Copyright Reports & Markets. All rights reserved.

Global (United States, European Union and China) Wafer Grinding Equipment Market Research Report 2019-2025

Request for Sample of this report
Buy now

Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global Wafer Grinding Equipment Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 Wafer Edge Grinder
      • 1.3.3 Wafer Surface Grinder
    • 1.4 Market Segment by Application
      • 1.4.1 Global Wafer Grinding Equipment Market Share by Application (2019-2025)
      • 1.4.2 Semiconductor
      • 1.4.3 Photovoltaic
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global Wafer Grinding Equipment Production Value 2014-2025
      • 2.1.2 Global Wafer Grinding Equipment Production 2014-2025
      • 2.1.3 Global Wafer Grinding Equipment Capacity 2014-2025
      • 2.1.4 Global Wafer Grinding Equipment Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global Wafer Grinding Equipment Market Size CAGR of Key Regions
      • 2.2.2 Global Wafer Grinding Equipment Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global Wafer Grinding Equipment Capacity by Manufacturers
      • 3.1.2 Global Wafer Grinding Equipment Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 Wafer Grinding Equipment Revenue by Manufacturers (2014-2019)
      • 3.2.2 Wafer Grinding Equipment Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global Wafer Grinding Equipment Market Concentration Ratio (CR5 and HHI)
    • 3.3 Wafer Grinding Equipment Price by Manufacturers
    • 3.4 Key Manufacturers Wafer Grinding Equipment Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into Wafer Grinding Equipment Market
    • 3.6 Key Manufacturers Wafer Grinding Equipment Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 Wafer Edge Grinder Production and Production Value (2014-2019)
      • 4.1.2 Wafer Surface Grinder Production and Production Value (2014-2019)
    • 4.2 Global Wafer Grinding Equipment Production Market Share by Type
    • 4.3 Global Wafer Grinding Equipment Production Value Market Share by Type
    • 4.4 Wafer Grinding Equipment Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global Wafer Grinding Equipment Consumption by Application

    6 Production by Regions

    • 6.1 Global Wafer Grinding Equipment Production (History Data) by Regions 2014-2019
    • 6.2 Global Wafer Grinding Equipment Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States Wafer Grinding Equipment Production Growth Rate 2014-2019
      • 6.3.2 United States Wafer Grinding Equipment Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States Wafer Grinding Equipment Import & Export
    • 6.4 European Union
      • 6.4.1 European Union Wafer Grinding Equipment Production Growth Rate 2014-2019
      • 6.4.2 European Union Wafer Grinding Equipment Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union Wafer Grinding Equipment Import & Export
    • 6.5 China
      • 6.5.1 China Wafer Grinding Equipment Production Growth Rate 2014-2019
      • 6.5.2 China Wafer Grinding Equipment Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China Wafer Grinding Equipment Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 Wafer Grinding Equipment Consumption by Regions

    • 7.1 Global Wafer Grinding Equipment Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States Wafer Grinding Equipment Consumption by Type
      • 7.2.2 United States Wafer Grinding Equipment Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union Wafer Grinding Equipment Consumption by Type
      • 7.3.2 European Union Wafer Grinding Equipment Consumption by Application
    • 7.4 China
      • 7.4.1 China Wafer Grinding Equipment Consumption by Type
      • 7.4.2 China Wafer Grinding Equipment Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World Wafer Grinding Equipment Consumption by Type
      • 7.5.2 Rest of World Wafer Grinding Equipment Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 Okamoto Semiconductor Equipment Division
      • 8.1.1 Okamoto Semiconductor Equipment Division Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of Wafer Grinding Equipment
      • 8.1.4 Wafer Grinding Equipment Product Introduction
      • 8.1.5 Okamoto Semiconductor Equipment Division Recent Development
    • 8.2 Strasbaugh
      • 8.2.1 Strasbaugh Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of Wafer Grinding Equipment
      • 8.2.4 Wafer Grinding Equipment Product Introduction
      • 8.2.5 Strasbaugh Recent Development
    • 8.3 Disco
      • 8.3.1 Disco Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of Wafer Grinding Equipment
      • 8.3.4 Wafer Grinding Equipment Product Introduction
      • 8.3.5 Disco Recent Development
    • 8.4 G&N Genauigkeits Maschinenbau Nürnberg GmbH
      • 8.4.1 G&N Genauigkeits Maschinenbau Nürnberg GmbH Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of Wafer Grinding Equipment
      • 8.4.4 Wafer Grinding Equipment Product Introduction
      • 8.4.5 G&N Genauigkeits Maschinenbau Nürnberg GmbH Recent Development
    • 8.5 GigaMat
      • 8.5.1 GigaMat Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of Wafer Grinding Equipment
      • 8.5.4 Wafer Grinding Equipment Product Introduction
      • 8.5.5 GigaMat Recent Development
    • 8.6 Arnold Gruppe
      • 8.6.1 Arnold Gruppe Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of Wafer Grinding Equipment
      • 8.6.4 Wafer Grinding Equipment Product Introduction
      • 8.6.5 Arnold Gruppe Recent Development
    • 8.7 Hunan Yujing Machine Industrial
      • 8.7.1 Hunan Yujing Machine Industrial Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of Wafer Grinding Equipment
      • 8.7.4 Wafer Grinding Equipment Product Introduction
      • 8.7.5 Hunan Yujing Machine Industrial Recent Development
    • 8.8 WAIDA MFG
      • 8.8.1 WAIDA MFG Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of Wafer Grinding Equipment
      • 8.8.4 Wafer Grinding Equipment Product Introduction
      • 8.8.5 WAIDA MFG Recent Development
    • 8.9 SpeedFam
      • 8.9.1 SpeedFam Company Details
      • 8.9.2 Company Description and Business Overview
      • 8.9.3 Production and Revenue of Wafer Grinding Equipment
      • 8.9.4 Wafer Grinding Equipment Product Introduction
      • 8.9.5 SpeedFam Recent Development
    • 8.10 Koyo Machinery
      • 8.10.1 Koyo Machinery Company Details
      • 8.10.2 Company Description and Business Overview
      • 8.10.3 Production and Revenue of Wafer Grinding Equipment
      • 8.10.4 Wafer Grinding Equipment Product Introduction
      • 8.10.5 Koyo Machinery Recent Development
    • 8.11 ACCRETECH
    • 8.12 Daitron
    • 8.13 MAT Inc.
    • 8.14 Dikema Presicion Machinery
    • 8.15 Dynavest
    • 8.16 Komatsu NTC

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global Wafer Grinding Equipment Capacity, Production Forecast 2019-2025
      • 9.1.2 Global Wafer Grinding Equipment Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global Wafer Grinding Equipment Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global Wafer Grinding Equipment Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global Wafer Grinding Equipment Production Forecast by Type
      • 9.7.2 Global Wafer Grinding Equipment Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 Wafer Grinding Equipment Sales Channels
      • 10.2.2 Wafer Grinding Equipment Distributors
    • 10.3 Wafer Grinding Equipment Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      This report covers Wafer Edge Grinder and Wafer Surface Grinder in Semiconductor and Photovoltaic field.
      In 2019, the market size of Wafer Grinding Equipment is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Wafer Grinding Equipment.

      This report studies the global market size of Wafer Grinding Equipment, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the Wafer Grinding Equipment production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      Okamoto Semiconductor Equipment Division
      Strasbaugh
      Disco
      G&N Genauigkeits Maschinenbau Nürnberg GmbH
      GigaMat
      Arnold Gruppe
      Hunan Yujing Machine Industrial
      WAIDA MFG
      SpeedFam
      Koyo Machinery
      ACCRETECH
      Daitron
      MAT Inc.
      Dikema Presicion Machinery
      Dynavest
      Komatsu NTC

      Market Segment by Product Type
      Wafer Edge Grinder
      Wafer Surface Grinder

      Market Segment by Application
      Semiconductor
      Photovoltaic

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the Wafer Grinding Equipment status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key Wafer Grinding Equipment manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of Wafer Grinding Equipment are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

      Buy now