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Global Wafer Level Packaging Technologies Market 2019 by Company, Regions, Type and Application, Forecast to 2024

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Table of Contents

    1 Wafer Level Packaging Technologies Market Overview

    • 1.1 Product Overview and Scope of Wafer Level Packaging Technologies
    • 1.2 Classification of Wafer Level Packaging Technologies by Types
      • 1.2.1 Global Wafer Level Packaging Technologies Revenue Comparison by Types (2019-2024)
      • 1.2.2 Global Wafer Level Packaging Technologies Revenue Market Share by Types in 2018
      • 1.2.3 Fan-In Wafer-Level Packaging
      • 1.2.4 Fan-Out Wafer-Level Packaging
    • 1.3 Global Wafer Level Packaging Technologies Market by Application
      • 1.3.1 Global Wafer Level Packaging Technologies Market Size and Market Share Comparison by Applications (2014-2024)
      • 1.3.2 CMOS Image Sensor
      • 1.3.3 Wireless Connectivity
      • 1.3.4 Logic and Memory IC
      • 1.3.5 MEMS and Sensor
      • 1.3.6 Analog and Mixed IC
      • 1.3.7 Others
    • 1.4 Global Wafer Level Packaging Technologies Market by Regions
      • 1.4.1 Global Wafer Level Packaging Technologies Market Size (Million USD) Comparison by Regions (2014-2024)
      • 1.4.1 North America (USA, Canada and Mexico) Wafer Level Packaging Technologies Status and Prospect (2014-2024)
      • 1.4.2 Europe (Germany, France, UK, Russia and Italy) Wafer Level Packaging Technologies Status and Prospect (2014-2024)
      • 1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia) Wafer Level Packaging Technologies Status and Prospect (2014-2024)
      • 1.4.4 South America (Brazil, Argentina, Colombia) Wafer Level Packaging Technologies Status and Prospect (2014-2024)
      • 1.4.5 Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa) Wafer Level Packaging Technologies Status and Prospect (2014-2024)
    • 1.5 Global Market Size of Wafer Level Packaging Technologies (2014-2024)

    2 Manufacturers Profiles

    • 2.1 Samsung Electro-Mechanics
      • 2.1.1 Business Overview
      • 2.1.2 Wafer Level Packaging Technologies Type and Applications
        • 2.1.2.1 Product A
        • 2.1.2.2 Product B
      • 2.1.3 Samsung Electro-Mechanics Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2018)
    • 2.2 TSMC
      • 2.2.1 Business Overview
      • 2.2.2 Wafer Level Packaging Technologies Type and Applications
        • 2.2.2.1 Product A
        • 2.2.2.2 Product B
      • 2.2.3 TSMC Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2018)
    • 2.3 Amkor Technology
      • 2.3.1 Business Overview
      • 2.3.2 Wafer Level Packaging Technologies Type and Applications
        • 2.3.2.1 Product A
        • 2.3.2.2 Product B
      • 2.3.3 Amkor Technology Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2018)
    • 2.4 Orbotech
      • 2.4.1 Business Overview
      • 2.4.2 Wafer Level Packaging Technologies Type and Applications
        • 2.4.2.1 Product A
        • 2.4.2.2 Product B
      • 2.4.3 Orbotech Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2018)
    • 2.5 Advanced Semiconductor Engineering
      • 2.5.1 Business Overview
      • 2.5.2 Wafer Level Packaging Technologies Type and Applications
        • 2.5.2.1 Product A
        • 2.5.2.2 Product B
      • 2.5.3 Advanced Semiconductor Engineering Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2018)
    • 2.6 Deca Technologies
      • 2.6.1 Business Overview
      • 2.6.2 Wafer Level Packaging Technologies Type and Applications
        • 2.6.2.1 Product A
        • 2.6.2.2 Product B
      • 2.6.3 Deca Technologies Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2018)
    • 2.7 STATS ChipPAC
      • 2.7.1 Business Overview
      • 2.7.2 Wafer Level Packaging Technologies Type and Applications
        • 2.7.2.1 Product A
        • 2.7.2.2 Product B
      • 2.7.3 STATS ChipPAC Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2018)
    • 2.8 Nepes
      • 2.8.1 Business Overview
      • 2.8.2 Wafer Level Packaging Technologies Type and Applications
        • 2.8.2.1 Product A
        • 2.8.2.2 Product B
      • 2.8.3 Nepes Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2018)

    3 Global Wafer Level Packaging Technologies Market Competition, by Players

    • 3.1 Global Wafer Level Packaging Technologies Revenue and Share by Players (2014-2019)
    • 3.2 Market Concentration Rate
      • 3.2.1 Top 5 Wafer Level Packaging Technologies Players Market Share
      • 3.2.2 Top 10 Wafer Level Packaging Technologies Players Market Share
    • 3.3 Market Competition Trend

    4 Global Wafer Level Packaging Technologies Market Size by Regions

    • 4.1 Global Wafer Level Packaging Technologies Revenue and Market Share by Regions
    • 4.2 North America Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 4.3 Europe Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 4.4 Asia-Pacific Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 4.5 South America Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 4.6 Middle East and Africa Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)

    5 North America Wafer Level Packaging Technologies Revenue by Countries

    • 5.1 North America Wafer Level Packaging Technologies Revenue by Countries (2014-2019)
    • 5.2 USA Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 5.3 Canada Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 5.4 Mexico Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)

    6 Europe Wafer Level Packaging Technologies Revenue by Countries

    • 6.1 Europe Wafer Level Packaging Technologies Revenue by Countries (2014-2019)
    • 6.2 Germany Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 6.3 UK Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 6.4 France Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 6.5 Russia Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 6.6 Italy Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)

    7 Asia-Pacific Wafer Level Packaging Technologies Revenue by Countries

    • 7.1 Asia-Pacific Wafer Level Packaging Technologies Revenue by Countries (2014-2019)
    • 7.2 China Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 7.3 Japan Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 7.4 Korea Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 7.5 India Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 7.6 Southeast Asia Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)

    8 South America Wafer Level Packaging Technologies Revenue by Countries

    • 8.1 South America Wafer Level Packaging Technologies Revenue by Countries (2014-2019)
    • 8.2 Brazil Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 8.3 Argentina Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 8.4 Colombia Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)

    9 Middle East and Africa Revenue Wafer Level Packaging Technologies by Countries

    • 9.1 Middle East and Africa Wafer Level Packaging Technologies Revenue by Countries (2014-2019)
    • 9.2 Saudi Arabia Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 9.3 UAE Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 9.4 Egypt Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 9.5 Nigeria Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)
    • 9.6 South Africa Wafer Level Packaging Technologies Revenue and Growth Rate (2014-2019)

    10 Global Wafer Level Packaging Technologies Market Segment by Type

    • 10.1 Global Wafer Level Packaging Technologies Revenue and Market Share by Type (2014-2019)
    • 10.2 Global Wafer Level Packaging Technologies Market Forecast by Type (2019-2024)
    • 10.3 Fan-In Wafer-Level Packaging Revenue Growth Rate (2014-2024)
    • 10.4 Fan-Out Wafer-Level Packaging Revenue Growth Rate (2014-2024)

    11 Global Wafer Level Packaging Technologies Market Segment by Application

    • 11.1 Global Wafer Level Packaging Technologies Revenue Market Share by Application (2014-2019)
    • 11.2 Wafer Level Packaging Technologies Market Forecast by Application (2019-2024)
    • 11.3 CMOS Image Sensor Revenue Growth (2014-2019)
    • 11.4 Wireless Connectivity Revenue Growth (2014-2019)
    • 11.5 Logic and Memory IC Revenue Growth (2014-2019)
    • 11.6 MEMS and Sensor Revenue Growth (2014-2019)
    • 11.7 Analog and Mixed IC Revenue Growth (2014-2019)
    • 11.8 Others Revenue Growth (2014-2019)

    12 Global Wafer Level Packaging Technologies Market Size Forecast (2019-2024)

    • 12.1 Global Wafer Level Packaging Technologies Market Size Forecast (2019-2024)
    • 12.2 Global Wafer Level Packaging Technologies Market Forecast by Regions (2019-2024)
    • 12.3 North America Wafer Level Packaging Technologies Revenue Market Forecast (2019-2024)
    • 12.4 Europe Wafer Level Packaging Technologies Revenue Market Forecast (2019-2024)
    • 12.5 Asia-Pacific Wafer Level Packaging Technologies Revenue Market Forecast (2019-2024)
    • 12.6 South America Wafer Level Packaging Technologies Revenue Market Forecast (2019-2024)
    • 12.7 Middle East and Africa Wafer Level Packaging Technologies Revenue Market Forecast (2019-2024)

    13 Research Findings and Conclusion

      14 Appendix

      • 14.1 Methodology

      Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.

      Scope of the Report:
      The global Wafer Level Packaging Technologies market is valued at xx million USD in 2018 and is expected to reach xx million USD by the end of 2024, growing at a CAGR of xx% between 2019 and 2024.
      The Asia-Pacific will occupy for more market share in following years, especially in China, also fast growing India and Southeast Asia regions.
      North America, especially The United States, will still play an important role which cannot be ignored. Any changes from United States might affect the development trend of Wafer Level Packaging Technologies.
      Europe also play important roles in global market, with market size of xx million USD in 2019 and will be xx million USD in 2024, with a CAGR of xx%.
      This report studies the Wafer Level Packaging Technologies market status and outlook of Global and major regions, from angles of players, countries, product types and end industries; this report analyzes the top players in global market, and splits the Wafer Level Packaging Technologies market by product type and applications/end industries.

      Market Segment by Companies, this report covers
      Samsung Electro-Mechanics
      TSMC
      Amkor Technology
      Orbotech
      Advanced Semiconductor Engineering
      Deca Technologies
      STATS ChipPAC
      Nepes

      Market Segment by Regions, regional analysis covers
      North America (United States, Canada and Mexico)
      Europe (Germany, France, UK, Russia and Italy)
      Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
      South America (Brazil, Argentina, Colombia)
      Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

      Market Segment by Type, covers
      Fan-In Wafer-Level Packaging
      Fan-Out Wafer-Level Packaging

      Market Segment by Applications, can be divided into
      CMOS Image Sensor
      Wireless Connectivity
      Logic and Memory IC
      MEMS and Sensor
      Analog and Mixed IC
      Others

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