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Global Wafer Grinder (Wafer Thinning Equipment) Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

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1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Level of Automation
    • 1.3.1 Overview: Global Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Level of Automation: 2020 Versus 2024 Versus 2031
    • 1.3.2 Fully Automatic
    • 1.3.3 Semi-Automatic
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 200mm Wafer
    • 1.4.3 300mm Wafer
    • 1.4.4 Others
  • 1.5 Global Wafer Grinder (Wafer Thinning Equipment) Market Size & Forecast
    • 1.5.1 Global Wafer Grinder (Wafer Thinning Equipment) Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Quantity (2020-2031)
    • 1.5.3 Global Wafer Grinder (Wafer Thinning Equipment) Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 Disco
    • 2.1.1 Disco Details
    • 2.1.2 Disco Major Business
    • 2.1.3 Disco Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.1.4 Disco Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 Disco Recent Developments/Updates
  • 2.2 TOKYO SEIMITSU
    • 2.2.1 TOKYO SEIMITSU Details
    • 2.2.2 TOKYO SEIMITSU Major Business
    • 2.2.3 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.2.4 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 TOKYO SEIMITSU Recent Developments/Updates
  • 2.3 G&N
    • 2.3.1 G&N Details
    • 2.3.2 G&N Major Business
    • 2.3.3 G&N Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.3.4 G&N Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 G&N Recent Developments/Updates
  • 2.4 Okamoto Semiconductor Equipment Division
    • 2.4.1 Okamoto Semiconductor Equipment Division Details
    • 2.4.2 Okamoto Semiconductor Equipment Division Major Business
    • 2.4.3 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.4.4 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates
  • 2.5 CETC
    • 2.5.1 CETC Details
    • 2.5.2 CETC Major Business
    • 2.5.3 CETC Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.5.4 CETC Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 CETC Recent Developments/Updates
  • 2.6 Koyo Machinery
    • 2.6.1 Koyo Machinery Details
    • 2.6.2 Koyo Machinery Major Business
    • 2.6.3 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.6.4 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 Koyo Machinery Recent Developments/Updates
  • 2.7 Revasum
    • 2.7.1 Revasum Details
    • 2.7.2 Revasum Major Business
    • 2.7.3 Revasum Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.7.4 Revasum Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 Revasum Recent Developments/Updates
  • 2.8 WAIDA MFG
    • 2.8.1 WAIDA MFG Details
    • 2.8.2 WAIDA MFG Major Business
    • 2.8.3 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.8.4 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 WAIDA MFG Recent Developments/Updates
  • 2.9 Hunan Yujing Machine Industrial
    • 2.9.1 Hunan Yujing Machine Industrial Details
    • 2.9.2 Hunan Yujing Machine Industrial Major Business
    • 2.9.3 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.9.4 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 Hunan Yujing Machine Industrial Recent Developments/Updates
  • 2.10 SpeedFam
    • 2.10.1 SpeedFam Details
    • 2.10.2 SpeedFam Major Business
    • 2.10.3 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.10.4 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 SpeedFam Recent Developments/Updates
  • 2.11 TSD
    • 2.11.1 TSD Details
    • 2.11.2 TSD Major Business
    • 2.11.3 TSD Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.11.4 TSD Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.11.5 TSD Recent Developments/Updates
  • 2.12 Engis Corporation
    • 2.12.1 Engis Corporation Details
    • 2.12.2 Engis Corporation Major Business
    • 2.12.3 Engis Corporation Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.12.4 Engis Corporation Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.12.5 Engis Corporation Recent Developments/Updates
  • 2.13 NTS
    • 2.13.1 NTS Details
    • 2.13.2 NTS Major Business
    • 2.13.3 NTS Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.13.4 NTS Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.13.5 NTS Recent Developments/Updates

3 Competitive Environment: Wafer Grinder (Wafer Thinning Equipment) by Manufacturer

  • 3.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue by Manufacturer (2020-2025)
  • 3.3 Global Wafer Grinder (Wafer Thinning Equipment) Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of Wafer Grinder (Wafer Thinning Equipment) by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 Wafer Grinder (Wafer Thinning Equipment) Manufacturer Market Share in 2024
    • 3.4.3 Top 6 Wafer Grinder (Wafer Thinning Equipment) Manufacturer Market Share in 2024
  • 3.5 Wafer Grinder (Wafer Thinning Equipment) Market: Overall Company Footprint Analysis
    • 3.5.1 Wafer Grinder (Wafer Thinning Equipment) Market: Region Footprint
    • 3.5.2 Wafer Grinder (Wafer Thinning Equipment) Market: Company Product Type Footprint
    • 3.5.3 Wafer Grinder (Wafer Thinning Equipment) Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Wafer Grinder (Wafer Thinning Equipment) Market Size by Region
    • 4.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Region (2020-2031)
    • 4.1.2 Global Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Region (2020-2031)
    • 4.1.3 Global Wafer Grinder (Wafer Thinning Equipment) Average Price by Region (2020-2031)
  • 4.2 North America Wafer Grinder (Wafer Thinning Equipment) Consumption Value (2020-2031)
  • 4.3 Europe Wafer Grinder (Wafer Thinning Equipment) Consumption Value (2020-2031)
  • 4.4 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Consumption Value (2020-2031)
  • 4.5 South America Wafer Grinder (Wafer Thinning Equipment) Consumption Value (2020-2031)
  • 4.6 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Consumption Value (2020-2031)

5 Market Segment by Level of Automation

  • 5.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Level of Automation (2020-2031)
  • 5.2 Global Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Level of Automation (2020-2031)
  • 5.3 Global Wafer Grinder (Wafer Thinning Equipment) Average Price by Level of Automation (2020-2031)

6 Market Segment by Application

  • 6.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Application (2020-2031)
  • 6.2 Global Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Application (2020-2031)
  • 6.3 Global Wafer Grinder (Wafer Thinning Equipment) Average Price by Application (2020-2031)

7 North America

  • 7.1 North America Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Level of Automation (2020-2031)
  • 7.2 North America Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Application (2020-2031)
  • 7.3 North America Wafer Grinder (Wafer Thinning Equipment) Market Size by Country
    • 7.3.1 North America Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Country (2020-2031)
    • 7.3.2 North America Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Level of Automation (2020-2031)
  • 8.2 Europe Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Application (2020-2031)
  • 8.3 Europe Wafer Grinder (Wafer Thinning Equipment) Market Size by Country
    • 8.3.1 Europe Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Level of Automation (2020-2031)
  • 9.2 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Market Size by Region
    • 9.3.1 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Level of Automation (2020-2031)
  • 10.2 South America Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Application (2020-2031)
  • 10.3 South America Wafer Grinder (Wafer Thinning Equipment) Market Size by Country
    • 10.3.1 South America Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Country (2020-2031)
    • 10.3.2 South America Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Level of Automation (2020-2031)
  • 11.2 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Market Size by Country
    • 11.3.1 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 Wafer Grinder (Wafer Thinning Equipment) Market Drivers
  • 12.2 Wafer Grinder (Wafer Thinning Equipment) Market Restraints
  • 12.3 Wafer Grinder (Wafer Thinning Equipment) Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Wafer Grinder (Wafer Thinning Equipment) and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Wafer Grinder (Wafer Thinning Equipment)
  • 13.3 Wafer Grinder (Wafer Thinning Equipment) Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Wafer Grinder (Wafer Thinning Equipment) Typical Distributors
  • 14.3 Wafer Grinder (Wafer Thinning Equipment) Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global Wafer Grinder (Wafer Thinning Equipment) market size was valued at US$ 1072 million in 2024 and is forecast to a readjusted size of USD 1732 million by 2031 with a CAGR of 6.9% during review period.
    Wafer Grinder (Wafer Thinning Equipment) uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
    The Wafer Grinder (Wafer Thinning Equipment) market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe. Wafer Grinder (Wafer Thinning Equipment)s are integral in wafer thinning processes, where the primary applications include the processing of 200mm and 300mm wafers. Among the various types of Wafer Grinder (Wafer Thinning Equipment)s, the fully automatic Wafer Grinder (Wafer Thinning Equipment)s dominate the market, they have higher automation levels, allowing for increased efficiency and precision, accounting for approximately 52% of the global market share. The most significant application market is for 300mm wafers, which accounts for 83% of the global demand, primarily driven by the advanced semiconductor manufacturing processes that require thinner wafers with high precision. Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.
    Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Wafer Grinder (Wafer Thinning Equipment) and related services. The top five players account for about 90% of the revenue market in 2024.
    Market Drivers:
    Technological Advancements in Semiconductor Manufacturing: As the demand for smaller, more powerful, and energy-efficient electronic devices grows, semiconductor manufacturers are continuously advancing their processes to meet these demands. This includes the need for thinner, more precisely engineered wafers, driving the demand for high-performance Wafer Grinder (Wafer Thinning Equipment)s. Fully automatic Wafer Grinder (Wafer Thinning Equipment)s, known for their precision and ability to handle larger volumes, are particularly in demand to meet these stringent manufacturing requirements.
    Miniaturization of Electronic Devices: The global trend towards smaller, more compact electronic devices—such as smartphones, wearables, and IoT devices—requires thinner semiconductor wafers. As a result, there is a growing demand for wafer thinning solutions that can maintain high quality while reducing thickness. Fully automatic Wafer Grinder (Wafer Thinning Equipment)s are the preferred solution, as they offer high precision and productivity.
    Surge in Semiconductor Demand: The semiconductor industry is experiencing significant growth, driven by the rise in demand for various electronic applications, including computing, communication, and automotive systems. As the industry's focus shifts towards advanced technology nodes, the demand for larger wafers, particularly 300mm wafers, is growing. These trends are contributing to the expansion of the Wafer Grinder (Wafer Thinning Equipment) market, especially in regions such as APAC, which dominate semiconductor manufacturing.
    Growth in 300mm Wafer Demand: The 300mm wafer segment is the most significant application for Wafer Grinder (Wafer Thinning Equipment)s, accounting for 83% of the global market share. Larger wafers allow for more chips to be processed at once, reducing manufacturing costs per chip. This increase in 300mm wafer production is a significant growth factor for the Wafer Grinder (Wafer Thinning Equipment) market, as manufacturers need specialized equipment to handle the larger wafers efficiently.
    Shift Towards Fully Automated Solutions: Fully automated Wafer Grinder (Wafer Thinning Equipment)s are gaining popularity due to their higher efficiency, reduced labor costs, and the ability to maintain consistency across large batches. As semiconductor manufacturers continue to scale production, automation becomes increasingly essential to meet high-volume production requirements without compromising quality.
    Market Restraints:
    Despite the strong growth, several factors may restrain the expansion of the Wafer Grinder (Wafer Thinning Equipment) market:
    High Initial Investment: Fully automatic Wafer Grinder (Wafer Thinning Equipment)s come with a high initial cost, which could be prohibitive for smaller semiconductor manufacturers or emerging markets with limited capital. Additionally, the cost of maintaining and upgrading these high-tech machines can be a barrier for smaller players who may prefer less expensive, semi-automatic models.
    Technological Complexity: Fully automatic Wafer Grinder (Wafer Thinning Equipment)s are highly complex systems that require specialized knowledge to operate, program, and maintain. This could limit the adoption of such systems in regions with a shortage of skilled technicians and engineers. The technical complexity can also result in extended downtime during maintenance or troubleshooting, affecting overall production efficiency.
    Conclusion:
    The Wafer Grinder (Wafer Thinning Equipment) market is poised for significant growth, driven by advancements in semiconductor manufacturing, the increasing demand for thinner and more precise wafers, and the rise in 300mm wafer processing. Fully automatic Wafer Grinder (Wafer Thinning Equipment)s, which dominate the market with a 52% share, will continue to lead the market due to their higher efficiency and precision.
    The APAC region remains the largest consumer of Wafer Grinder (Wafer Thinning Equipment)s, accounting for 78% of the global market. However, despite these strong growth drivers, challenges such as high initial investment costs and technological complexity may pose barriers to market entry for smaller players. Manufacturers will need to innovate and focus on automation, precision, and cost-effective solutions to capitalize on the growing demand for wafer thinning equipment.
    In conclusion, the Wafer Grinder (Wafer Thinning Equipment) market offers abundant opportunities for companies that can provide high-quality, efficient, and cost-effective wafer grinding solutions, particularly those that address the increasing demand for 300mm wafers and advanced semiconductor manufacturing processes.
    This report is a detailed and comprehensive analysis for global Wafer Grinder (Wafer Thinning Equipment) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Level of Automation and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
    Key Features:
    Global Wafer Grinder (Wafer Thinning Equipment) market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
    Global Wafer Grinder (Wafer Thinning Equipment) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
    Global Wafer Grinder (Wafer Thinning Equipment) market size and forecasts, by Level of Automation and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
    Global Wafer Grinder (Wafer Thinning Equipment) market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
    The Primary Objectives in This Report Are:
    To determine the size of the total market opportunity of global and key countries
    To assess the growth potential for Wafer Grinder (Wafer Thinning Equipment)
    To forecast future growth in each product and end-use market
    To assess competitive factors affecting the marketplace
    This report profiles key players in the global Wafer Grinder (Wafer Thinning Equipment) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, etc.
    This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
    Market Segmentation
    Wafer Grinder (Wafer Thinning Equipment) market is split by Level of Automation and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Level of Automation, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
    Market segment by Level of Automation
    Fully Automatic
    Semi-Automatic
    Market segment by Application
    200mm Wafer
    300mm Wafer
    Others
    Major players covered
    Disco
    TOKYO SEIMITSU
    G&N
    Okamoto Semiconductor Equipment Division
    CETC
    Koyo Machinery
    Revasum
    WAIDA MFG
    Hunan Yujing Machine Industrial
    SpeedFam
    TSD
    Engis Corporation
    NTS
    Market segment by region, regional analysis covers
    North America (United States, Canada, and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 15 chapters:
    Chapter 1, to describe Wafer Grinder (Wafer Thinning Equipment) product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top manufacturers of Wafer Grinder (Wafer Thinning Equipment), with price, sales quantity, revenue, and global market share of Wafer Grinder (Wafer Thinning Equipment) from 2020 to 2025.
    Chapter 3, the Wafer Grinder (Wafer Thinning Equipment) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
    Chapter 4, the Wafer Grinder (Wafer Thinning Equipment) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
    Chapter 5 and 6, to segment the sales by Level of Automation and by Application, with sales market share and growth rate by Level of Automation, by Application, from 2020 to 2031.
    Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Grinder (Wafer Thinning Equipment) market forecast, by regions, by Level of Automation, and by Application, with sales and revenue, from 2026 to 2031.
    Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
    Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Grinder (Wafer Thinning Equipment).
    Chapter 14 and 15, to describe Wafer Grinder (Wafer Thinning Equipment) sales channel, distributors, customers, research findings and conclusion.

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