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Global Under Screen Fingerprint Module Packaging Market 2026 by Company, Regions, Type and Application, Forecast to 2032

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1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Classification of Under Screen Fingerprint Module Packaging by Type
    • 1.3.1 Overview: Global Under Screen Fingerprint Module Packaging Market Size by Type: 2021 Versus 2025 Versus 2032
    • 1.3.2 Global Under Screen Fingerprint Module Packaging Consumption Value Market Share by Type in 2025
    • 1.3.3 Optical Type
    • 1.3.4 Ultrasonic Type
    • 1.3.5 Capacitive Type
  • 1.4 Global Under Screen Fingerprint Module Packaging Market by Application
    • 1.4.1 Overview: Global Under Screen Fingerprint Module Packaging Market Size by Application: 2021 Versus 2025 Versus 2032
    • 1.4.2 Smartphone
    • 1.4.3 Tablet
    • 1.4.4 Smart Door Lock
    • 1.4.5 Others
  • 1.5 Global Under Screen Fingerprint Module Packaging Market Size & Forecast
  • 1.6 Global Under Screen Fingerprint Module Packaging Market Size and Forecast by Region
    • 1.6.1 Global Under Screen Fingerprint Module Packaging Market Size by Region: 2021 VS 2025 VS 2032
    • 1.6.2 Global Under Screen Fingerprint Module Packaging Market Size by Region, (2021-2032)
    • 1.6.3 North America Under Screen Fingerprint Module Packaging Market Size and Prospect (2021-2032)
    • 1.6.4 Europe Under Screen Fingerprint Module Packaging Market Size and Prospect (2021-2032)
    • 1.6.5 Asia-Pacific Under Screen Fingerprint Module Packaging Market Size and Prospect (2021-2032)
    • 1.6.6 South America Under Screen Fingerprint Module Packaging Market Size and Prospect (2021-2032)
    • 1.6.7 Middle East & Africa Under Screen Fingerprint Module Packaging Market Size and Prospect (2021-2032)

2 Company Profiles

  • 2.1 Samsung Electronics
    • 2.1.1 Samsung Electronics Details
    • 2.1.2 Samsung Electronics Major Business
    • 2.1.3 Samsung Electronics Under Screen Fingerprint Module Packaging Product and Solutions
    • 2.1.4 Samsung Electronics Under Screen Fingerprint Module Packaging Revenue, Gross Margin and Market Share (2021-2026)
    • 2.1.5 Samsung Electronics Recent Developments and Future Plans
  • 2.2 TDK
    • 2.2.1 TDK Details
    • 2.2.2 TDK Major Business
    • 2.2.3 TDK Under Screen Fingerprint Module Packaging Product and Solutions
    • 2.2.4 TDK Under Screen Fingerprint Module Packaging Revenue, Gross Margin and Market Share (2021-2026)
    • 2.2.5 TDK Recent Developments and Future Plans
  • 2.3 OFILM Group
    • 2.3.1 OFILM Group Details
    • 2.3.2 OFILM Group Major Business
    • 2.3.3 OFILM Group Under Screen Fingerprint Module Packaging Product and Solutions
    • 2.3.4 OFILM Group Under Screen Fingerprint Module Packaging Revenue, Gross Margin and Market Share (2021-2026)
    • 2.3.5 OFILM Group Recent Developments and Future Plans
  • 2.4 Q Technology Group
    • 2.4.1 Q Technology Group Details
    • 2.4.2 Q Technology Group Major Business
    • 2.4.3 Q Technology Group Under Screen Fingerprint Module Packaging Product and Solutions
    • 2.4.4 Q Technology Group Under Screen Fingerprint Module Packaging Revenue, Gross Margin and Market Share (2021-2026)
    • 2.4.5 Q Technology Group Recent Developments and Future Plans
  • 2.5 BYD Semiconductor
    • 2.5.1 BYD Semiconductor Details
    • 2.5.2 BYD Semiconductor Major Business
    • 2.5.3 BYD Semiconductor Under Screen Fingerprint Module Packaging Product and Solutions
    • 2.5.4 BYD Semiconductor Under Screen Fingerprint Module Packaging Revenue, Gross Margin and Market Share (2021-2026)
    • 2.5.5 BYD Semiconductor Recent Developments and Future Plans
  • 2.6 GIS Taiwan
    • 2.6.1 GIS Taiwan Details
    • 2.6.2 GIS Taiwan Major Business
    • 2.6.3 GIS Taiwan Under Screen Fingerprint Module Packaging Product and Solutions
    • 2.6.4 GIS Taiwan Under Screen Fingerprint Module Packaging Revenue, Gross Margin and Market Share (2021-2026)
    • 2.6.5 GIS Taiwan Recent Developments and Future Plans
  • 2.7 Truly Opto-electronics
    • 2.7.1 Truly Opto-electronics Details
    • 2.7.2 Truly Opto-electronics Major Business
    • 2.7.3 Truly Opto-electronics Under Screen Fingerprint Module Packaging Product and Solutions
    • 2.7.4 Truly Opto-electronics Under Screen Fingerprint Module Packaging Revenue, Gross Margin and Market Share (2021-2026)
    • 2.7.5 Truly Opto-electronics Recent Developments and Future Plans
  • 2.8 Primax Electronics
    • 2.8.1 Primax Electronics Details
    • 2.8.2 Primax Electronics Major Business
    • 2.8.3 Primax Electronics Under Screen Fingerprint Module Packaging Product and Solutions
    • 2.8.4 Primax Electronics Under Screen Fingerprint Module Packaging Revenue, Gross Margin and Market Share (2021-2026)
    • 2.8.5 Primax Electronics Recent Developments and Future Plans

3 Market Competition, by Players

  • 3.1 Global Under Screen Fingerprint Module Packaging Revenue and Share by Players (2021-2026)
  • 3.2 Market Share Analysis (2025)
    • 3.2.1 Market Share of Under Screen Fingerprint Module Packaging by Company Revenue
    • 3.2.2 Top 3 Under Screen Fingerprint Module Packaging Players Market Share in 2025
    • 3.2.3 Top 6 Under Screen Fingerprint Module Packaging Players Market Share in 2025
  • 3.3 Under Screen Fingerprint Module Packaging Market: Overall Company Footprint Analysis
    • 3.3.1 Under Screen Fingerprint Module Packaging Market: Region Footprint
    • 3.3.2 Under Screen Fingerprint Module Packaging Market: Company Product Type Footprint
    • 3.3.3 Under Screen Fingerprint Module Packaging Market: Company Product Application Footprint
  • 3.4 New Market Entrants and Barriers to Market Entry
  • 3.5 Mergers, Acquisition, Agreements, and Collaborations

4 Market Size Segment by Type

  • 4.1 Global Under Screen Fingerprint Module Packaging Consumption Value and Market Share by Type (2021-2026)
  • 4.2 Global Under Screen Fingerprint Module Packaging Market Forecast by Type (2027-2032)

5 Market Size Segment by Application

  • 5.1 Global Under Screen Fingerprint Module Packaging Consumption Value Market Share by Application (2021-2026)
  • 5.2 Global Under Screen Fingerprint Module Packaging Market Forecast by Application (2027-2032)

6 North America

  • 6.1 North America Under Screen Fingerprint Module Packaging Consumption Value by Type (2021-2032)
  • 6.2 North America Under Screen Fingerprint Module Packaging Market Size by Application (2021-2032)
  • 6.3 North America Under Screen Fingerprint Module Packaging Market Size by Country
    • 6.3.1 North America Under Screen Fingerprint Module Packaging Consumption Value by Country (2021-2032)
    • 6.3.2 United States Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 6.3.3 Canada Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 6.3.4 Mexico Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)

7 Europe

  • 7.1 Europe Under Screen Fingerprint Module Packaging Consumption Value by Type (2021-2032)
  • 7.2 Europe Under Screen Fingerprint Module Packaging Consumption Value by Application (2021-2032)
  • 7.3 Europe Under Screen Fingerprint Module Packaging Market Size by Country
    • 7.3.1 Europe Under Screen Fingerprint Module Packaging Consumption Value by Country (2021-2032)
    • 7.3.2 Germany Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 7.3.3 France Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 7.3.4 United Kingdom Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 7.3.5 Russia Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 7.3.6 Italy Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)

8 Asia-Pacific

  • 8.1 Asia-Pacific Under Screen Fingerprint Module Packaging Consumption Value by Type (2021-2032)
  • 8.2 Asia-Pacific Under Screen Fingerprint Module Packaging Consumption Value by Application (2021-2032)
  • 8.3 Asia-Pacific Under Screen Fingerprint Module Packaging Market Size by Region
    • 8.3.1 Asia-Pacific Under Screen Fingerprint Module Packaging Consumption Value by Region (2021-2032)
    • 8.3.2 China Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 8.3.3 Japan Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 8.3.4 South Korea Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 8.3.5 India Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 8.3.6 Southeast Asia Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 8.3.7 Australia Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)

9 South America

  • 9.1 South America Under Screen Fingerprint Module Packaging Consumption Value by Type (2021-2032)
  • 9.2 South America Under Screen Fingerprint Module Packaging Consumption Value by Application (2021-2032)
  • 9.3 South America Under Screen Fingerprint Module Packaging Market Size by Country
    • 9.3.1 South America Under Screen Fingerprint Module Packaging Consumption Value by Country (2021-2032)
    • 9.3.2 Brazil Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 9.3.3 Argentina Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)

10 Middle East & Africa

  • 10.1 Middle East & Africa Under Screen Fingerprint Module Packaging Consumption Value by Type (2021-2032)
  • 10.2 Middle East & Africa Under Screen Fingerprint Module Packaging Consumption Value by Application (2021-2032)
  • 10.3 Middle East & Africa Under Screen Fingerprint Module Packaging Market Size by Country
    • 10.3.1 Middle East & Africa Under Screen Fingerprint Module Packaging Consumption Value by Country (2021-2032)
    • 10.3.2 Turkey Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 10.3.3 Saudi Arabia Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)
    • 10.3.4 UAE Under Screen Fingerprint Module Packaging Market Size and Forecast (2021-2032)

11 Market Dynamics

  • 11.1 Under Screen Fingerprint Module Packaging Market Drivers
  • 11.2 Under Screen Fingerprint Module Packaging Market Restraints
  • 11.3 Under Screen Fingerprint Module Packaging Trends Analysis
  • 11.4 Porters Five Forces Analysis
    • 11.4.1 Threat of New Entrants
    • 11.4.2 Bargaining Power of Suppliers
    • 11.4.3 Bargaining Power of Buyers
    • 11.4.4 Threat of Substitutes
    • 11.4.5 Competitive Rivalry

12 Industry Chain Analysis

  • 12.1 Under Screen Fingerprint Module Packaging Industry Chain
  • 12.2 Under Screen Fingerprint Module Packaging Upstream Analysis
  • 12.3 Under Screen Fingerprint Module Packaging Midstream Analysis
  • 12.4 Under Screen Fingerprint Module Packaging Downstream Analysis

13 Research Findings and Conclusion

    14 Appendix

    • 14.1 Methodology
    • 14.2 Research Process and Data Source

    According to our (Global Info Research) latest study, the global Under Screen Fingerprint Module Packaging market size was valued at US$ 2446 million in 2025 and is forecast to a readjusted size of US$ 3294 million by 2032 with a CAGR of 4.4% during review period.
    Under-screen fingerprint module packaging is a key technology that integrates optical or ultrasonic fingerprint sensors under the smartphone screen, ensuring that the sensor can achieve efficient fingerprint recognition without affecting the screen display effect. This packaging method not only improves the overall aesthetics and user experience of the device, but also makes it possible to achieve a higher screen-to-body ratio. Under-screen fingerprint modules are usually composed of multiple components, including optical sensors, microlens arrays, filters, and protective layers, which work together to capture high-quality fingerprint images.
    This report is a detailed and comprehensive analysis for global Under Screen Fingerprint Module Packaging market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
    Key Features:
    Global Under Screen Fingerprint Module Packaging market size and forecasts, in consumption value ($ Million), 2021-2032
    Global Under Screen Fingerprint Module Packaging market size and forecasts by region and country, in consumption value ($ Million), 2021-2032
    Global Under Screen Fingerprint Module Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), 2021-2032
    Global Under Screen Fingerprint Module Packaging market shares of main players, in revenue ($ Million), 2021-2026
    The Primary Objectives in This Report Are:
    To determine the size of the total market opportunity of global and key countries
    To assess the growth potential for Under Screen Fingerprint Module Packaging
    To forecast future growth in each product and end-use market
    To assess competitive factors affecting the marketplace
    This report profiles key players in the global Under Screen Fingerprint Module Packaging market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Samsung Electronics, TDK, OFILM Group, Q Technology Group, BYD Semiconductor, GIS Taiwan, Truly Opto-electronics, Primax Electronics, etc.
    This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
    Market segmentation
    Under Screen Fingerprint Module Packaging market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
    Market segment by Type
    Optical Type
    Ultrasonic Type
    Capacitive Type
    Market segment by Application
    Smartphone
    Tablet
    Smart Door Lock
    Others
    Market segment by players, this report covers
    Samsung Electronics
    TDK
    OFILM Group
    Q Technology Group
    BYD Semiconductor
    GIS Taiwan
    Truly Opto-electronics
    Primax Electronics
    Market segment by regions, regional analysis covers
    North America (United States, Canada and Mexico)
    Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
    Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
    South America (Brazil, Rest of South America)
    Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
    The content of the study subjects, includes a total of 13 chapters:
    Chapter 1, to describe Under Screen Fingerprint Module Packaging product scope, market overview, market estimation caveats and base year.
    Chapter 2, to profile the top players of Under Screen Fingerprint Module Packaging, with revenue, gross margin, and global market share of Under Screen Fingerprint Module Packaging from 2021 to 2026.
    Chapter 3, the Under Screen Fingerprint Module Packaging competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
    Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2021 to 2032.
    Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2021 to 2026.and Under Screen Fingerprint Module Packaging market forecast, by regions, by Type and by Application, with consumption value, from 2027 to 2032.
    Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
    Chapter 12, the key raw materials and key suppliers, and industry chain of Under Screen Fingerprint Module Packaging.
    Chapter 13, to describe Under Screen Fingerprint Module Packaging research findings and conclusion.

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