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Global Wafer Back Grinding Tapes Market Research Report 2021

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1 Wafer Back Grinding Tapes Market Overview

  • 1.1 Product Overview and Scope of Wafer Back Grinding Tapes
  • 1.2 Wafer Back Grinding Tapes Segment by Type
    • 1.2.1 Global Wafer Back Grinding Tapes Market Size Growth Rate Analysis by Type 2021 VS 2027
    • 1.2.2 UV Type
    • 1.2.3 Non-UV Type
  • 1.3 Wafer Back Grinding Tapes Segment by Application
    • 1.3.1 Global Wafer Back Grinding Tapes Consumption Comparison by Application: 2016 VS 2021 VS 2027
    • 1.3.2 Standard
    • 1.3.3 Standard Thin Die
    • 1.3.4 (S)DBG(GAL)
    • 1.3.5 Bump
  • 1.4 Global Market Growth Prospects
    • 1.4.1 Global Wafer Back Grinding Tapes Revenue Estimates and Forecasts (2016-2027)
    • 1.4.2 Global Wafer Back Grinding Tapes Production Estimates and Forecasts (2016-2027)
  • 1.5 Global Wafer Back Grinding Tapes Market by Region
    • 1.5.1 Global Wafer Back Grinding Tapes Market Size Estimates and Forecasts by Region: 2016 VS 2021 VS 2027
    • 1.5.2 North America Wafer Back Grinding Tapes Estimates and Forecasts (2016-2027)
    • 1.5.3 Europe Wafer Back Grinding Tapes Estimates and Forecasts (2016-2027)
    • 1.5.5 China Wafer Back Grinding Tapes Estimates and Forecasts (2016-2027)
    • 1.5.5 Japan Wafer Back Grinding Tapes Estimates and Forecasts (2016-2027)

2 Market Competition by Manufacturers

  • 2.1 Global Wafer Back Grinding Tapes Production Market Share by Manufacturers (2016-2021)
  • 2.2 Global Wafer Back Grinding Tapes Revenue Market Share by Manufacturers (2016-2021)
  • 2.3 Wafer Back Grinding Tapes Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
  • 2.4 Global Wafer Back Grinding Tapes Average Price by Manufacturers (2016-2021)
  • 2.5 Manufacturers Wafer Back Grinding Tapes Production Sites, Area Served, Product Types
  • 2.6 Wafer Back Grinding Tapes Market Competitive Situation and Trends
    • 2.6.1 Wafer Back Grinding Tapes Market Concentration Rate
    • 2.6.2 Global 5 and 10 Largest Wafer Back Grinding Tapes Players Market Share by Revenue
    • 2.6.3 Mergers & Acquisitions, Expansion

3 Production and Capacity by Region

  • 3.1 Global Production of Wafer Back Grinding Tapes Market Share by Region (2016-2021)
  • 3.2 Global Wafer Back Grinding Tapes Revenue Market Share by Region (2016-2021)
  • 3.3 Global Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.4 North America Wafer Back Grinding Tapes Production
    • 3.4.1 North America Wafer Back Grinding Tapes Production Growth Rate (2016-2021)
    • 3.4.2 North America Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.5 Europe Wafer Back Grinding Tapes Production
    • 3.5.1 Europe Wafer Back Grinding Tapes Production Growth Rate (2016-2021)
    • 3.5.2 Europe Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.6 China Wafer Back Grinding Tapes Production
    • 3.6.1 China Wafer Back Grinding Tapes Production Growth Rate (2016-2021)
    • 3.6.2 China Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
  • 3.7 Japan Wafer Back Grinding Tapes Production
    • 3.7.1 Japan Wafer Back Grinding Tapes Production Growth Rate (2016-2021)
    • 3.7.2 Japan Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)

4 Global Wafer Back Grinding Tapes Consumption by Region

  • 4.1 Global Wafer Back Grinding Tapes Consumption by Region
    • 4.1.1 Global Wafer Back Grinding Tapes Consumption by Region
    • 4.1.2 Global Wafer Back Grinding Tapes Consumption Market Share by Region
  • 4.2 North America
    • 4.2.1 North America Wafer Back Grinding Tapes Consumption by Country
    • 4.2.2 U.S.
    • 4.2.3 Canada
  • 4.3 Europe
    • 4.3.1 Europe Wafer Back Grinding Tapes Consumption by Country
    • 4.3.2 Germany
    • 4.3.3 France
    • 4.3.4 U.K.
    • 4.3.5 Italy
    • 4.3.6 Russia
  • 4.4 Asia Pacific
    • 4.4.1 Asia Pacific Wafer Back Grinding Tapes Consumption by Region
    • 4.4.2 China
    • 4.4.3 Japan
    • 4.4.4 South Korea
    • 4.4.5 Taiwan
    • 4.4.6 Southeast Asia
    • 4.4.7 India
    • 4.4.8 Australia
  • 4.5 Latin America
    • 4.5.1 Latin America Wafer Back Grinding Tapes Consumption by Country
    • 4.5.2 Mexico
    • 4.5.3 Brazil

5 Production, Revenue, Price Trend by Type

  • 5.1 Global Wafer Back Grinding Tapes Production Market Share by Type (2016-2021)
  • 5.2 Global Wafer Back Grinding Tapes Revenue Market Share by Type (2016-2021)
  • 5.3 Global Wafer Back Grinding Tapes Price by Type (2016-2021)

6 Consumption Analysis by Application

  • 6.1 Global Wafer Back Grinding Tapes Consumption Market Share by Application (2016-2021)
  • 6.2 Global Wafer Back Grinding Tapes Consumption Growth Rate by Application (2016-2021)

7 Key Companies Profiled

  • 7.1 Mitsui Chemicals Tohcello
    • 7.1.1 Mitsui Chemicals Tohcello Wafer Back Grinding Tapes Corporation Information
    • 7.1.2 Mitsui Chemicals Tohcello Wafer Back Grinding Tapes Product Portfolio
    • 7.1.3 Mitsui Chemicals Tohcello Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.1.4 Mitsui Chemicals Tohcello Main Business and Markets Served
    • 7.1.5 Mitsui Chemicals Tohcello Recent Developments/Updates
  • 7.2 Nitto
    • 7.2.1 Nitto Wafer Back Grinding Tapes Corporation Information
    • 7.2.2 Nitto Wafer Back Grinding Tapes Product Portfolio
    • 7.2.3 Nitto Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.2.4 Nitto Main Business and Markets Served
    • 7.2.5 Nitto Recent Developments/Updates
  • 7.3 LINTEC
    • 7.3.1 LINTEC Wafer Back Grinding Tapes Corporation Information
    • 7.3.2 LINTEC Wafer Back Grinding Tapes Product Portfolio
    • 7.3.3 LINTEC Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.3.4 LINTEC Main Business and Markets Served
    • 7.3.5 LINTEC Recent Developments/Updates
  • 7.4 Furukawa Electric
    • 7.4.1 Furukawa Electric Wafer Back Grinding Tapes Corporation Information
    • 7.4.2 Furukawa Electric Wafer Back Grinding Tapes Product Portfolio
    • 7.4.3 Furukawa Electric Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.4.4 Furukawa Electric Main Business and Markets Served
    • 7.4.5 Furukawa Electric Recent Developments/Updates
  • 7.5 Denka
    • 7.5.1 Denka Wafer Back Grinding Tapes Corporation Information
    • 7.5.2 Denka Wafer Back Grinding Tapes Product Portfolio
    • 7.5.3 Denka Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.5.4 Denka Main Business and Markets Served
    • 7.5.5 Denka Recent Developments/Updates
  • 7.6 D&X
    • 7.6.1 D&X Wafer Back Grinding Tapes Corporation Information
    • 7.6.2 D&X Wafer Back Grinding Tapes Product Portfolio
    • 7.6.3 D&X Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.6.4 D&X Main Business and Markets Served
    • 7.6.5 D&X Recent Developments/Updates
  • 7.7 AI Technology
    • 7.7.1 AI Technology Wafer Back Grinding Tapes Corporation Information
    • 7.7.2 AI Technology Wafer Back Grinding Tapes Product Portfolio
    • 7.7.3 AI Technology Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.7.4 AI Technology Main Business and Markets Served
    • 7.7.5 AI Technology Recent Developments/Updates
  • 7.8 Force-One Applied Materials
    • 7.8.1 Force-One Applied Materials Wafer Back Grinding Tapes Corporation Information
    • 7.8.2 Force-One Applied Materials Wafer Back Grinding Tapes Product Portfolio
    • 7.8.3 Force-One Applied Materials Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.8.4 Force-One Applied Materials Main Business and Markets Served
    • 7.7.5 Force-One Applied Materials Recent Developments/Updates
  • 7.9 AMC Co, Ltd
    • 7.9.1 AMC Co, Ltd Wafer Back Grinding Tapes Corporation Information
    • 7.9.2 AMC Co, Ltd Wafer Back Grinding Tapes Product Portfolio
    • 7.9.3 AMC Co, Ltd Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.9.4 AMC Co, Ltd Main Business and Markets Served
    • 7.9.5 AMC Co, Ltd Recent Developments/Updates
  • 7.10 Pantech Tape Co., Ltd
    • 7.10.1 Pantech Tape Co., Ltd Wafer Back Grinding Tapes Corporation Information
    • 7.10.2 Pantech Tape Co., Ltd Wafer Back Grinding Tapes Product Portfolio
    • 7.10.3 Pantech Tape Co., Ltd Wafer Back Grinding Tapes Production, Revenue, Price and Gross Margin (2016-2021)
    • 7.10.4 Pantech Tape Co., Ltd Main Business and Markets Served
    • 7.10.5 Pantech Tape Co., Ltd Recent Developments/Updates

8 Wafer Back Grinding Tapes Manufacturing Cost Analysis

  • 8.1 Wafer Back Grinding Tapes Key Raw Materials Analysis
    • 8.1.1 Key Raw Materials
    • 8.1.2 Key Raw Materials Price Trend
    • 8.1.3 Key Suppliers of Raw Materials
  • 8.2 Proportion of Manufacturing Cost Structure
  • 8.3 Manufacturing Process Analysis of Wafer Back Grinding Tapes
  • 8.4 Wafer Back Grinding Tapes Industrial Chain Analysis

9 Marketing Channel, Distributors and Customers

  • 9.1 Marketing Channel
  • 9.2 Wafer Back Grinding Tapes Distributors List
  • 9.3 Wafer Back Grinding Tapes Customers

10 Market Dynamics

  • 10.1 Wafer Back Grinding Tapes Industry Trends
  • 10.2 Wafer Back Grinding Tapes Growth Drivers
  • 10.3 Wafer Back Grinding Tapes Market Challenges
  • 10.4 Wafer Back Grinding Tapes Market Restraints

11 Production and Supply Forecast

  • 11.1 Global Forecasted Production of Wafer Back Grinding Tapes by Region (2022-2027)
  • 11.2 North America Wafer Back Grinding Tapes Production, Revenue Forecast (2022-2027)
  • 11.3 Europe Wafer Back Grinding Tapes Production, Revenue Forecast (2022-2027)
  • 11.4 China Wafer Back Grinding Tapes Production, Revenue Forecast (2022-2027)
  • 11.5 Japan Wafer Back Grinding Tapes Production, Revenue Forecast (2022-2027)

12 Consumption and Demand Forecast

  • 12.1 Global Forecasted Demand Analysis of Wafer Back Grinding Tapes
  • 12.2 North America Forecasted Consumption of Wafer Back Grinding Tapes by Country
  • 12.3 Europe Market Forecasted Consumption of Wafer Back Grinding Tapes by Country
  • 12.4 Asia Pacific Market Forecasted Consumption of Wafer Back Grinding Tapes by Region
  • 12.5 Latin America Forecasted Consumption of Wafer Back Grinding Tapes by Country

13 Forecast by Type and by Application (2022-2027)

  • 13.1 Global Production, Revenue and Price Forecast by Type (2022-2027)
    • 13.1.1 Global Forecasted Production of Wafer Back Grinding Tapes by Type (2022-2027)
    • 13.1.2 Global Forecasted Revenue of Wafer Back Grinding Tapes by Type (2022-2027)
    • 13.1.3 Global Forecasted Price of Wafer Back Grinding Tapes by Type (2022-2027)
  • 13.2 Global Forecasted Consumption of Wafer Back Grinding Tapes by Application (2022-2027)

14 Research Finding and Conclusion

    15 Methodology and Data Source

    • 15.1 Methodology/Research Approach
      • 15.1.1 Research Programs/Design
      • 15.1.2 Market Size Estimation
      • 15.1.3 Market Breakdown and Data Triangulation
    • 15.2 Data Source
      • 15.2.1 Secondary Sources
      • 15.2.2 Primary Sources
    • 15.3 Author List

    The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.

    Segment by Type
    UV Type
    Non-UV Type

    Segment by Application
    Standard
    Standard Thin Die
    (S)DBG(GAL)
    Bump

    By Company
    Mitsui Chemicals Tohcello
    Nitto
    LINTEC
    Furukawa Electric
    Denka
    D&X
    AI Technology
    Force-One Applied Materials
    AMC Co, Ltd
    Pantech Tape Co., Ltd

    Production by Region
    North America
    Europe
    China
    Japan

    Consumption by Region
    North America
    U.S.
    Canada
    Europe
    Germany
    France
    U.K.
    Italy
    Russia
    Asia-Pacific
    China
    Japan
    South Korea
    India
    Australia
    Taiwan
    Indonesia
    Thailand
    Malaysia
    Philippines
    Vietnam
    Latin America
    Mexico
    Brazil
    Argentina
    Middle East & Africa
    Turkey
    Saudi Arabia
    UAE

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