Report Detail

Chemical & Material Global Wafer Back Grinding Tapes Market Research Report 2021

  • RnM3941464
  • |
  • 18 March, 2021
  • |
  • Global
  • |
  • 93 Pages
  • |
  • QYResearch
  • |
  • Chemical & Material

The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.

Segment by Type
UV Type
Non-UV Type

Segment by Application
Standard
Standard Thin Die
(S)DBG(GAL)
Bump

By Company
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
Force-One Applied Materials
AMC Co, Ltd
Pantech Tape Co., Ltd

Production by Region
North America
Europe
China
Japan

Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE


1 Wafer Back Grinding Tapes Market Overview

  • 1.1 Product Overview and Scope of Wafer Back Grinding Tapes
  • 1.2 Wafer Back Grinding Tapes Segment by Type
    • 1.2.1 Global Wafer Back Grinding Tapes Market Size Growth Rate Analysis by Type 2021 VS 2027
    • 1.2.2 UV Type
    • 1.2.3 Non-UV Type
  • 1.3 Wafer Back Grinding Tapes Segment by Application
    • 1.3.1 Global Wafer Back Grinding Tapes Consumption Comparison by Application: 2016 VS 2021 VS 2027
    • 1.3.2 Standard
    • 1.3.3 Standard Thin Die
    • 1.3.4 (S)DBG(GAL)
    • 1.3.5 Bump
  • 1.4 Global Market Growth Prospects
    • 1.4.1 Global Wafer Back Grinding Tapes Revenue Estimates and Forecasts (2016-2027)
    • 1.4.2 Global Wafer Back Grinding Tapes Production Estimates and Forecasts (2016-2027)
  • 1.5 Global Wafer Back Grinding Tapes Market by Region
    • 1.5.1 Global Wafer Back Grinding Tapes Market Size Estimates and Forecasts by Region: 2016 VS 2021 VS 2027
    • 1.5.2 North America Wafer Back Grinding Tapes Estimates and Forecasts (2016-2027)
    • 1.5.3 Europe Wafer Back Grinding Tapes Estimates and Forecasts (2016-2027)
    • 1.5.5 China Wafer Back Grinding Tapes Estimates and Forecasts (2016-2027)
    • 1.5.5 Japan Wafer Back Grinding Tapes Estimates and Forecasts (2016-2027)

2 Market Competition by Manufacturers

  • 2.1 Global Wafer Back Grinding Tapes Production Market Share by Manufacturers (2016-2021)
  • 2.2 Global Wafer Back Grinding Tapes Revenue Market Share by Manufacturers (2016-2021)
  • 2.3 Wafer Back Grinding Tapes Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
  • 2.4 Global Wafer Back Grinding Tapes Average Price by Manufacturers (2016-2021)
  • 2.5 Manufacturers Wafer Back Grinding Tapes Production Sites, Area Served, Product Types
  • 2.6 Wafer Back Grinding Tapes Market Competitive Situation and Trends
    • 2.6.1 Wafer Back Grinding Tapes Market Concentration Rate
    • 2.6.2 Global 5 and 10 Largest Wafer Back Grinding Tapes Players Market Share by Revenue
    • 2.6.3 Mergers & Acquisitions, Expansion

3 Production and Capacity by Region

  • 3.1 Global Production of Wafer Back Grinding Tapes Market Share by Region (2016-2021)
  • 3.2 Global Wafer Back Grinding Tapes Revenue Market Share by Region (2016-2021)
  • 3.3 Global Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.4 North America Wafer Back Grinding Tapes Production
    • 3.4.1 North America Wafer Back Grinding Tapes Production Growth Rate (2016-2021)
    • 3.4.2 North America Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.5 Europe Wafer Back Grinding Tapes Production
    • 3.5.1 Europe Wafer Back Grinding Tapes Production Growth Rate (2016-2021)
    • 3.5.2 Europe Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.6 China Wafer Back Grinding Tapes Production
    • 3.6.1 China Wafer Back Grinding Tapes Production Growth Rate (2016-2021)
    • 3.6.2 China Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.7 Japan Wafer Back Grinding Tapes Production
    • 3.7.1 Japan Wafer Back Grinding Tapes Production Growth Rate (2016-2021)
    • 3.7.2 Japan Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)

4 Global Wafer Back Grinding Tapes Consumption by Region

  • 4.1 Global Wafer Back Grinding Tapes Consumption by Region
    • 4.1.1 Global Wafer Back Grinding Tapes Consumption by Region
    • 4.1.2 Global Wafer Back Grinding Tapes Consumption Market Share by Region
  • 4.2 North America
    • 4.2.1 North America Wafer Back Grinding Tapes Consumption by Country
    • 4.2.2 U.S.
    • 4.2.3 Canada
  • 4.3 Europe
    • 4.3.1 Europe Wafer Back Grinding Tapes Consumption by Country
    • 4.3.2 Germany
    • 4.3.3 France
    • 4.3.4 U.K.
    • 4.3.5 Italy
    • 4.3.6 Russia
  • 4.4 Asia Pacific
    • 4.4.1 Asia Pacific Wafer Back Grinding Tapes Consumption by Region
    • 4.4.2 China
    • 4.4.3 Japan
    • 4.4.4 South Korea
    • 4.4.5 Taiwan
    • 4.4.6 Southeast Asia
    • 4.4.7 India
    • 4.4.8 Australia
  • 4.5 Latin America
    • 4.5.1 Latin America Wafer Back Grinding Tapes Consumption by Country
    • 4.5.2 Mexico
    • 4.5.3 Brazil

5 Production, Revenue, Price Trend by Type

  • 5.1 Global Wafer Back Grinding Tapes Production Market Share by Type (2016-2021)
  • 5.2 Global Wafer Back Grinding Tapes Revenue Market Share by Type (2016-2021)
  • 5.3 Global Wafer Back Grinding Tapes Price by Type (2016-2021)

6 Consumption Analysis by Application

  • 6.1 Global Wafer Back Grinding Tapes Consumption Market Share by Application (2016-2021)
  • 6.2 Global Wafer Back Grinding Tapes Consumption Growth Rate by Application (2016-2021)

7 Key Companies Profiled

  • 7.1 Mitsui Chemicals Tohcello
    • 7.1.1 Mitsui Chemicals Tohcello Wafer Back Grinding Tapes Corporation Information
    • 7.1.2 Mitsui Chemicals Tohcello Wafer Back Grinding Tapes Product Portfolio
    • 7.1.3 Mitsui Chemicals Tohcello Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.1.4 Mitsui Chemicals Tohcello Main Business and Markets Served
    • 7.1.5 Mitsui Chemicals Tohcello Recent Developments/Updates
  • 7.2 Nitto
    • 7.2.1 Nitto Wafer Back Grinding Tapes Corporation Information
    • 7.2.2 Nitto Wafer Back Grinding Tapes Product Portfolio
    • 7.2.3 Nitto Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.2.4 Nitto Main Business and Markets Served
    • 7.2.5 Nitto Recent Developments/Updates
  • 7.3 LINTEC
    • 7.3.1 LINTEC Wafer Back Grinding Tapes Corporation Information
    • 7.3.2 LINTEC Wafer Back Grinding Tapes Product Portfolio
    • 7.3.3 LINTEC Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.3.4 LINTEC Main Business and Markets Served
    • 7.3.5 LINTEC Recent Developments/Updates
  • 7.4 Furukawa Electric
    • 7.4.1 Furukawa Electric Wafer Back Grinding Tapes Corporation Information
    • 7.4.2 Furukawa Electric Wafer Back Grinding Tapes Product Portfolio
    • 7.4.3 Furukawa Electric Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.4.4 Furukawa Electric Main Business and Markets Served
    • 7.4.5 Furukawa Electric Recent Developments/Updates
  • 7.5 Denka
    • 7.5.1 Denka Wafer Back Grinding Tapes Corporation Information
    • 7.5.2 Denka Wafer Back Grinding Tapes Product Portfolio
    • 7.5.3 Denka Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.5.4 Denka Main Business and Markets Served
    • 7.5.5 Denka Recent Developments/Updates
  • 7.6 D&X
    • 7.6.1 D&X Wafer Back Grinding Tapes Corporation Information
    • 7.6.2 D&X Wafer Back Grinding Tapes Product Portfolio
    • 7.6.3 D&X Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.6.4 D&X Main Business and Markets Served
    • 7.6.5 D&X Recent Developments/Updates
  • 7.7 AI Technology
    • 7.7.1 AI Technology Wafer Back Grinding Tapes Corporation Information
    • 7.7.2 AI Technology Wafer Back Grinding Tapes Product Portfolio
    • 7.7.3 AI Technology Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.7.4 AI Technology Main Business and Markets Served
    • 7.7.5 AI Technology Recent Developments/Updates
  • 7.8 Force-One Applied Materials
    • 7.8.1 Force-One Applied Materials Wafer Back Grinding Tapes Corporation Information
    • 7.8.2 Force-One Applied Materials Wafer Back Grinding Tapes Product Portfolio
    • 7.8.3 Force-One Applied Materials Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.8.4 Force-One Applied Materials Main Business and Markets Served
    • 7.7.5 Force-One Applied Materials Recent Developments/Updates
  • 7.9 AMC Co, Ltd
    • 7.9.1 AMC Co, Ltd Wafer Back Grinding Tapes Corporation Information
    • 7.9.2 AMC Co, Ltd Wafer Back Grinding Tapes Product Portfolio
    • 7.9.3 AMC Co, Ltd Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.9.4 AMC Co, Ltd Main Business and Markets Served
    • 7.9.5 AMC Co, Ltd Recent Developments/Updates
  • 7.10 Pantech Tape Co., Ltd
    • 7.10.1 Pantech Tape Co., Ltd Wafer Back Grinding Tapes Corporation Information
    • 7.10.2 Pantech Tape Co., Ltd Wafer Back Grinding Tapes Product Portfolio
    • 7.10.3 Pantech Tape Co., Ltd Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.10.4 Pantech Tape Co., Ltd Main Business and Markets Served
    • 7.10.5 Pantech Tape Co., Ltd Recent Developments/Updates

8 Wafer Back Grinding Tapes Manufacturing Cost Analysis

  • 8.1 Wafer Back Grinding Tapes Key Raw Materials Analysis
    • 8.1.1 Key Raw Materials
    • 8.1.2 Key Raw Materials Price Trend
    • 8.1.3 Key Suppliers of Raw Materials
  • 8.2 Proportion of Manufacturing Cost Structure
  • 8.3 Manufacturing Process Analysis of Wafer Back Grinding Tapes
  • 8.4 Wafer Back Grinding Tapes Industrial Chain Analysis

9 Marketing Channel, Distributors and Customers

  • 9.1 Marketing Channel
  • 9.2 Wafer Back Grinding Tapes Distributors List
  • 9.3 Wafer Back Grinding Tapes Customers

10 Market Dynamics

  • 10.1 Wafer Back Grinding Tapes Industry Trends
  • 10.2 Wafer Back Grinding Tapes Growth Drivers
  • 10.3 Wafer Back Grinding Tapes Market Challenges
  • 10.4 Wafer Back Grinding Tapes Market Restraints

11 Production and Supply Forecast

  • 11.1 Global Forecasted Production of Wafer Back Grinding Tapes by Region (2022-2027)
  • 11.2 North America Wafer Back Grinding Tapes Production, Revenue Forecast (2022-2027)
  • 11.3 Europe Wafer Back Grinding Tapes Production, Revenue Forecast (2022-2027)
  • 11.4 China Wafer Back Grinding Tapes Production, Revenue Forecast (2022-2027)
  • 11.5 Japan Wafer Back Grinding Tapes Production, Revenue Forecast (2022-2027)

12 Consumption and Demand Forecast

  • 12.1 Global Forecasted Demand Analysis of Wafer Back Grinding Tapes
  • 12.2 North America Forecasted Consumption of Wafer Back Grinding Tapes by Country
  • 12.3 Europe Market Forecasted Consumption of Wafer Back Grinding Tapes by Country
  • 12.4 Asia Pacific Market Forecasted Consumption of Wafer Back Grinding Tapes by Region
  • 12.5 Latin America Forecasted Consumption of Wafer Back Grinding Tapes by Country

13 Forecast by Type and by Application (2022-2027)

  • 13.1 Global Production, Revenue and Price Forecast by Type (2022-2027)
    • 13.1.1 Global Forecasted Production of Wafer Back Grinding Tapes by Type (2022-2027)
    • 13.1.2 Global Forecasted Revenue of Wafer Back Grinding Tapes by Type (2022-2027)
    • 13.1.3 Global Forecasted Price of Wafer Back Grinding Tapes by Type (2022-2027)
  • 13.2 Global Forecasted Consumption of Wafer Back Grinding Tapes by Application (2022-2027)

14 Research Finding and Conclusion

    15 Methodology and Data Source

    • 15.1 Methodology/Research Approach
      • 15.1.1 Research Programs/Design
      • 15.1.2 Market Size Estimation
      • 15.1.3 Market Breakdown and Data Triangulation
    • 15.2 Data Source
      • 15.2.1 Secondary Sources
      • 15.2.2 Primary Sources
    • 15.3 Author List

    Summary:
    Get latest Market Research Reports on Wafer Back Grinding Tapes. Industry analysis & Market Report on Wafer Back Grinding Tapes is a syndicated market report, published as Global Wafer Back Grinding Tapes Market Research Report 2021. It is complete Research Study and Industry Analysis of Wafer Back Grinding Tapes market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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