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Global Wafer Level Packaging Technologies Market Size, Status and Forecast 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Study Scope
    • 1.2 Key Market Segments
    • 1.3 Players Covered
    • 1.4 Market Analysis by Type
      • 1.4.1 Global Wafer Level Packaging Technologies Market Size Growth Rate by Type (2014-2025)
      • 1.4.2 Fan-In Wafer-Level Packaging
      • 1.4.3 Fan-Out Wafer-Level Packaging
    • 1.5 Market by Application
      • 1.5.1 Global Wafer Level Packaging Technologies Market Share by Application (2014-2025)
      • 1.5.2 CMOS Image Sensor
      • 1.5.3 Wireless Connectivity
      • 1.5.4 Logic and Memory IC
      • 1.5.5 MEMS and Sensor
      • 1.5.6 Analog and Mixed IC
      • 1.5.7 Others
    • 1.6 Study Objectives
    • 1.7 Years Considered

    2 Global Growth Trends

    • 2.1 Wafer Level Packaging Technologies Market Size
    • 2.2 Wafer Level Packaging Technologies Growth Trends by Regions
      • 2.2.1 Wafer Level Packaging Technologies Market Size by Regions (2014-2025)
      • 2.2.2 Wafer Level Packaging Technologies Market Share by Regions (2014-2019)
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers
      • 2.3.3 Market Opportunities

    3 Market Share by Key Players

    • 3.1 Wafer Level Packaging Technologies Market Size by Manufacturers
      • 3.1.1 Global Wafer Level Packaging Technologies Revenue by Manufacturers (2014-2019)
      • 3.1.2 Global Wafer Level Packaging Technologies Revenue Market Share by Manufacturers (2014-2019)
      • 3.1.3 Global Wafer Level Packaging Technologies Market Concentration Ratio (CR5 and HHI)
    • 3.2 Wafer Level Packaging Technologies Key Players Head office and Area Served
    • 3.3 Key Players Wafer Level Packaging Technologies Product/Solution/Service
    • 3.4 Date of Enter into Wafer Level Packaging Technologies Market
    • 3.5 Mergers & Acquisitions, Expansion Plans

    4 Breakdown Data by Type and Application

    • 4.1 Global Wafer Level Packaging Technologies Market Size by Type (2014-2019)
    • 4.2 Global Wafer Level Packaging Technologies Market Size by Application (2014-2019)

    5 United States

    • 5.1 United States Wafer Level Packaging Technologies Market Size (2014-2019)
    • 5.2 Wafer Level Packaging Technologies Key Players in United States
    • 5.3 United States Wafer Level Packaging Technologies Market Size by Type
    • 5.4 United States Wafer Level Packaging Technologies Market Size by Application

    6 Europe

    • 6.1 Europe Wafer Level Packaging Technologies Market Size (2014-2019)
    • 6.2 Wafer Level Packaging Technologies Key Players in Europe
    • 6.3 Europe Wafer Level Packaging Technologies Market Size by Type
    • 6.4 Europe Wafer Level Packaging Technologies Market Size by Application

    7 China

    • 7.1 China Wafer Level Packaging Technologies Market Size (2014-2019)
    • 7.2 Wafer Level Packaging Technologies Key Players in China
    • 7.3 China Wafer Level Packaging Technologies Market Size by Type
    • 7.4 China Wafer Level Packaging Technologies Market Size by Application

    8 Japan

    • 8.1 Japan Wafer Level Packaging Technologies Market Size (2014-2019)
    • 8.2 Wafer Level Packaging Technologies Key Players in Japan
    • 8.3 Japan Wafer Level Packaging Technologies Market Size by Type
    • 8.4 Japan Wafer Level Packaging Technologies Market Size by Application

    9 Southeast Asia

    • 9.1 Southeast Asia Wafer Level Packaging Technologies Market Size (2014-2019)
    • 9.2 Wafer Level Packaging Technologies Key Players in Southeast Asia
    • 9.3 Southeast Asia Wafer Level Packaging Technologies Market Size by Type
    • 9.4 Southeast Asia Wafer Level Packaging Technologies Market Size by Application

    10 India

    • 10.1 India Wafer Level Packaging Technologies Market Size (2014-2019)
    • 10.2 Wafer Level Packaging Technologies Key Players in India
    • 10.3 India Wafer Level Packaging Technologies Market Size by Type
    • 10.4 India Wafer Level Packaging Technologies Market Size by Application

    11 Central & South America

    • 11.1 Central & South America Wafer Level Packaging Technologies Market Size (2014-2019)
    • 11.2 Wafer Level Packaging Technologies Key Players in Central & South America
    • 11.3 Central & South America Wafer Level Packaging Technologies Market Size by Type
    • 11.4 Central & South America Wafer Level Packaging Technologies Market Size by Application

    12 International Players Profiles

    • 12.1 Samsung Electro-Mechanics
      • 12.1.1 Samsung Electro-Mechanics Company Details
      • 12.1.2 Company Description and Business Overview
      • 12.1.3 Wafer Level Packaging Technologies Introduction
      • 12.1.4 Samsung Electro-Mechanics Revenue in Wafer Level Packaging Technologies Business (2014-2019)
      • 12.1.5 Samsung Electro-Mechanics Recent Development
    • 12.2 TSMC
      • 12.2.1 TSMC Company Details
      • 12.2.2 Company Description and Business Overview
      • 12.2.3 Wafer Level Packaging Technologies Introduction
      • 12.2.4 TSMC Revenue in Wafer Level Packaging Technologies Business (2014-2019)
      • 12.2.5 TSMC Recent Development
    • 12.3 Amkor Technology
      • 12.3.1 Amkor Technology Company Details
      • 12.3.2 Company Description and Business Overview
      • 12.3.3 Wafer Level Packaging Technologies Introduction
      • 12.3.4 Amkor Technology Revenue in Wafer Level Packaging Technologies Business (2014-2019)
      • 12.3.5 Amkor Technology Recent Development
    • 12.4 Orbotech
      • 12.4.1 Orbotech Company Details
      • 12.4.2 Company Description and Business Overview
      • 12.4.3 Wafer Level Packaging Technologies Introduction
      • 12.4.4 Orbotech Revenue in Wafer Level Packaging Technologies Business (2014-2019)
      • 12.4.5 Orbotech Recent Development
    • 12.5 Advanced Semiconductor Engineering
      • 12.5.1 Advanced Semiconductor Engineering Company Details
      • 12.5.2 Company Description and Business Overview
      • 12.5.3 Wafer Level Packaging Technologies Introduction
      • 12.5.4 Advanced Semiconductor Engineering Revenue in Wafer Level Packaging Technologies Business (2014-2019)
      • 12.5.5 Advanced Semiconductor Engineering Recent Development
    • 12.6 Deca Technologies
      • 12.6.1 Deca Technologies Company Details
      • 12.6.2 Company Description and Business Overview
      • 12.6.3 Wafer Level Packaging Technologies Introduction
      • 12.6.4 Deca Technologies Revenue in Wafer Level Packaging Technologies Business (2014-2019)
      • 12.6.5 Deca Technologies Recent Development
    • 12.7 STATS ChipPAC
      • 12.7.1 STATS ChipPAC Company Details
      • 12.7.2 Company Description and Business Overview
      • 12.7.3 Wafer Level Packaging Technologies Introduction
      • 12.7.4 STATS ChipPAC Revenue in Wafer Level Packaging Technologies Business (2014-2019)
      • 12.7.5 STATS ChipPAC Recent Development
    • 12.8 Nepes
      • 12.8.1 Nepes Company Details
      • 12.8.2 Company Description and Business Overview
      • 12.8.3 Wafer Level Packaging Technologies Introduction
      • 12.8.4 Nepes Revenue in Wafer Level Packaging Technologies Business (2014-2019)
      • 12.8.5 Nepes Recent Development

    13 Market Forecast 2019-2025

    • 13.1 Market Size Forecast by Regions
    • 13.2 United States
    • 13.3 Europe
    • 13.4 China
    • 13.5 Japan
    • 13.6 Southeast Asia
    • 13.7 India
    • 13.8 Central & South America
    • 13.9 Market Size Forecast by Product (2019-2025)
    • 13.10 Market Size Forecast by Application (2019-2025)

    14 Analyst's Viewpoints/Conclusions

      15 Appendix

      • 15.1 Research Methodology
        • 15.1.1 Methodology/Research Approach
          • 15.1.1.1 Research Programs/Design
          • 15.1.1.2 Market Size Estimation
          • 12.1.1.3 Market Breakdown and Data Triangulation
        • 15.1.2 Data Source
          • 15.1.2.1 Secondary Sources
          • 15.1.2.2 Primary Sources
      • 15.2 Disclaimer

      Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.
      In 2018, the global Wafer Level Packaging Technologies market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2019-2025.

      This report focuses on the global Wafer Level Packaging Technologies status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Wafer Level Packaging Technologies development in United States, Europe and China.

      The key players covered in this study
      Samsung Electro-Mechanics
      TSMC
      Amkor Technology
      Orbotech
      Advanced Semiconductor Engineering
      Deca Technologies
      STATS ChipPAC
      Nepes

      Market segment by Type, the product can be split into
      Fan-In Wafer-Level Packaging
      Fan-Out Wafer-Level Packaging

      Market segment by Application, split into
      CMOS Image Sensor
      Wireless Connectivity
      Logic and Memory IC
      MEMS and Sensor
      Analog and Mixed IC
      Others

      Market segment by Regions/Countries, this report covers
      United States
      Europe
      China
      Japan
      Southeast Asia
      India
      Central & South America

      The study objectives of this report are:
      To analyze global Wafer Level Packaging Technologies status, future forecast, growth opportunity, key market and key players.
      To present the Wafer Level Packaging Technologies development in United States, Europe and China.
      To strategically profile the key players and comprehensively analyze their development plan and strategies.
      To define, describe and forecast the market by product type, market and key regions.

      In this study, the years considered to estimate the market size of Wafer Level Packaging Technologies are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025
      For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

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