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Global (United States, European Union and China) Wafer Cutting Machines Market Research Report 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global Wafer Cutting Machines Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 Fiber Laser Cutting Machines
      • 1.3.3 Semiconductor Laser Cutting Machines
      • 1.3.4 YAG Laser Cutting Machines
    • 1.4 Market Segment by Application
      • 1.4.1 Global Wafer Cutting Machines Market Share by Application (2019-2025)
      • 1.4.2 Solar
      • 1.4.3 Electronics
      • 1.4.4 Others
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global Wafer Cutting Machines Production Value 2014-2025
      • 2.1.2 Global Wafer Cutting Machines Production 2014-2025
      • 2.1.3 Global Wafer Cutting Machines Capacity 2014-2025
      • 2.1.4 Global Wafer Cutting Machines Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global Wafer Cutting Machines Market Size CAGR of Key Regions
      • 2.2.2 Global Wafer Cutting Machines Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global Wafer Cutting Machines Capacity by Manufacturers
      • 3.1.2 Global Wafer Cutting Machines Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 Wafer Cutting Machines Revenue by Manufacturers (2014-2019)
      • 3.2.2 Wafer Cutting Machines Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global Wafer Cutting Machines Market Concentration Ratio (CR5 and HHI)
    • 3.3 Wafer Cutting Machines Price by Manufacturers
    • 3.4 Key Manufacturers Wafer Cutting Machines Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into Wafer Cutting Machines Market
    • 3.6 Key Manufacturers Wafer Cutting Machines Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 Fiber Laser Cutting Machines Production and Production Value (2014-2019)
      • 4.1.2 Semiconductor Laser Cutting Machines Production and Production Value (2014-2019)
      • 4.1.3 YAG Laser Cutting Machines Production and Production Value (2014-2019)
    • 4.2 Global Wafer Cutting Machines Production Market Share by Type
    • 4.3 Global Wafer Cutting Machines Production Value Market Share by Type
    • 4.4 Wafer Cutting Machines Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global Wafer Cutting Machines Consumption by Application

    6 Production by Regions

    • 6.1 Global Wafer Cutting Machines Production (History Data) by Regions 2014-2019
    • 6.2 Global Wafer Cutting Machines Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States Wafer Cutting Machines Production Growth Rate 2014-2019
      • 6.3.2 United States Wafer Cutting Machines Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States Wafer Cutting Machines Import & Export
    • 6.4 European Union
      • 6.4.1 European Union Wafer Cutting Machines Production Growth Rate 2014-2019
      • 6.4.2 European Union Wafer Cutting Machines Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union Wafer Cutting Machines Import & Export
    • 6.5 China
      • 6.5.1 China Wafer Cutting Machines Production Growth Rate 2014-2019
      • 6.5.2 China Wafer Cutting Machines Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China Wafer Cutting Machines Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 Wafer Cutting Machines Consumption by Regions

    • 7.1 Global Wafer Cutting Machines Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States Wafer Cutting Machines Consumption by Type
      • 7.2.2 United States Wafer Cutting Machines Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union Wafer Cutting Machines Consumption by Type
      • 7.3.2 European Union Wafer Cutting Machines Consumption by Application
    • 7.4 China
      • 7.4.1 China Wafer Cutting Machines Consumption by Type
      • 7.4.2 China Wafer Cutting Machines Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World Wafer Cutting Machines Consumption by Type
      • 7.5.2 Rest of World Wafer Cutting Machines Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 Applied Materials
      • 8.1.1 Applied Materials Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of Wafer Cutting Machines
      • 8.1.4 Wafer Cutting Machines Product Introduction
      • 8.1.5 Applied Materials Recent Development
    • 8.2 Meyer Burger
      • 8.2.1 Meyer Burger Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of Wafer Cutting Machines
      • 8.2.4 Wafer Cutting Machines Product Introduction
      • 8.2.5 Meyer Burger Recent Development
    • 8.3 Komatsu NTC
      • 8.3.1 Komatsu NTC Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of Wafer Cutting Machines
      • 8.3.4 Wafer Cutting Machines Product Introduction
      • 8.3.5 Komatsu NTC Recent Development
    • 8.4 Takatori Corporation
      • 8.4.1 Takatori Corporation Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of Wafer Cutting Machines
      • 8.4.4 Wafer Cutting Machines Product Introduction
      • 8.4.5 Takatori Corporation Recent Development
    • 8.5 Fujikoshi
      • 8.5.1 Fujikoshi Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of Wafer Cutting Machines
      • 8.5.4 Wafer Cutting Machines Product Introduction
      • 8.5.5 Fujikoshi Recent Development
    • 8.6 HG Laser
      • 8.6.1 HG Laser Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of Wafer Cutting Machines
      • 8.6.4 Wafer Cutting Machines Product Introduction
      • 8.6.5 HG Laser Recent Development
    • 8.7 Synova
      • 8.7.1 Synova Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of Wafer Cutting Machines
      • 8.7.4 Wafer Cutting Machines Product Introduction
      • 8.7.5 Synova Recent Development
    • 8.8 Gocmen
      • 8.8.1 Gocmen Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of Wafer Cutting Machines
      • 8.8.4 Wafer Cutting Machines Product Introduction
      • 8.8.5 Gocmen Recent Development
    • 8.9 Insreo
      • 8.9.1 Insreo Company Details
      • 8.9.2 Company Description and Business Overview
      • 8.9.3 Production and Revenue of Wafer Cutting Machines
      • 8.9.4 Wafer Cutting Machines Product Introduction
      • 8.9.5 Insreo Recent Development
    • 8.10 Rofin
      • 8.10.1 Rofin Company Details
      • 8.10.2 Company Description and Business Overview
      • 8.10.3 Production and Revenue of Wafer Cutting Machines
      • 8.10.4 Wafer Cutting Machines Product Introduction
      • 8.10.5 Rofin Recent Development
    • 8.11 Hanjiang Machine
    • 8.12 Shuanghui Machine
    • 8.13 Heyan Tech
    • 8.14 Keyi Laser

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global Wafer Cutting Machines Capacity, Production Forecast 2019-2025
      • 9.1.2 Global Wafer Cutting Machines Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global Wafer Cutting Machines Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global Wafer Cutting Machines Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global Wafer Cutting Machines Production Forecast by Type
      • 9.7.2 Global Wafer Cutting Machines Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 Wafer Cutting Machines Sales Channels
      • 10.2.2 Wafer Cutting Machines Distributors
    • 10.3 Wafer Cutting Machines Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      In 2019, the market size of Wafer Cutting Machines is million US$ and it will reach million US$ in 2025, growing at a CAGR of from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Wafer Cutting Machines.

      This report studies the global market size of Wafer Cutting Machines, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the Wafer Cutting Machines production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      Applied Materials
      Meyer Burger
      Komatsu NTC
      Takatori Corporation
      Fujikoshi
      HG Laser
      Synova
      Gocmen
      Insreo
      Rofin
      Hanjiang Machine
      Shuanghui Machine
      Heyan Tech
      Keyi Laser

      Market Segment by Product Type
      Fiber Laser Cutting Machines
      Semiconductor Laser Cutting Machines
      YAG Laser Cutting Machines

      Market Segment by Application
      Solar
      Electronics
      Others

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the Wafer Cutting Machines status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key Wafer Cutting Machines manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of Wafer Cutting Machines are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

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