Wafer Dicing Tape Market Report – Research, Industry Analysis Reports and Market Demands

Global Wafer Dicing Tape Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

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Table of Content

1 Market Overview

1.1 Product Overview and Scope
1.2 Market Estimation Caveats and Base Year
1.3 Market Analysis by Peel-off Method
- 1.3.1 Overview: Global Wafer Dicing Tape Consumption Value by Peel-off Method: 2020 Versus 2024 Versus 2031
- 1.3.2 UV Tape
- 1.3.3 Non-UV Tape
1.4 Market Analysis by Base Film
- 1.4.1 Overview: Global Wafer Dicing Tape Consumption Value by Base Film: 2020 Versus 2024 Versus 2031
- 1.4.2 PO Base Film Tape
- 1.4.3 PVC Base Film Tape
- 1.4.4 PET Base Film Tape
1.5 Global Wafer Dicing Tape Market Size & Forecast
- 1.5.1 Global Wafer Dicing Tape Consumption Value (2020 & 2024 & 2031)
- 1.5.2 Global Wafer Dicing Tape Sales Quantity (2020-2031)
- 1.5.3 Global Wafer Dicing Tape Average Price (2020-2031)

2 Manufacturers Profiles

3 Competitive Environment: Wafer Dicing Tape by Manufacturer

3.1 Global Wafer Dicing Tape Sales Quantity by Manufacturer (2020-2025)
3.2 Global Wafer Dicing Tape Revenue by Manufacturer (2020-2025)
3.3 Global Wafer Dicing Tape Average Price by Manufacturer (2020-2025)
3.4 Market Share Analysis (2024)
- 3.4.1 Producer Shipments of Wafer Dicing Tape by Manufacturer Revenue ($MM) and Market Share (%): 2024
- 3.4.2 Top 3 Wafer Dicing Tape Manufacturer Market Share in 2024
- 3.4.3 Top 6 Wafer Dicing Tape Manufacturer Market Share in 2024
3.5 Wafer Dicing Tape Market: Overall Company Footprint Analysis
- 3.5.1 Wafer Dicing Tape Market: Region Footprint
- 3.5.2 Wafer Dicing Tape Market: Company Product Type Footprint
- 3.5.3 Wafer Dicing Tape Market: Company Product Application Footprint
3.6 New Market Entrants and Barriers to Market Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

4.1 Global Wafer Dicing Tape Market Size by Region
- 4.1.1 Global Wafer Dicing Tape Sales Quantity by Region (2020-2031)
- 4.1.2 Global Wafer Dicing Tape Consumption Value by Region (2020-2031)
- 4.1.3 Global Wafer Dicing Tape Average Price by Region (2020-2031)
4.2 North America Wafer Dicing Tape Consumption Value (2020-2031)
4.3 Europe Wafer Dicing Tape Consumption Value (2020-2031)
4.4 Asia-Pacific Wafer Dicing Tape Consumption Value (2020-2031)
4.5 South America Wafer Dicing Tape Consumption Value (2020-2031)
4.6 Middle East & Africa Wafer Dicing Tape Consumption Value (2020-2031)

5 Market Segment by Peel-off Method

5.1 Global Wafer Dicing Tape Sales Quantity by Peel-off Method (2020-2031)
5.2 Global Wafer Dicing Tape Consumption Value by Peel-off Method (2020-2031)
5.3 Global Wafer Dicing Tape Average Price by Peel-off Method (2020-2031)

6 Market Segment by Base Film

6.1 Global Wafer Dicing Tape Sales Quantity by Base Film (2020-2031)
6.2 Global Wafer Dicing Tape Consumption Value by Base Film (2020-2031)
6.3 Global Wafer Dicing Tape Average Price by Base Film (2020-2031)

7 North America

7.1 North America Wafer Dicing Tape Sales Quantity by Peel-off Method (2020-2031)
7.2 North America Wafer Dicing Tape Sales Quantity by Base Film (2020-2031)
7.3 North America Wafer Dicing Tape Market Size by Country
- 7.3.1 North America Wafer Dicing Tape Sales Quantity by Country (2020-2031)
- 7.3.2 North America Wafer Dicing Tape Consumption Value by Country (2020-2031)
- 7.3.3 United States Market Size and Forecast (2020-2031)
- 7.3.4 Canada Market Size and Forecast (2020-2031)
- 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

8.1 Europe Wafer Dicing Tape Sales Quantity by Peel-off Method (2020-2031)
8.2 Europe Wafer Dicing Tape Sales Quantity by Base Film (2020-2031)
8.3 Europe Wafer Dicing Tape Market Size by Country
- 8.3.1 Europe Wafer Dicing Tape Sales Quantity by Country (2020-2031)
- 8.3.2 Europe Wafer Dicing Tape Consumption Value by Country (2020-2031)
- 8.3.3 Germany Market Size and Forecast (2020-2031)
- 8.3.4 France Market Size and Forecast (2020-2031)
- 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
- 8.3.6 Russia Market Size and Forecast (2020-2031)
- 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

9.1 Asia-Pacific Wafer Dicing Tape Sales Quantity by Peel-off Method (2020-2031)
9.2 Asia-Pacific Wafer Dicing Tape Sales Quantity by Base Film (2020-2031)
9.3 Asia-Pacific Wafer Dicing Tape Market Size by Region
- 9.3.1 Asia-Pacific Wafer Dicing Tape Sales Quantity by Region (2020-2031)
- 9.3.2 Asia-Pacific Wafer Dicing Tape Consumption Value by Region (2020-2031)
- 9.3.3 China Market Size and Forecast (2020-2031)
- 9.3.4 Japan Market Size and Forecast (2020-2031)
- 9.3.5 South Korea Market Size and Forecast (2020-2031)
- 9.3.6 India Market Size and Forecast (2020-2031)
- 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
- 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

10.1 South America Wafer Dicing Tape Sales Quantity by Peel-off Method (2020-2031)
10.2 South America Wafer Dicing Tape Sales Quantity by Base Film (2020-2031)
10.3 South America Wafer Dicing Tape Market Size by Country
- 10.3.1 South America Wafer Dicing Tape Sales Quantity by Country (2020-2031)
- 10.3.2 South America Wafer Dicing Tape Consumption Value by Country (2020-2031)
- 10.3.3 Brazil Market Size and Forecast (2020-2031)
- 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

11.1 Middle East & Africa Wafer Dicing Tape Sales Quantity by Peel-off Method (2020-2031)
11.2 Middle East & Africa Wafer Dicing Tape Sales Quantity by Base Film (2020-2031)
11.3 Middle East & Africa Wafer Dicing Tape Market Size by Country
- 11.3.1 Middle East & Africa Wafer Dicing Tape Sales Quantity by Country (2020-2031)
- 11.3.2 Middle East & Africa Wafer Dicing Tape Consumption Value by Country (2020-2031)
- 11.3.3 Turkey Market Size and Forecast (2020-2031)
- 11.3.4 Egypt Market Size and Forecast (2020-2031)
- 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
- 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

12.1 Wafer Dicing Tape Market Drivers
12.2 Wafer Dicing Tape Market Restraints
12.3 Wafer Dicing Tape Trends Analysis
12.4 Porters Five Forces Analysis
- 12.4.1 Threat of New Entrants
- 12.4.2 Bargaining Power of Suppliers
- 12.4.3 Bargaining Power of Buyers
- 12.4.4 Threat of Substitutes
- 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

13.1 Raw Material of Wafer Dicing Tape and Key Manufacturers
13.2 Manufacturing Costs Percentage of Wafer Dicing Tape
13.3 Wafer Dicing Tape Production Process
13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

14.1 Sales Channel
- 14.1.1 Direct to End-User
- 14.1.2 Distributors
14.2 Wafer Dicing Tape Typical Distributors
14.3 Wafer Dicing Tape Typical Customers

15 Research Findings and Conclusion

16 Appendix

16.1 Methodology
16.2 Research Process and Data Source

Description

According to our (Global Info Research) latest study, the global Wafer Dicing Tape market size was valued at US$ 457 million in 2024 and is forecast to a readjusted size of USD 848 million by 2031 with a CAGR of 8.4% during review period.
Dicing Tape is a type of adhesive tape used in semiconductor manufacturing, also known as cutting tape.
This report studies the semiconductor wafer dicing tapes, include the UV and Non-UV tapes used in waer dicing processing.
Current the key manufacturers of semiconductor wafer tapes worldwide mainly include Mitsui Chemicals, LINTEC Corporation, Furukawa Electric, Denka, Nitto Denko Corporation, Maxell Sliontec and Sekisui Chemical. In 2023, the top five manufacturers in the world accounted for about 82.5% of the market share. Chinese local manufacturers of wafer tapes are currently mainly in the verification and small batch stages. Representative companies include Shanghai Guke Adhesive Tape Technology, Plusco Tech, Taicang Zhanxin Adhesive Material, Cybrid Technologies, ZZSM, BYE POLYMER MATERIAL, ZHONGSHAN CROWN ADHESIVE PRODUCTS, Yantai Darbond Technology and Sunliky New Material Technology. It is expected that in the next few years, Chinese local companies will gradually grow and occupy a higher share in the Chinese market.
This report is a detailed and comprehensive analysis for global Wafer Dicing Tape market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Peel-off Method and by Base Film. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Wafer Dicing Tape market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Wafer Dicing Tape market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Wafer Dicing Tape market size and forecasts, by Peel-off Method and by Base Film, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Wafer Dicing Tape market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sq m), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Dicing Tape
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Wafer Dicing Tape market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsui Chemicals, LINTEC Corporation, Denka, Nitto Denko Corporation, Furukawa Electric, Sekisui Chemical, Maxell Sliontec, Resonac Corporation, Sumitomo Bakelite Company, D&X Co., Ltd, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Wafer Dicing Tape market is split by Peel-off Method and by Base Film. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Peel-off Method, and by Base Film in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Peel-off Method
UV Tape
Non-UV Tape
Market segment by Base Film
PO Base Film Tape
PVC Base Film Tape
PET Base Film Tape
Major players covered
Mitsui Chemicals
LINTEC Corporation
Denka
Nitto Denko Corporation
Furukawa Electric
Sekisui Chemical
Maxell Sliontec
Resonac Corporation
Sumitomo Bakelite Company
D&X Co., Ltd
KGK Chemical Corporation
AI Technology, Inc. (AIT)
Ultron System
Daehyun ST
Solar Plus Company
Alliance Material Co., Ltd (AMC)
3M
Shanghai Guke Adhesive Tape Technology
Plusco Tech
Taicang Zhanxin Adhesive Material
Cybrid Technologies
ZZSM
BYE POLYMER MATERIAL
ZHONGSHAN CROWN ADHESIVE PRODUCTS
Yantai Darbond Technology
Sunliky New Material Technology
GTA Material
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Dicing Tape product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Dicing Tape, with price, sales quantity, revenue, and global market share of Wafer Dicing Tape from 2020 to 2025.
Chapter 3, the Wafer Dicing Tape competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Dicing Tape breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Peel-off Method and by Base Film, with sales market share and growth rate by Peel-off Method, by Base Film, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Dicing Tape market forecast, by regions, by Peel-off Method, and by Base Film, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Dicing Tape.
Chapter 14 and 15, to describe Wafer Dicing Tape sales channel, distributors, customers, research findings and conclusion.

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