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Global Through Glass Via (TGV) Wafer Market Size, Status and Forecast 2019-2025

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Table of Contents

    1 Report Overview

    • 1.1 Study Scope
    • 1.2 Key Market Segments
    • 1.3 Players Covered
    • 1.4 Market Analysis by Type
      • 1.4.1 Global Through Glass Via (TGV) Wafer Market Size Growth Rate by Type (2014-2025)
      • 1.4.2 300 mm
      • 1.4.3 200 mm
      • 1.4.4 Below150 mm
    • 1.5 Market by Application
      • 1.5.1 Global Through Glass Via (TGV) Wafer Market Share by Application (2019-2025)
      • 1.5.2 Biotechnology/Medical
      • 1.5.3 Consumer Electronics
      • 1.5.4 Automotive
      • 1.5.5 Others
    • 1.6 Study Objectives
    • 1.7 Years Considered

    2 Global Growth Trends

    • 2.1 Through Glass Via (TGV) Wafer Market Size
    • 2.2 Through Glass Via (TGV) Wafer Growth Trends by Regions
      • 2.2.1 Through Glass Via (TGV) Wafer Market Size by Regions (2019-2025)
      • 2.2.2 Through Glass Via (TGV) Wafer Market Share by Regions (2014-2019)
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers
      • 2.3.3 Market Challenges
      • 2.3.4 Porter’s Five Forces Analysis

    3 Market Share by Key Players

    • 3.1 Through Glass Via (TGV) Wafer Market Size by by Players
      • 3.1.1 Global Through Glass Via (TGV) Wafer Revenue by by Players (2014-2019)
      • 3.1.2 Global Through Glass Via (TGV) Wafer Revenue Market Share by by Players (2014-2019)
      • 3.1.3 Global Through Glass Via (TGV) Wafer Market Concentration Ratio (CR5 and HHI)
    • 3.2 Through Glass Via (TGV) Wafer Key Players Head office and Area Served
    • 3.3 Key Players Through Glass Via (TGV) Wafer Product/Solution/Service
    • 3.4 Date of Enter into Through Glass Via (TGV) Wafer Market
    • 3.5 Mergers & Acquisitions, Expansion Plans

    4 Breakdown Data by Type and Application

    • 4.1 Global Through Glass Via (TGV) Wafer Market Size by Type (2014-2019)
    • 4.2 Global Through Glass Via (TGV) Wafer Market Size by Application (2014-2019)

    5 United States

    • 5.1 United States Through Glass Via (TGV) Wafer Market Size (2014-2019)
    • 5.2 Through Glass Via (TGV) Wafer Key Players in United States
    • 5.3 United States Through Glass Via (TGV) Wafer Market Size by Type
    • 5.4 United States Through Glass Via (TGV) Wafer Market Size by Application

    6 Europe

    • 6.1 Europe Through Glass Via (TGV) Wafer Market Size (2014-2019)
    • 6.2 Through Glass Via (TGV) Wafer Key Players in Europe
    • 6.3 Europe Through Glass Via (TGV) Wafer Market Size by Type
    • 6.4 Europe Through Glass Via (TGV) Wafer Market Size by Application

    7 Japan

    • 7.1 Japan Through Glass Via (TGV) Wafer Market Size (2014-2019)
    • 7.2 Through Glass Via (TGV) Wafer Key Players in Japan
    • 7.3 Japan Through Glass Via (TGV) Wafer Market Size by Type
    • 7.4 Japan Through Glass Via (TGV) Wafer Market Size by Application

    8 International Players Profiles

    • 8.1 Corning
      • 8.1.1 Corning Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Through Glass Via (TGV) Wafer Introduction
      • 8.1.4 Corning Revenue in Through Glass Via (TGV) Wafer Business (2014-2019))
      • 8.1.5 Corning Recent Development
    • 8.2 LPKF
      • 8.2.1 LPKF Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Through Glass Via (TGV) Wafer Introduction
      • 8.2.4 LPKF Revenue in Through Glass Via (TGV) Wafer Business (2014-2019)
      • 8.2.5 LPKF Recent Development
    • 8.3 Samtec
      • 8.3.1 Samtec Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Through Glass Via (TGV) Wafer Introduction
      • 8.3.4 Samtec Revenue in Through Glass Via (TGV) Wafer Business (2014-2019)
      • 8.3.5 Samtec Recent Development
    • 8.4 Kiso Micro Co.LTD
      • 8.4.1 Kiso Micro Co.LTD Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Through Glass Via (TGV) Wafer Introduction
      • 8.4.4 Kiso Micro Co.LTD Revenue in Through Glass Via (TGV) Wafer Business (2014-2019)
      • 8.4.5 Kiso Micro Co.LTD Recent Development
    • 8.5 Tecnisco
      • 8.5.1 Tecnisco Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Through Glass Via (TGV) Wafer Introduction
      • 8.5.4 Tecnisco Revenue in Through Glass Via (TGV) Wafer Business (2014-2019)
      • 8.5.5 Tecnisco Recent Development
    • 8.6 Microplex
      • 8.6.1 Microplex Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Through Glass Via (TGV) Wafer Introduction
      • 8.6.4 Microplex Revenue in Through Glass Via (TGV) Wafer Business (2014-2019)
      • 8.6.5 Microplex Recent Development
    • 8.7 Plan Optik
      • 8.7.1 Plan Optik Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Through Glass Via (TGV) Wafer Introduction
      • 8.7.4 Plan Optik Revenue in Through Glass Via (TGV) Wafer Business (2014-2019)
      • 8.7.5 Plan Optik Recent Development
    • 8.8 NSG Group
      • 8.8.1 NSG Group Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Through Glass Via (TGV) Wafer Introduction
      • 8.8.4 NSG Group Revenue in Through Glass Via (TGV) Wafer Business (2014-2019)
      • 8.8.5 NSG Group Recent Development
    • 8.9 Allvia
      • 8.9.1 Allvia Company Details
      • 8.9.2 Company Description and Business Overview
      • 8.9.3 Through Glass Via (TGV) Wafer Introduction
      • 8.9.4 Allvia Revenue in Through Glass Via (TGV) Wafer Business (2014-2019)
      • 8.9.5 Allvia Recent Development

    9 Market Forecast 2019-2025

    • 9.1 Market Size Forecast by Product (2019-2025)
    • 9.2 Market Size Forecast by Application (2019-2025)
    • 9.3 Market Size Forecast by Regions
    • 9.4 United States
    • 9.5 Europe
    • 9.6 Japan

    10 Analyst's Viewpoints/Conclusions

      11 Appendix

      • 11.1 Research Methodology
        • 11.1.1 Methodology/Research Approach
          • 11.1.1.1 Research Programs/Design
          • 11.1.1.2 Market Size Estimation
          • 11.1.1.3 Market Breakdown and Data Triangulation
        • 11.1.2 Data Source
          • 11.1.2.1 Secondary Sources
          • 11.1.2.2 Primary Sources
      • 11.2 Disclaimer

      This report focuses on the global Through Glass Via (TGV) Wafer status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Through Glass Via (TGV) Wafer development in United States, Europe and Japan.

      The key players covered in this study
      Corning
      LPKF
      Samtec
      Kiso Micro Co.LTD
      Tecnisco
      Microplex
      Plan Optik
      NSG Group
      Allvia

      Market segment by Type, the product can be split into
      300 mm
      200 mm
      Below150 mm

      300 mm Occupy the largest market share segmentation reached 64% and the fastest growth

      Market segment by Application, split into
      Biotechnology/Medical
      Consumer Electronics
      Automotive
      Others

      The largest segment is 56%; Biotechnology/Medical is the fastest growing

      Market segment by Regions/Countries, this report covers
      United States
      Europe
      Japan

      The study objectives of this report are:
      To analyze global Through Glass Via (TGV) Wafer status, future forecast, growth opportunity, key market and key players.
      To present the Through Glass Via (TGV) Wafer development in United States, Europe and Japan.
      To strategically profile the key players and comprehensively analyze their development plan and strategies.
      To define, describe and forecast the market by product type, market and key regions.

      In this study, the years considered to estimate the market size of Through Glass Via (TGV) Wafer are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025
      For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

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