SiC Semiconductor Processing Equipment Market Report – Research, Industry Analysis Reports and Market Demands

Global SiC Semiconductor Processing Equipment Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032

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Table of Content

1 Market Overview

1.1 Product Overview and Scope
1.2 Market Estimation Caveats and Base Year
1.3 Market Analysis by Equipment Type
- 1.3.1 Overview: Global SiC Semiconductor Processing Equipment Consumption Value by Equipment Type: 2021 Versus 2025 Versus 2032
- 1.3.2 SiC Crystal Growth Furnace
- 1.3.3 SiC Cutting Equipment
- 1.3.4 SiC Epitaxy/HTCVD Equipment
- 1.3.5 SiC Grinding/CMP Equipment
- 1.3.6 SiC Deposition Equipment
- 1.3.7 SiC Thermal Processing Equipment
- 1.3.8 SiC Etch and Clean Equipment
- 1.3.9 SiC Ion Implant Equipment
- 1.3.10 SiC Patterning Equipment
1.4 Market Analysis by SiC Wafer Size
- 1.4.1 Overview: Global SiC Semiconductor Processing Equipment Consumption Value by SiC Wafer Size: 2021 Versus 2025 Versus 2032
- 1.4.2 150mm SiC Equipment
- 1.4.3 200mm SiC Equipment
- 1.4.4 Others
1.5 Market Analysis by Device Type
- 1.5.1 Overview: Global SiC Semiconductor Processing Equipment Consumption Value by Device Type: 2021 Versus 2025 Versus 2032
- 1.5.2 SiC MOSFET
- 1.5.3 SiC Diode
- 1.5.4 Others
1.6 Market Analysis by Application
- 1.6.1 Overview: Global SiC Semiconductor Processing Equipment Consumption Value by Application: 2021 Versus 2025 Versus 2032
- 1.6.2 Silicon Carbide Wafer
- 1.6.3 Silicon Carbide Epitaxial Wafer
- 1.6.4 Silicon Carbide Devices
1.7 Global SiC Semiconductor Processing Equipment Market Size & Forecast
- 1.7.1 Global SiC Semiconductor Processing Equipment Consumption Value (2021 & 2025 & 2032)
- 1.7.2 Global SiC Semiconductor Processing Equipment Sales Quantity (2021-2032)
- 1.7.3 Global SiC Semiconductor Processing Equipment Average Price (2021-2032)

2 Manufacturers Profiles

3 Competitive Environment: SiC Semiconductor Processing Equipment by Manufacturer

3.1 Global SiC Semiconductor Processing Equipment Sales Quantity by Manufacturer (2021-2026)
3.2 Global SiC Semiconductor Processing Equipment Revenue by Manufacturer (2021-2026)
3.3 Global SiC Semiconductor Processing Equipment Average Price by Manufacturer (2021-2026)
3.4 Market Share Analysis (2025)
- 3.4.1 Producer Shipments of SiC Semiconductor Processing Equipment by Manufacturer Revenue ($MM) and Market Share (%): 2025
- 3.4.2 Top 3 SiC Semiconductor Processing Equipment Manufacturer Market Share in 2025
- 3.4.3 Top 6 SiC Semiconductor Processing Equipment Manufacturer Market Share in 2025
3.5 SiC Semiconductor Processing Equipment Market: Overall Company Footprint Analysis
- 3.5.1 SiC Semiconductor Processing Equipment Market: Region Footprint
- 3.5.2 SiC Semiconductor Processing Equipment Market: Company Product Type Footprint
- 3.5.3 SiC Semiconductor Processing Equipment Market: Company Product Application Footprint
3.6 New Market Entrants and Barriers to Market Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

4.1 Global SiC Semiconductor Processing Equipment Market Size by Region
- 4.1.1 Global SiC Semiconductor Processing Equipment Sales Quantity by Region (2021-2032)
- 4.1.2 Global SiC Semiconductor Processing Equipment Consumption Value by Region (2021-2032)
- 4.1.3 Global SiC Semiconductor Processing Equipment Average Price by Region (2021-2032)
4.2 North America SiC Semiconductor Processing Equipment Consumption Value (2021-2032)
4.3 Europe SiC Semiconductor Processing Equipment Consumption Value (2021-2032)
4.4 Asia-Pacific SiC Semiconductor Processing Equipment Consumption Value (2021-2032)
4.5 South America SiC Semiconductor Processing Equipment Consumption Value (2021-2032)
4.6 Middle East & Africa SiC Semiconductor Processing Equipment Consumption Value (2021-2032)

5 Market Segment by Equipment Type

5.1 Global SiC Semiconductor Processing Equipment Sales Quantity by Equipment Type (2021-2032)
5.2 Global SiC Semiconductor Processing Equipment Consumption Value by Equipment Type (2021-2032)
5.3 Global SiC Semiconductor Processing Equipment Average Price by Equipment Type (2021-2032)

6 Market Segment by Application

6.1 Global SiC Semiconductor Processing Equipment Sales Quantity by Application (2021-2032)
6.2 Global SiC Semiconductor Processing Equipment Consumption Value by Application (2021-2032)
6.3 Global SiC Semiconductor Processing Equipment Average Price by Application (2021-2032)

7 North America

7.1 North America SiC Semiconductor Processing Equipment Sales Quantity by Equipment Type (2021-2032)
7.2 North America SiC Semiconductor Processing Equipment Sales Quantity by Application (2021-2032)
7.3 North America SiC Semiconductor Processing Equipment Market Size by Country
- 7.3.1 North America SiC Semiconductor Processing Equipment Sales Quantity by Country (2021-2032)
- 7.3.2 North America SiC Semiconductor Processing Equipment Consumption Value by Country (2021-2032)
- 7.3.3 United States Market Size and Forecast (2021-2032)
- 7.3.4 Canada Market Size and Forecast (2021-2032)
- 7.3.5 Mexico Market Size and Forecast (2021-2032)

8 Europe

8.1 Europe SiC Semiconductor Processing Equipment Sales Quantity by Equipment Type (2021-2032)
8.2 Europe SiC Semiconductor Processing Equipment Sales Quantity by Application (2021-2032)
8.3 Europe SiC Semiconductor Processing Equipment Market Size by Country
- 8.3.1 Europe SiC Semiconductor Processing Equipment Sales Quantity by Country (2021-2032)
- 8.3.2 Europe SiC Semiconductor Processing Equipment Consumption Value by Country (2021-2032)
- 8.3.3 Germany Market Size and Forecast (2021-2032)
- 8.3.4 France Market Size and Forecast (2021-2032)
- 8.3.5 United Kingdom Market Size and Forecast (2021-2032)
- 8.3.6 Russia Market Size and Forecast (2021-2032)
- 8.3.7 Italy Market Size and Forecast (2021-2032)

9 Asia-Pacific

9.1 Asia-Pacific SiC Semiconductor Processing Equipment Sales Quantity by Equipment Type (2021-2032)
9.2 Asia-Pacific SiC Semiconductor Processing Equipment Sales Quantity by Application (2021-2032)
9.3 Asia-Pacific SiC Semiconductor Processing Equipment Market Size by Region
- 9.3.1 Asia-Pacific SiC Semiconductor Processing Equipment Sales Quantity by Region (2021-2032)
- 9.3.2 Asia-Pacific SiC Semiconductor Processing Equipment Consumption Value by Region (2021-2032)
- 9.3.3 China Market Size and Forecast (2021-2032)
- 9.3.4 Japan Market Size and Forecast (2021-2032)
- 9.3.5 South Korea Market Size and Forecast (2021-2032)
- 9.3.6 India Market Size and Forecast (2021-2032)
- 9.3.7 Southeast Asia Market Size and Forecast (2021-2032)
- 9.3.8 Australia Market Size and Forecast (2021-2032)

10 South America

10.1 South America SiC Semiconductor Processing Equipment Sales Quantity by Equipment Type (2021-2032)
10.2 South America SiC Semiconductor Processing Equipment Sales Quantity by Application (2021-2032)
10.3 South America SiC Semiconductor Processing Equipment Market Size by Country
- 10.3.1 South America SiC Semiconductor Processing Equipment Sales Quantity by Country (2021-2032)
- 10.3.2 South America SiC Semiconductor Processing Equipment Consumption Value by Country (2021-2032)
- 10.3.3 Brazil Market Size and Forecast (2021-2032)
- 10.3.4 Argentina Market Size and Forecast (2021-2032)

11 Middle East & Africa

11.1 Middle East & Africa SiC Semiconductor Processing Equipment Sales Quantity by Equipment Type (2021-2032)
11.2 Middle East & Africa SiC Semiconductor Processing Equipment Sales Quantity by Application (2021-2032)
11.3 Middle East & Africa SiC Semiconductor Processing Equipment Market Size by Country
- 11.3.1 Middle East & Africa SiC Semiconductor Processing Equipment Sales Quantity by Country (2021-2032)
- 11.3.2 Middle East & Africa SiC Semiconductor Processing Equipment Consumption Value by Country (2021-2032)
- 11.3.3 Turkey Market Size and Forecast (2021-2032)
- 11.3.4 Egypt Market Size and Forecast (2021-2032)
- 11.3.5 Saudi Arabia Market Size and Forecast (2021-2032)
- 11.3.6 South Africa Market Size and Forecast (2021-2032)

12 Market Dynamics

12.1 SiC Semiconductor Processing Equipment Market Drivers
12.2 SiC Semiconductor Processing Equipment Market Restraints
12.3 SiC Semiconductor Processing Equipment Trends Analysis
12.4 Porters Five Forces Analysis
- 12.4.1 Threat of New Entrants
- 12.4.2 Bargaining Power of Suppliers
- 12.4.3 Bargaining Power of Buyers
- 12.4.4 Threat of Substitutes
- 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

13.1 Raw Material of SiC Semiconductor Processing Equipment and Key Manufacturers
13.2 Manufacturing Costs Percentage of SiC Semiconductor Processing Equipment
13.3 SiC Semiconductor Processing Equipment Production Process
13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

14.1 Sales Channel
- 14.1.1 Direct to End-User
- 14.1.2 Distributors
14.2 SiC Semiconductor Processing Equipment Typical Distributors
14.3 SiC Semiconductor Processing Equipment Typical Customers

15 Research Findings and Conclusion

16 Appendix

16.1 Methodology
16.2 Research Process and Data Source

Description

According to our (Global Info Research) latest study, the global SiC Semiconductor Processing Equipment market size was valued at US$ 3373 million in 2025 and is forecast to a readjusted size of US$ 8075 million by 2032 with a CAGR of 14.0% during review period.
SiC Semiconductor Processing Equipment refers to the core toolsets required across the SiC value chain—SiC substrate manufacturing, SiC epitaxy, and SiC device front-end processing—with the emphasis on tools that directly determine yield, reliability, and cost per cm². Compared with silicon, SiC processing imposes distinct equipment requirements driven by (i) a hard/brittle wafering and surface-finishing regime, and (ii) a device flow that typically depends on heated ion implantation, very high-temperature activation anneals, and robust plasma etching/ohmic-contact formation, making thermal budgets, chamber materials, particle control, and defect sensitivity materially more demanding.
The market can be framed around 10 core equipment categories: (1) SiC crystal growth (PVT) platforms engineered for long-cycle thermal-field stability (e.g., PVA TePla/CGS highlights PVT systems for SiC single crystals); (2) boule processing & wafering (orientation/end-face, slicing) to reduce kerf loss and increase wafers per boule (e.g., DISCO’s KABRA laser ingot slicing applicable to SiC; Okamoto’s SiC ingot grinding/orientation workflow); (3) wafer surface finishing (grinding/lapping/DSP/CMP) to reach tight TTV/warp and nanometer-scale surfaces (e.g., EBARA CMP systems emphasize nano-level planarity and contamination/particle mitigation concepts); (4) cleaning & surface preparation (single-wafer/batch, megasonic, dry-in/dry-out) to manage particle sensitivity (e.g., SCREEN single-wafer cleaner product line); (5) metrology & defect inspection for substrates/epi/patterned wafers—closing feedback loops on BPDs/stacking faults and other SiC-relevant defects (e.g., KLA Candela for SiC-oriented inspection and classification); (6) SiC epitaxy (high-temperature CVD reactors) focused on low defectivity, thickness/doping uniformity, and output per m² (e.g., AIXTRON G10-SiC for 150/200 mm; ASM PE2O8 positioned for yield/throughput/cost); (7) lithography & track (often mainstream silicon toolsets, but critical for trench/termination patterning); (8) plasma etch & ash/strip where SiC deep/trench etches demand high-density plasma with low damage and tight profile control (e.g., Oxford Instruments’ ICP-RIE tooling and SiC-focused etch content); (9) thin film deposition & metallization (CVD/ALD/PVD) for dielectrics/barriers/metals (Applied Materials summarizes PVD/CVD/ALD as core deposition technologies in semiconductor manufacturing); and (10) doping & thermal processing (implant/activation anneal/oxidation) that defines the SiC “high-temperature window” (Axcelis highlights high-temperature implant capability and Si/SiC flexibility; Nissin highlights high-temperature SiC implantation; centrotherm positions c.ACTIVATOR for up to 2000°C anneals and c.OXIDATOR for SiC oxidation/anneal up to 1500°C).
The equipment challenge in SiC is inherently cross-step coupled: upstream wafering/surface finishing must minimize damage layers and particles on a hard/brittle material; epitaxy must control defect propagation and doping/thickness uniformity that directly map into device blocking/leakage behavior; and device fabrication typically requires heated implantation followed by extreme-temperature activation anneals, while plasma etches (especially trenches/deep features) must balance rate, selectivity, and low-damage surfaces to avoid reliability penalties (interface traps, leakage, oxide integrity). Meanwhile, SiC’s defect spectrum (e.g., BPDs, stacking faults) drives a stronger pull for inspection + classification + feedback earlier in the flow to reduce downstream scrap of high-value processed wafers.
The current industry posture is moving from “materials bottleneck” to “manufacturing system competition,” where tool value is measured by throughput × yield × repeatability × cost-of-ownership rather than single-step capability. A second structural driver is the accelerating transition toward 200 mm SiC manufacturing, which triggers a new capex cycle across epitaxy, thermal, metrology, and cleaning. Public disclosures illustrate this clearly: Infineon explicitly references shifting SiC manufacturing to 200-mm wafers; ST announced a high-volume 200-mm SiC manufacturing facility in Catania; and Wolfspeed continues to position 200-mm materials/device scaling as central to its roadmap. On the equipment side, AIXTRON’s G10-SiC shipment milestone explicitly ties demand to ramping 200-mm SiC epitaxy capacity—highlighting high-throughput epitaxy as a key expansion lever.
Looking forward, equipment growth is driven by (i) electrification and energy-efficiency demand from EV (incl. 800V architectures), renewables/storage, industrial power and grid, sustaining SiC capacity build-outs; (ii) the industry pivot from capacity to cost curve reduction, pushing tool roadmaps toward higher wafer output per m², longer stable runs, and deeper automation/SPC; and (iii) three practical “battlefields” for tool innovation: wafering/surface finishing (damage/kerf reduction), epitaxy (defectivity + throughput), and implant/anneal/oxidation/clean (high-temperature capability with ultra-low contamination). Along the chain, upstream consumables and critical parts (hot-zone materials, process gases/chemicals, chamber materials/coatings) increasingly co-evolve with tool design; midstream equipment suppliers differentiate via integrated process windows and service uptime; and downstream SiC substrate/epi/device makers require faster qualification loops—making joint development and platform standardization more common in the 200-mm era.
This report is a detailed and comprehensive analysis for global SiC Semiconductor Processing Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Equipment Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global SiC Semiconductor Processing Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2021-2032
Global SiC Semiconductor Processing Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2021-2032
Global SiC Semiconductor Processing Equipment market size and forecasts, by Equipment Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2021-2032
Global SiC Semiconductor Processing Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for SiC Semiconductor Processing Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global SiC Semiconductor Processing Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Applied Materials, KLA SPTS, Lam, Tel, Axcelis, Centrotherm, ULVAC, PVA TePla, NAURA, Kokusai, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
SiC Semiconductor Processing Equipment market is split by Equipment Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Equipment Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Equipment Type
SiC Crystal Growth Furnace
SiC Cutting Equipment
SiC Epitaxy/HTCVD Equipment
SiC Grinding/CMP Equipment
SiC Deposition Equipment
SiC Thermal Processing Equipment
SiC Etch and Clean Equipment
SiC Ion Implant Equipment
SiC Patterning Equipment
SiC Metrology and Inspection Equipment
SiC Wafer Bonders
Others
Market segment by SiC Wafer Size
150mm SiC Equipment
200mm SiC Equipment
Others
Market segment by Device Type
SiC MOSFET
SiC Diode
Others
Market segment by Application
Silicon Carbide Wafer
Silicon Carbide Epitaxial Wafer
Silicon Carbide Devices
Major players covered
Applied Materials
KLA SPTS
Lam
Tel
Axcelis
Centrotherm
ULVAC
PVA TePla
NAURA
Kokusai
SCREEN
Sumitomo
Nissin Ion
Oxford Instruments
ASML
Nikon
Canon
AIXTRON
ASM/LPE
Accretech
DISCO
Okamoto
Lasertec
Advantest
Teradyne
Crystal Growth & Energy Equipment Inc.
Han's Laser Technology Industry
Beijing TSD Semiconductor Co., Ltd.
Shenzhen Naso Tech
Beijing U-Precision Tech
AMIES Technology
Gurui Semiconductor Equipment (Guangzhou)
Angkun Vision (Beijing) Technology
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe SiC Semiconductor Processing Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of SiC Semiconductor Processing Equipment, with price, sales quantity, revenue, and global market share of SiC Semiconductor Processing Equipment from 2021 to 2026.
Chapter 3, the SiC Semiconductor Processing Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the SiC Semiconductor Processing Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Equipment Type and by Application, with sales market share and growth rate by Equipment Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and SiC Semiconductor Processing Equipment market forecast, by regions, by Equipment Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of SiC Semiconductor Processing Equipment.
Chapter 14 and 15, to describe SiC Semiconductor Processing Equipment sales channel, distributors, customers, research findings and conclusion.

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