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Global Wafer Level Packaging Market Professional Survey Report 2019

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Table of Contents

    Executive Summary

      1 Industry Overview of Wafer Level Packaging

      • 1.1 Definition of Wafer Level Packaging
      • 1.2 Wafer Level Packaging Segment by Type
        • 1.2.1 Global Wafer Level Packaging Production Growth Rate Comparison by Types (2014-2025)
        • 1.2.2 3D TSV WLP
        • 1.2.3 2.5D TSV WLP
        • 1.2.4 WLCSP
        • 1.2.5 Nano WLP
        • 1.2.6 Others ( 2D TSV WLP and Compliant WLP)
      • 1.3 Wafer Level Packaging Segment by Applications
        • 1.3.1 Global Wafer Level Packaging Consumption Comparison by Applications (2014-2025)
        • 1.3.2 Electronics
        • 1.3.3 IT & Telecommunication
        • 1.3.4 Industrial
        • 1.3.5 Automotive
        • 1.3.6 Aerospace & Defense
        • 1.3.7 Healthcare
        • 1.3.8 Others (Media & Entertainment and Non-Conventional Energy Resources)
      • 1.4 Global Wafer Level Packaging Overall Market
        • 1.4.1 Global Wafer Level Packaging Revenue (2014-2025)
        • 1.4.2 Global Wafer Level Packaging Production (2014-2025)
        • 1.4.3 North America Wafer Level Packaging Status and Prospect (2014-2025)
        • 1.4.4 Europe Wafer Level Packaging Status and Prospect (2014-2025)
        • 1.4.5 China Wafer Level Packaging Status and Prospect (2014-2025)
        • 1.4.6 Japan Wafer Level Packaging Status and Prospect (2014-2025)
        • 1.4.7 Southeast Asia Wafer Level Packaging Status and Prospect (2014-2025)
        • 1.4.8 India Wafer Level Packaging Status and Prospect (2014-2025)

      2 Manufacturing Cost Structure Analysis

      • 2.1 Raw Material and Suppliers
      • 2.2 Manufacturing Cost Structure Analysis of Wafer Level Packaging
      • 2.3 Manufacturing Process Analysis of Wafer Level Packaging
      • 2.4 Industry Chain Structure of Wafer Level Packaging

      3 Development and Manufacturing Plants Analysis of Wafer Level Packaging

      • 3.1 Capacity and Commercial Production Date
      • 3.2 Global Wafer Level Packaging Manufacturing Plants Distribution
      • 3.3 Major Manufacturers Technology Source and Market Position of Wafer Level Packaging
      • 3.4 Recent Development and Expansion Plans

      4 Key Figures of Major Manufacturers

      • 4.1 Wafer Level Packaging Production and Capacity Analysis
      • 4.2 Wafer Level Packaging Revenue Analysis
      • 4.3 Wafer Level Packaging Price Analysis
      • 4.4 Market Concentration Degree

      5 Wafer Level Packaging Regional Market Analysis

      • 5.1 Wafer Level Packaging Production by Regions
        • 5.1.1 Global Wafer Level Packaging Production by Regions
        • 5.1.2 Global Wafer Level Packaging Revenue by Regions
      • 5.2 Wafer Level Packaging Consumption by Regions
      • 5.3 North America Wafer Level Packaging Market Analysis
        • 5.3.1 North America Wafer Level Packaging Production
        • 5.3.2 North America Wafer Level Packaging Revenue
        • 5.3.3 Key Manufacturers in North America
        • 5.3.4 North America Wafer Level Packaging Import and Export
      • 5.4 Europe Wafer Level Packaging Market Analysis
        • 5.4.1 Europe Wafer Level Packaging Production
        • 5.4.2 Europe Wafer Level Packaging Revenue
        • 5.4.3 Key Manufacturers in Europe
        • 5.4.4 Europe Wafer Level Packaging Import and Export
      • 5.5 China Wafer Level Packaging Market Analysis
        • 5.5.1 China Wafer Level Packaging Production
        • 5.5.2 China Wafer Level Packaging Revenue
        • 5.5.3 Key Manufacturers in China
        • 5.5.4 China Wafer Level Packaging Import and Export
      • 5.6 Japan Wafer Level Packaging Market Analysis
        • 5.6.1 Japan Wafer Level Packaging Production
        • 5.6.2 Japan Wafer Level Packaging Revenue
        • 5.6.3 Key Manufacturers in Japan
        • 5.6.4 Japan Wafer Level Packaging Import and Export
      • 5.7 Southeast Asia Wafer Level Packaging Market Analysis
        • 5.7.1 Southeast Asia Wafer Level Packaging Production
        • 5.7.2 Southeast Asia Wafer Level Packaging Revenue
        • 5.7.3 Key Manufacturers in Southeast Asia
        • 5.7.4 Southeast Asia Wafer Level Packaging Import and Export
      • 5.8 India Wafer Level Packaging Market Analysis
        • 5.8.1 India Wafer Level Packaging Production
        • 5.8.2 India Wafer Level Packaging Revenue
        • 5.8.3 Key Manufacturers in India
        • 5.8.4 India Wafer Level Packaging Import and Export

      6 Wafer Level Packaging Segment Market Analysis (by Type)

      • 6.1 Global Wafer Level Packaging Production by Type
      • 6.2 Global Wafer Level Packaging Revenue by Type
      • 6.3 Wafer Level Packaging Price by Type

      7 Wafer Level Packaging Segment Market Analysis (by Application)

      • 7.1 Global Wafer Level Packaging Consumption by Application
      • 7.2 Global Wafer Level Packaging Consumption Market Share by Application (2014-2019)

      8 Wafer Level Packaging Major Manufacturers Analysis

      • 8.1 Amkor Technology Inc
        • 8.1.1 Amkor Technology Inc Wafer Level Packaging Production Sites and Area Served
        • 8.1.2 Amkor Technology Inc Product Introduction, Application and Specification
        • 8.1.3 Amkor Technology Inc Wafer Level Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.1.4 Main Business and Markets Served
      • 8.2 Fujitsu Ltd
        • 8.2.1 Fujitsu Ltd Wafer Level Packaging Production Sites and Area Served
        • 8.2.2 Fujitsu Ltd Product Introduction, Application and Specification
        • 8.2.3 Fujitsu Ltd Wafer Level Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.2.4 Main Business and Markets Served
      • 8.3 Jiangsu Changjiang Electronics
        • 8.3.1 Jiangsu Changjiang Electronics Wafer Level Packaging Production Sites and Area Served
        • 8.3.2 Jiangsu Changjiang Electronics Product Introduction, Application and Specification
        • 8.3.3 Jiangsu Changjiang Electronics Wafer Level Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.3.4 Main Business and Markets Served
      • 8.4 Deca Technologies
        • 8.4.1 Deca Technologies Wafer Level Packaging Production Sites and Area Served
        • 8.4.2 Deca Technologies Product Introduction, Application and Specification
        • 8.4.3 Deca Technologies Wafer Level Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.4.4 Main Business and Markets Served
      • 8.5 Qualcomm Inc
        • 8.5.1 Qualcomm Inc Wafer Level Packaging Production Sites and Area Served
        • 8.5.2 Qualcomm Inc Product Introduction, Application and Specification
        • 8.5.3 Qualcomm Inc Wafer Level Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.5.4 Main Business and Markets Served
      • 8.6 Toshiba Corp
        • 8.6.1 Toshiba Corp Wafer Level Packaging Production Sites and Area Served
        • 8.6.2 Toshiba Corp Product Introduction, Application and Specification
        • 8.6.3 Toshiba Corp Wafer Level Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.6.4 Main Business and Markets Served
      • 8.7 Tokyo Electron Ltd
        • 8.7.1 Tokyo Electron Ltd Wafer Level Packaging Production Sites and Area Served
        • 8.7.2 Tokyo Electron Ltd Product Introduction, Application and Specification
        • 8.7.3 Tokyo Electron Ltd Wafer Level Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.7.4 Main Business and Markets Served
      • 8.8 Applied Materials, Inc
        • 8.8.1 Applied Materials, Inc Wafer Level Packaging Production Sites and Area Served
        • 8.8.2 Applied Materials, Inc Product Introduction, Application and Specification
        • 8.8.3 Applied Materials, Inc Wafer Level Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.8.4 Main Business and Markets Served
      • 8.9 ASML Holding NV
        • 8.9.1 ASML Holding NV Wafer Level Packaging Production Sites and Area Served
        • 8.9.2 ASML Holding NV Product Introduction, Application and Specification
        • 8.9.3 ASML Holding NV Wafer Level Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.9.4 Main Business and Markets Served
      • 8.10 Lam Research Corp
        • 8.10.1 Lam Research Corp Wafer Level Packaging Production Sites and Area Served
        • 8.10.2 Lam Research Corp Product Introduction, Application and Specification
        • 8.10.3 Lam Research Corp Wafer Level Packaging Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.10.4 Main Business and Markets Served
      • 8.11 KLA-Tencor Corration
      • 8.12 China Wafer Level CSP Co. Ltd
      • 8.13 Marvell Technology Group Ltd
      • 8.14 Siliconware Precision Industries
      • 8.15 Nanium SA
      • 8.16 STATS Chip
      • 8.17 PAC Ltd

      9 Development Trend of Analysis of Wafer Level Packaging Market

      • 9.1 Global Wafer Level Packaging Market Trend Analysis
        • 9.1.1 Global Wafer Level Packaging Market Size (Volume and Value) Forecast 2019-2025
      • 9.2 Wafer Level Packaging Regional Market Trend
        • 9.2.1 North America Wafer Level Packaging Forecast 2019-2025
        • 9.2.2 Europe Wafer Level Packaging Forecast 2019-2025
        • 9.2.3 China Wafer Level Packaging Forecast 2019-2025
        • 9.2.4 Japan Wafer Level Packaging Forecast 2019-2025
        • 9.2.5 Southeast Asia Wafer Level Packaging Forecast 2019-2025
        • 9.2.6 India Wafer Level Packaging Forecast 2019-2025
      • 9.3 Wafer Level Packaging Market Trend (Product Type)
      • 9.4 Wafer Level Packaging Market Trend (Application)
      • 10.1 Marketing Channel
        • 10.1.1 Direct Marketing
        • 10.1.2 Indirect Marketing
      • 10.3 Wafer Level Packaging Customers

      11 Market Dynamics

      • 11.1 Market Trends
      • 11.2 Opportunities
      • 11.3 Market Drivers
      • 11.4 Challenges
      • 11.5 Influence Factors

      12 Conclusion

        13 Appendix

        • 13.1 Methodology/Research Approach
          • 13.1.1 Research Programs/Design
          • 13.1.2 Market Size Estimation
          • 13.1.3 Market Breakdown and Data Triangulation
        • 13.2 Data Source
          • 13.2.1 Secondary Sources
          • 13.2.2 Primary Sources
        • 13.3 Author List

        Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.[1] Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.

        Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing.

        There is no single industry-standard method of wafer-level packaging at present.

        A major application area of WLPs are smartphones due to the size constraints.

        The global Wafer Level Packaging market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
        This report focuses on Wafer Level Packaging volume and value at global level, regional level and company level. From a global perspective, this report represents overall Wafer Level Packaging market size by analyzing historical data and future prospect.
        Regionally, this report categorizes the production, apparent consumption, export and import of Wafer Level Packaging in North America, Europe, China, Japan, Southeast Asia and India.
        For each manufacturer covered, this report analyzes their Wafer Level Packaging manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

        The following manufacturers are covered:
        Amkor Technology Inc
        Fujitsu Ltd
        Jiangsu Changjiang Electronics
        Deca Technologies
        Qualcomm Inc
        Toshiba Corp
        Tokyo Electron Ltd
        Applied Materials, Inc
        ASML Holding NV
        Lam Research Corp
        KLA-Tencor Corration
        China Wafer Level CSP Co. Ltd
        Marvell Technology Group Ltd
        Siliconware Precision Industries
        Nanium SA
        STATS Chip
        PAC Ltd

        Segment by Regions
        North America
        Europe
        China
        Japan
        Southeast Asia
        India

        Segment by Type
        3D TSV WLP
        2.5D TSV WLP
        WLCSP
        Nano WLP
        Others ( 2D TSV WLP and Compliant WLP)

        Segment by Application
        Electronics
        IT & Telecommunication
        Industrial
        Automotive
        Aerospace & Defense
        Healthcare
        Others (Media & Entertainment and Non-Conventional Energy Resources)

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