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Global Wafer Grinding Machine Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

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1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Wafer Grinding Machine Consumption Value by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 Semi-automatic
    • 1.3.3 Full-automatic
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Wafer Grinding Machine Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 200mm Wafer
    • 1.4.3 300mm Wafer
    • 1.4.4 Others
  • 1.5 Global Wafer Grinding Machine Market Size & Forecast
    • 1.5.1 Global Wafer Grinding Machine Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global Wafer Grinding Machine Sales Quantity (2020-2031)
    • 1.5.3 Global Wafer Grinding Machine Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 Disco
    • 2.1.1 Disco Details
    • 2.1.2 Disco Major Business
    • 2.1.3 Disco Wafer Grinding Machine Product and Services
    • 2.1.4 Disco Wafer Grinding Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 Disco Recent Developments/Updates
  • 2.2 TOKYO SEIMITSU
    • 2.2.1 TOKYO SEIMITSU Details
    • 2.2.2 TOKYO SEIMITSU Major Business
    • 2.2.3 TOKYO SEIMITSU Wafer Grinding Machine Product and Services
    • 2.2.4 TOKYO SEIMITSU Wafer Grinding Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 TOKYO SEIMITSU Recent Developments/Updates
  • 2.3 G&N
    • 2.3.1 G&N Details
    • 2.3.2 G&N Major Business
    • 2.3.3 G&N Wafer Grinding Machine Product and Services
    • 2.3.4 G&N Wafer Grinding Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 G&N Recent Developments/Updates
  • 2.4 Okamoto Semiconductor Equipment Division
    • 2.4.1 Okamoto Semiconductor Equipment Division Details
    • 2.4.2 Okamoto Semiconductor Equipment Division Major Business
    • 2.4.3 Okamoto Semiconductor Equipment Division Wafer Grinding Machine Product and Services
    • 2.4.4 Okamoto Semiconductor Equipment Division Wafer Grinding Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates
  • 2.5 CETC
    • 2.5.1 CETC Details
    • 2.5.2 CETC Major Business
    • 2.5.3 CETC Wafer Grinding Machine Product and Services
    • 2.5.4 CETC Wafer Grinding Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 CETC Recent Developments/Updates
  • 2.6 Koyo Machinery
    • 2.6.1 Koyo Machinery Details
    • 2.6.2 Koyo Machinery Major Business
    • 2.6.3 Koyo Machinery Wafer Grinding Machine Product and Services
    • 2.6.4 Koyo Machinery Wafer Grinding Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 Koyo Machinery Recent Developments/Updates
  • 2.7 Revasum
    • 2.7.1 Revasum Details
    • 2.7.2 Revasum Major Business
    • 2.7.3 Revasum Wafer Grinding Machine Product and Services
    • 2.7.4 Revasum Wafer Grinding Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 Revasum Recent Developments/Updates
  • 2.8 WAIDA MFG
    • 2.8.1 WAIDA MFG Details
    • 2.8.2 WAIDA MFG Major Business
    • 2.8.3 WAIDA MFG Wafer Grinding Machine Product and Services
    • 2.8.4 WAIDA MFG Wafer Grinding Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 WAIDA MFG Recent Developments/Updates
  • 2.9 Hunan Yujing Machine Industrial
    • 2.9.1 Hunan Yujing Machine Industrial Details
    • 2.9.2 Hunan Yujing Machine Industrial Major Business
    • 2.9.3 Hunan Yujing Machine Industrial Wafer Grinding Machine Product and Services
    • 2.9.4 Hunan Yujing Machine Industrial Wafer Grinding Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 Hunan Yujing Machine Industrial Recent Developments/Updates
  • 2.10 SpeedFam
    • 2.10.1 SpeedFam Details
    • 2.10.2 SpeedFam Major Business
    • 2.10.3 SpeedFam Wafer Grinding Machine Product and Services
    • 2.10.4 SpeedFam Wafer Grinding Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 SpeedFam Recent Developments/Updates
  • 2.11 TSD
    • 2.11.1 TSD Details
    • 2.11.2 TSD Major Business
    • 2.11.3 TSD Wafer Grinding Machine Product and Services
    • 2.11.4 TSD Wafer Grinding Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.11.5 TSD Recent Developments/Updates
  • 2.12 Engis Corporation
    • 2.12.1 Engis Corporation Details
    • 2.12.2 Engis Corporation Major Business
    • 2.12.3 Engis Corporation Wafer Grinding Machine Product and Services
    • 2.12.4 Engis Corporation Wafer Grinding Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.12.5 Engis Corporation Recent Developments/Updates
  • 2.13 NTS
    • 2.13.1 NTS Details
    • 2.13.2 NTS Major Business
    • 2.13.3 NTS Wafer Grinding Machine Product and Services
    • 2.13.4 NTS Wafer Grinding Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.13.5 NTS Recent Developments/Updates

3 Competitive Environment: Wafer Grinding Machine by Manufacturer

  • 3.1 Global Wafer Grinding Machine Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global Wafer Grinding Machine Revenue by Manufacturer (2020-2025)
  • 3.3 Global Wafer Grinding Machine Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of Wafer Grinding Machine by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 Wafer Grinding Machine Manufacturer Market Share in 2024
    • 3.4.3 Top 6 Wafer Grinding Machine Manufacturer Market Share in 2024
  • 3.5 Wafer Grinding Machine Market: Overall Company Footprint Analysis
    • 3.5.1 Wafer Grinding Machine Market: Region Footprint
    • 3.5.2 Wafer Grinding Machine Market: Company Product Type Footprint
    • 3.5.3 Wafer Grinding Machine Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Wafer Grinding Machine Market Size by Region
    • 4.1.1 Global Wafer Grinding Machine Sales Quantity by Region (2020-2031)
    • 4.1.2 Global Wafer Grinding Machine Consumption Value by Region (2020-2031)
    • 4.1.3 Global Wafer Grinding Machine Average Price by Region (2020-2031)
  • 4.2 North America Wafer Grinding Machine Consumption Value (2020-2031)
  • 4.3 Europe Wafer Grinding Machine Consumption Value (2020-2031)
  • 4.4 Asia-Pacific Wafer Grinding Machine Consumption Value (2020-2031)
  • 4.5 South America Wafer Grinding Machine Consumption Value (2020-2031)
  • 4.6 Middle East & Africa Wafer Grinding Machine Consumption Value (2020-2031)

5 Market Segment by Type

  • 5.1 Global Wafer Grinding Machine Sales Quantity by Type (2020-2031)
  • 5.2 Global Wafer Grinding Machine Consumption Value by Type (2020-2031)
  • 5.3 Global Wafer Grinding Machine Average Price by Type (2020-2031)

6 Market Segment by Application

  • 6.1 Global Wafer Grinding Machine Sales Quantity by Application (2020-2031)
  • 6.2 Global Wafer Grinding Machine Consumption Value by Application (2020-2031)
  • 6.3 Global Wafer Grinding Machine Average Price by Application (2020-2031)

7 North America

  • 7.1 North America Wafer Grinding Machine Sales Quantity by Type (2020-2031)
  • 7.2 North America Wafer Grinding Machine Sales Quantity by Application (2020-2031)
  • 7.3 North America Wafer Grinding Machine Market Size by Country
    • 7.3.1 North America Wafer Grinding Machine Sales Quantity by Country (2020-2031)
    • 7.3.2 North America Wafer Grinding Machine Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe Wafer Grinding Machine Sales Quantity by Type (2020-2031)
  • 8.2 Europe Wafer Grinding Machine Sales Quantity by Application (2020-2031)
  • 8.3 Europe Wafer Grinding Machine Market Size by Country
    • 8.3.1 Europe Wafer Grinding Machine Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe Wafer Grinding Machine Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific Wafer Grinding Machine Sales Quantity by Type (2020-2031)
  • 9.2 Asia-Pacific Wafer Grinding Machine Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific Wafer Grinding Machine Market Size by Region
    • 9.3.1 Asia-Pacific Wafer Grinding Machine Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific Wafer Grinding Machine Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America Wafer Grinding Machine Sales Quantity by Type (2020-2031)
  • 10.2 South America Wafer Grinding Machine Sales Quantity by Application (2020-2031)
  • 10.3 South America Wafer Grinding Machine Market Size by Country
    • 10.3.1 South America Wafer Grinding Machine Sales Quantity by Country (2020-2031)
    • 10.3.2 South America Wafer Grinding Machine Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa Wafer Grinding Machine Sales Quantity by Type (2020-2031)
  • 11.2 Middle East & Africa Wafer Grinding Machine Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa Wafer Grinding Machine Market Size by Country
    • 11.3.1 Middle East & Africa Wafer Grinding Machine Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa Wafer Grinding Machine Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 Wafer Grinding Machine Market Drivers
  • 12.2 Wafer Grinding Machine Market Restraints
  • 12.3 Wafer Grinding Machine Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Wafer Grinding Machine and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Wafer Grinding Machine
  • 13.3 Wafer Grinding Machine Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Wafer Grinding Machine Typical Distributors
  • 14.3 Wafer Grinding Machine Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global Wafer Grinding Machine market size was valued at US$ 1072 million in 2024 and is forecast to a readjusted size of USD 1732 million by 2031 with a CAGR of 6.9% during review period.
    Wafer Grinding Machine can reduce the size of the wafer in the production of integrated circuits, and make the wafer meet the requirements of more complex integrated circuits. The wafer substrate is thinned by thinning / lapping to improve the heat dissipation effect of the chip, which is also conducive to the later packaging process.
    The Wafer Grinding Machines market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe. Wafer Grinding Machines are integral in wafer thinning processes, where the primary applications include the processing of 200mm and 300mm wafers. Among the various types of Wafer Grinding Machines, the fully automatic Wafer Grinding Machines dominate the market, they have higher automation levels, allowing for increased efficiency and precision, accounting for approximately 52% of the global market share. The most significant application market is for 300mm wafers, which accounts for 83% of the global demand, primarily driven by the advanced semiconductor manufacturing processes that require thinner wafers with high precision. Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.
    Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Wafer Grinding Machine and related services. The top five players account for about 90% of the revenue market in 2024.
    Opportunities in the Wafer Grinding Machine Market:
    Several opportunities exist for companies involved in the Wafer Grinding Machine market:
    Expansion of Semiconductor Manufacturing in APAC: The APAC region remains the largest consumer of wafer grinding equipment, and with countries like China, Japan, South Korea, and Taiwan increasing their semiconductor manufacturing capabilities, this trend is expected to continue. The demand for Wafer Grinding Machines in this region will remain high, offering significant growth opportunities for suppliers.
    Advancements in Wafer Grinding Technologies: Technological advancements in wafer grinding equipment, such as the integration of artificial intelligence (AI) for predictive maintenance or process optimization, will create new opportunities in the market. Manufacturers who can innovate to improve the efficiency, accuracy, and cost-effectiveness of Wafer Grinding Machines will be well-positioned to capture additional market share.
    Rise of Emerging Markets: Emerging markets, particularly in regions like Southeast Asia, Latin America, and the Middle East, are seeing increased semiconductor production. As these regions continue to expand their manufacturing capabilities, the demand for wafer thinning equipment will grow. This provides an opportunity for companies to tap into new and developing markets.
    Conclusion:
    The Wafer Grinding Machine market is poised for significant growth, driven by advancements in semiconductor manufacturing, the increasing demand for thinner and more precise wafers, and the rise in 300mm wafer processing. Fully automatic Wafer Grinding Machines, which dominate the market with a 52% share, will continue to lead the market due to their higher efficiency and precision.
    The APAC region remains the largest consumer of Wafer Grinding Machines, accounting for 78% of the global market. However, despite these strong growth drivers, challenges such as high initial investment costs and technological complexity may pose barriers to market entry for smaller players. Manufacturers will need to innovate and focus on automation, precision, and cost-effective solutions to capitalize on the growing demand for wafer thinning equipment.
    In conclusion, the Wafer Grinding Machine market offers abundant opportunities for companies that can provide high-quality, efficient, and cost-effective wafer grinding solutions, particularly those that address the increasing demand for 300mm wafers and advanced semiconductor manufacturing processes.
    This report is a detailed and comprehensive analysis for global Wafer Grinding Machine market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
    Key Features:
    Global Wafer Grinding Machine market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
    Global Wafer Grinding Machine market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
    Global Wafer Grinding Machine market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
    Global Wafer Grinding Machine market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
    The Primary Objectives in This Report Are:
    To determine the size of the total market opportunity of global and key countries
    To assess the growth potential for Wafer Grinding Machine
    To forecast future growth in each product and end-use market
    To assess competitive factors affecting the marketplace
    This report profiles key players in the global Wafer Grinding Machine market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, etc.
    This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
    Market Segmentation
    Wafer Grinding Machine market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
    Market segment by Type
    Semi-automatic
    Full-automatic
    Market segment by Application
    200mm Wafer
    300mm Wafer
    Others
    Major players covered
    Disco
    TOKYO SEIMITSU
    G&N
    Okamoto Semiconductor Equipment Division
    CETC
    Koyo Machinery
    Revasum
    WAIDA MFG
    Hunan Yujing Machine Industrial
    SpeedFam
    TSD
    Engis Corporation
    NTS
    Market segment by region, regional analysis covers
    North America (United States, Canada, and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 15 chapters:
    Chapter 1, to describe Wafer Grinding Machine product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top manufacturers of Wafer Grinding Machine, with price, sales quantity, revenue, and global market share of Wafer Grinding Machine from 2020 to 2025.
    Chapter 3, the Wafer Grinding Machine competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
    Chapter 4, the Wafer Grinding Machine breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
    Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
    Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Grinding Machine market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
    Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
    Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Grinding Machine.
    Chapter 14 and 15, to describe Wafer Grinding Machine sales channel, distributors, customers, research findings and conclusion.

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