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Global Wafer Level Packaging Technologies Market Growth (Status and Outlook) 2019-2024

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Table of Contents

    2019-2024 Global Wafer Level Packaging Technologies Market Report (Status and Outlook)

      1 Scope of the Report

      • 1.1 Market Introduction
      • 1.2 Research Objectives
      • 1.3 Years Considered
      • 1.4 Market Research Methodology
      • 1.5 Economic Indicators
      • 1.6 Currency Considered

      2 Executive Summary

      • 2.1 World Market Overview
        • 2.1.1 Global Wafer Level Packaging Technologies Market Size 2014-2024
        • 2.1.2 Wafer Level Packaging Technologies Market Size CAGR by Region
      • 2.2 Wafer Level Packaging Technologies Segment by Type
        • 2.2.1 Fan-In Wafer-Level Packaging
        • 2.2.2 Fan-Out Wafer-Level Packaging
      • 2.3 Wafer Level Packaging Technologies Market Size by Type
        • 2.3.1 Global Wafer Level Packaging Technologies Market Size Market Share by Type (2014-2019)
        • 2.3.2 Global Wafer Level Packaging Technologies Market Size Growth Rate by Type (2014-2019)
      • 2.4 Wafer Level Packaging Technologies Segment by Application
        • 2.4.1 CMOS Image Sensor
        • 2.4.2 Wireless Connectivity
        • 2.4.3 Logic and Memory IC
        • 2.4.4 MEMS and Sensor
        • 2.4.5 Analog and Mixed IC
        • 2.4.6 Others
      • 2.5 Wafer Level Packaging Technologies Market Size by Application
        • 2.5.1 Global Wafer Level Packaging Technologies Market Size Market Share by Application (2014-2019)
        • 2.5.2 Global Wafer Level Packaging Technologies Market Size Growth Rate by Application (2014-2019)

      3 Global Wafer Level Packaging Technologies by Players

      • 3.1 Global Wafer Level Packaging Technologies Market Size Market Share by Players
        • 3.1.1 Global Wafer Level Packaging Technologies Market Size by Players (2017-2019)
        • 3.1.2 Global Wafer Level Packaging Technologies Market Size Market Share by Players (2017-2019)
      • 3.2 Global Wafer Level Packaging Technologies Key Players Head office and Products Offered
      • 3.3 Market Concentration Rate Analysis
        • 3.3.1 Competition Landscape Analysis
        • 3.3.2 Concentration Ratio (CR3, CR5 and CR10) (2017-2019)
      • 3.4 New Products and Potential Entrants
      • 3.5 Mergers & Acquisitions, Expansion

      4 Wafer Level Packaging Technologies by Regions

      • 4.1 Wafer Level Packaging Technologies Market Size by Regions
      • 4.2 Americas Wafer Level Packaging Technologies Market Size Growth
      • 4.3 APAC Wafer Level Packaging Technologies Market Size Growth
      • 4.4 Europe Wafer Level Packaging Technologies Market Size Growth
      • 4.5 Middle East & Africa Wafer Level Packaging Technologies Market Size Growth

      5 Americas

      • 5.1 Americas Wafer Level Packaging Technologies Market Size by Countries
      • 5.2 Americas Wafer Level Packaging Technologies Market Size by Type
      • 5.3 Americas Wafer Level Packaging Technologies Market Size by Application
      • 5.4 United States
      • 5.5 Canada
      • 5.6 Mexico
      • 5.7 Key Economic Indicators of Few Americas Countries

      6 APAC

      • 6.1 APAC Wafer Level Packaging Technologies Market Size by Countries
      • 6.2 APAC Wafer Level Packaging Technologies Market Size by Type
      • 6.3 APAC Wafer Level Packaging Technologies Market Size by Application
      • 6.4 China
      • 6.5 Japan
      • 6.6 Korea
      • 6.7 Southeast Asia
      • 6.8 India
      • 6.9 Australia
      • 6.10 Key Economic Indicators of Few APAC Countries

      7 Europe

      • 7.1 Europe Wafer Level Packaging Technologies by Countries
      • 7.2 Europe Wafer Level Packaging Technologies Market Size by Type
      • 7.3 Europe Wafer Level Packaging Technologies Market Size by Application
      • 7.4 Germany
      • 7.5 France
      • 7.6 UK
      • 7.7 Italy
      • 7.8 Russia
      • 7.9 Spain
      • 7.10 Key Economic Indicators of Few Europe Countries

      8 Middle East & Africa

      • 8.1 Middle East & Africa Wafer Level Packaging Technologies by Countries
      • 8.2 Middle East & Africa Wafer Level Packaging Technologies Market Size by Type
      • 8.3 Middle East & Africa Wafer Level Packaging Technologies Market Size by Application
      • 8.4 Egypt
      • 8.5 South Africa
      • 8.6 Israel
      • 8.7 Turkey
      • 8.8 GCC Countries

      9 Market Drivers, Challenges and Trends

      • 9.1 Market Drivers and Impact
        • 9.1.1 Growing Demand from Key Regions
        • 9.1.2 Growing Demand from Key Applications and Potential Industries
      • 9.2 Market Challenges and Impact
      • 9.3 Market Trends

      10 Global Wafer Level Packaging Technologies Market Forecast

      • 10.1 Global Wafer Level Packaging Technologies Market Size Forecast (2019-2024)
      • 10.2 Global Wafer Level Packaging Technologies Forecast by Regions
        • 10.2.1 Global Wafer Level Packaging Technologies Forecast by Regions (2019-2024)
        • 10.2.2 Americas Market Forecast
        • 10.2.3 APAC Market Forecast
        • 10.2.4 Europe Market Forecast
        • 10.2.5 Middle East & Africa Market Forecast
      • 10.3 Americas Forecast by Countries
        • 10.3.1 United States Market Forecast
        • 10.3.2 Canada Market Forecast
        • 10.3.3 Mexico Market Forecast
        • 10.3.4 Brazil Market Forecast
      • 10.4 APAC Forecast by Countries
        • 10.4.1 China Market Forecast
        • 10.4.2 Japan Market Forecast
        • 10.4.3 Korea Market Forecast
        • 10.4.4 Southeast Asia Market Forecast
        • 10.4.5 India Market Forecast
        • 10.4.6 Australia Market Forecast
      • 10.5 Europe Forecast by Countries
        • 10.5.1 Germany Market Forecast
        • 10.5.2 France Market Forecast
        • 10.5.3 UK Market Forecast
        • 10.5.4 Italy Market Forecast
        • 10.5.5 Russia Market Forecast
        • 10.5.6 Spain Market Forecast
      • 10.6 Middle East & Africa Forecast by Countries
        • 10.6.1 Egypt Market Forecast
        • 10.6.2 South Africa Market Forecast
        • 10.6.3 Israel Market Forecast
        • 10.6.4 Turkey Market Forecast
        • 10.6.5 GCC Countries Market Forecast
      • 10.7 Global Wafer Level Packaging Technologies Forecast by Type
      • 10.8 Global Wafer Level Packaging Technologies Forecast by Application

      11 Key Players Analysis

      • 11.1 Samsung Electro-Mechanics
        • 11.1.1 Company Details
        • 11.1.2 Wafer Level Packaging Technologies Product Offered
        • 11.1.3 Samsung Electro-Mechanics Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2019)
        • 11.1.4 Main Business Overview
        • 11.1.5 Samsung Electro-Mechanics News
      • 11.2 TSMC
        • 11.2.1 Company Details
        • 11.2.2 Wafer Level Packaging Technologies Product Offered
        • 11.2.3 TSMC Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2019)
        • 11.2.4 Main Business Overview
        • 11.2.5 TSMC News
      • 11.3 Amkor Technology
        • 11.3.1 Company Details
        • 11.3.2 Wafer Level Packaging Technologies Product Offered
        • 11.3.3 Amkor Technology Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2019)
        • 11.3.4 Main Business Overview
        • 11.3.5 Amkor Technology News
      • 11.4 Orbotech
        • 11.4.1 Company Details
        • 11.4.2 Wafer Level Packaging Technologies Product Offered
        • 11.4.3 Orbotech Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2019)
        • 11.4.4 Main Business Overview
        • 11.4.5 Orbotech News
      • 11.5 Advanced Semiconductor Engineering
        • 11.5.1 Company Details
        • 11.5.2 Wafer Level Packaging Technologies Product Offered
        • 11.5.3 Advanced Semiconductor Engineering Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2019)
        • 11.5.4 Main Business Overview
        • 11.5.5 Advanced Semiconductor Engineering News
      • 11.6 Deca Technologies
        • 11.6.1 Company Details
        • 11.6.2 Wafer Level Packaging Technologies Product Offered
        • 11.6.3 Deca Technologies Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2019)
        • 11.6.4 Main Business Overview
        • 11.6.5 Deca Technologies News
      • 11.7 STATS ChipPAC
        • 11.7.1 Company Details
        • 11.7.2 Wafer Level Packaging Technologies Product Offered
        • 11.7.3 STATS ChipPAC Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2019)
        • 11.7.4 Main Business Overview
        • 11.7.5 STATS ChipPAC News
      • 11.8 Nepes
        • 11.8.1 Company Details
        • 11.8.2 Wafer Level Packaging Technologies Product Offered
        • 11.8.3 Nepes Wafer Level Packaging Technologies Revenue, Gross Margin and Market Share (2017-2019)
        • 11.8.4 Main Business Overview
        • 11.8.5 Nepes News

      12 Research Findings and Conclusion

      Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.

      According to this study, over the next five years the Wafer Level Packaging Technologies market will register a xx% CAGR in terms of revenue, the global market size will reach US$ xx million by 2024, from US$ xx million in 2019. In particular, this report presents the global revenue market share of key companies in Wafer Level Packaging Technologies business, shared in Chapter 3.

      This report presents a comprehensive overview, market shares and growth opportunities of Wafer Level Packaging Technologies market by product type, application, key companies and key regions.

      This study considers the Wafer Level Packaging Technologies value generated from the sales of the following segments:

      Segmentation by product type: breakdown data from 2014 to 2019 in Section 2.3; and forecast to 2024 in section 10.7.
      Fan-In Wafer-Level Packaging
      Fan-Out Wafer-Level Packaging
      Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 10.8.
      CMOS Image Sensor
      Wireless Connectivity
      Logic and Memory IC
      MEMS and Sensor
      Analog and Mixed IC
      Others

      This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
      Americas
      United States
      Canada
      Mexico
      Brazil
      APAC
      China
      Japan
      Korea
      Southeast Asia
      India
      Australia
      Europe
      Germany
      France
      UK
      Italy
      Russia
      Spain
      Middle East & Africa
      Egypt
      South Africa
      Israel
      Turkey
      GCC Countries

      The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
      Samsung Electro-Mechanics
      TSMC
      Amkor Technology
      Orbotech
      Advanced Semiconductor Engineering
      Deca Technologies
      STATS ChipPAC
      Nepes

      In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key players and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.

      Research objectives
      To study and analyze the global Wafer Level Packaging Technologies market size by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
      To understand the structure of Wafer Level Packaging Technologies market by identifying its various subsegments.
      Focuses on the key global Wafer Level Packaging Technologies players, to define, describe and analyze the value, market share, market competition landscape, SWOT analysis and development plans in next few years.
      To analyze the Wafer Level Packaging Technologies with respect to individual growth trends, future prospects, and their contribution to the total market.
      To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
      To project the size of Wafer Level Packaging Technologies submarkets, with respect to key regions (along with their respective key countries).
      To analyze competitive developments such as expansions, agreements, new product launches and acquisitions in the market.
      To strategically profile the key players and comprehensively analyze their growth strategies.

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