Region Footprint
    • 3.5.2 Wafer Thinning Machine Market: Company Product Type Footprint
    • 3.5.3 Wafer Thinning Machine Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Wafer Thinning Machine Market Size by Region
    • 4.1.1 Global Wafer Thinning Machine Sales Quantity by Region (2020-2031)
    • 4.1.2 Global Wafer Thinning Machine Consumption Value by Region (2020-2031)
    • 4.1.3 Global Wafer Thinning Machine Average Price by Region (2020-2031)
  • 4.2 North America Wafer Thinning Machine Consumption Value (2020-2031)
  • 4.3 Europe Wafer Thinning Machine Consumption Value (2020-2031)
  • 4.4 Asia-Pacific Wafer Thinning Machine Consumption Value (2020-2031)
  • 4.5 South America Wafer Thinning Machine Consumption Value (2020-2031)
  • 4.6 Middle East & Africa Wafer Thinning Machine Consumption Value (2020-2031)

5 Market Segment by Type

  • 5.1 Global Wafer Thinning Machine Sales Quantity by Type (2020-2031)
  • 5.2 Global Wafer Thinning Machine Consumption Value by Type (2020-2031)
  • 5.3 Global Wafer Thinning Machine Average Price by Type (2020-2031)

6 Market Segment by Application

  • 6.1 Global Wafer Thinning Machine Sales Quantity by Application (2020-2031)
  • 6.2 Global Wafer Thinning Machine Consumption Value by Application (2020-2031)
  • 6.3 Global Wafer Thinning Machine Average Price by Application (2020-2031)

7 North America

  • 7.1 North America Wafer Thinning Machine Sales Quantity by Type (2020-2031)
  • 7.2 North America Wafer Thinning Machine Sales Quantity by Application (2020-2031)
  • 7.3 North America Wafer Thinning Machine Market Size by Country
    • 7.3.1 North America Wafer Thinning Machine Sales Quantity by Country (2020-2031)
    • 7.3.2 North America Wafer Thinning Machine Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe Wafer Thinning Machine Sales Quantity by Type (2020-2031)
  • 8.2 Europe Wafer Thinning Machine Sales Quantity by Application (2020-2031)
  • 8.3 Europe Wafer Thinning Machine Market Size by Country
    • 8.3.1 Europe Wafer Thinning Machine Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe Wafer Thinning Machine Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific Wafer Thinning Machine Sales Quantity by Type (2020-2031)
  • 9.2 Asia-Pacific Wafer Thinning Machine Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific Wafer Thinning Machine Market Size by Region
    • 9.3.1 Asia-Pacific Wafer Thinning Machine Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific Wafer Thinning Machine Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America Wafer Thinning Machine Sales Quantity by Type (2020-2031)
  • 10.2 South America Wafer Thinning Machine Sales Quantity by Application (2020-2031)
  • 10.3 South America Wafer Thinning Machine Market Size by Country
    • 10.3.1 South America Wafer Thinning Machine Sales Quantity by Country (2020-2031)
    • 10.3.2 South America Wafer Thinning Machine Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa Wafer Thinning Machine Sales Quantity by Type (2020-2031)
  • 11.2 Middle East & Africa Wafer Thinning Machine Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa Wafer Thinning Machine Market Size by Country
    • 11.3.1 Middle East & Africa Wafer Thinning Machine Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa Wafer Thinning Machine Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 Wafer Thinning Machine Market Drivers
  • 12.2 Wafer Thinning Machine Market Restraints
  • 12.3 Wafer Thinning Machine Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Wafer Thinning Machine and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Wafer Thinning Machine
  • 13.3 Wafer Thinning Machine Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Wafer Thinning Machine Typical Distributors
  • 14.3 Wafer Thinning Machine Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global Wafer Thinning Machine market size was valued at US$ 1072 million in 2024 and is forecast to a readjusted size of USD 1732 million by 2031 with a CAGR of 6.9% during review period.
    Wafer thinning machines, also called grinders, use a centrally located robot to move wafers from the input station to the measurement station. After that, the wafer moves to the polishing station and the cleaning station in sequence. The robot can move the wafer from the cleaning station to the measuring station for measurement after grinding or directly to the output station.
    The Wafer Thinning Machines market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe. Wafer Thinning Machines are integral in wafer thinning processes, where the primary applications include the processing of 200mm and 300mm wafers. Among the various types of Wafer Thinning Machines, the fully automatic Wafer Thinning Machines dominate the market, they have higher automation levels, allowing for increased efficiency and precision, accounting for approximately 52% of the global market share. The most significant application market is for 300mm wafers, which accounts for 83% of the global demand, primarily driven by the advanced semiconductor manufacturing processes that require thinner wafers with high precision. Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.
    Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Wafer Thinning Machine and related services. The top five players account for about 90% of the revenue market in 2024.
    Market Drivers:
    Technological Advancements in Semiconductor Manufacturing: As the demand for smaller, more powerful, and energy-efficient electronic devices grows, semiconductor manufacturers are continuously advancing their processes to meet these demands. This includes the need for thinner, more precisely engineered wafers, driving the demand for high-performance Wafer Thinning Machines. Fully automatic Wafer Thinning Machines, known for their precision and ability to handle larger volumes, are particularly in demand to meet these stringent manufacturing requirements.
    Miniaturization of Electronic Devices: The global trend towards smaller, more compact electronic devices—such as smartphones, wearables, and IoT devices—requires thinner semiconductor wafers. As a result, there is a growing demand for wafer thinning solutions that can maintain high quality while reducing thickness. Fully automatic Wafer Thinning Machines are the preferred solution, as they offer high precision and productivity.
    Surge in Semiconductor Demand: The semiconductor industry is experiencing significant growth, driven by the rise in demand for various electronic applications, including computing, communication, and automotive systems. As the industry's focus shifts towards advanced technology nodes, the demand for larger wafers, particularly 300mm wafers, is growing. These trends are contributing to the expansion of the Wafer Thinning Machine market, especially in regions such as APAC, which dominate semiconductor manufacturing.
    Shift Towards Fully Automated Solutions: Fully automated Wafer Thinning Machines are gaining popularity due to their higher efficiency, reduced labor costs, and the ability to maintain consistency across large batches. As semiconductor manufacturers continue to scale production, automation becomes increasingly essential to meet high-volume production requirements without compromising quality.
    Conclusion:
    The Wafer Thinning Machine market is poised for significant growth, driven by advancements in semiconductor manufacturing, the increasing demand for thinner and more precise wafers, and the rise in 300mm wafer processing. Fully automatic Wafer Thinning Machines, which dominate the market with a 52% share, will continue to lead the market due to their higher efficiency and precision.
    The APAC region remains the largest consumer of Wafer Thinning Machines. However, despite these strong growth drivers, challenges such as high initial investment costs and technological complexity may pose barriers to market entry for smaller players. Manufacturers will need to innovate and focus on automation, precision, and cost-effective solutions to capitalize on the growing demand for wafer thinning equipment.
    This report is a detailed and comprehensive analysis for global Wafer Thinning Machine market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
    Key Features:
    Global Wafer Thinning Machine market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
    Global Wafer Thinning Machine market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
    Global Wafer Thinning Machine market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
    Global Wafer Thinning Machine market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
    The Primary Objectives in This Report Are:
    To determine the size of the total market opportunity of global and key countries
    To assess the growth potential for Wafer Thinning Machine
    To forecast future growth in each product and end-use market
    To assess competitive factors affecting the marketplace
    This report profiles key players in the global Wafer Thinning Machine market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, etc.
    This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
    Market Segmentation
    Wafer Thinning Machine market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
    Market segment by Type
    Fully Automatic Wafer Grinders
    Semi-Automatic Wafer Grinders
    Market segment by Application
    Silicon Wafer
    Compound Semiconductors
    Major players covered
    Disco
    TOKYO SEIMITSU
    G&N
    Okamoto Semiconductor Equipment Division
    CETC
    Koyo Machinery
    Revasum
    WAIDA MFG
    Hunan Yujing Machine Industrial
    SpeedFam
    TSD
    Engis Corporation
    NTS
    Market segment by region, regional analysis covers
    North America (United States, Canada, and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 15 chapters:
    Chapter 1, to describe Wafer Thinning Machine product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top manufacturers of Wafer Thinning Machine, with price, sales quantity, revenue, and global market share of Wafer Thinning Machine from 2020 to 2025.
    Chapter 3, the Wafer Thinning Machine competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
    Chapter 4, the Wafer Thinning Machine breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
    Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
    Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Thinning Machine market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
    Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
    Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Thinning Machine.
    Chapter 14 and 15, to describe Wafer Thinning Machine sales channel, distributors, customers, research findings and conclusion.

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