Semiconductor Packaging and Testing Equipment Market Report – Research, Industry Analysis Reports and Market Demands

Global Semiconductor Packaging and Testing Equipment Supply, Demand and Key Producers, 2026-2032

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Table of Content

1 Supply Summary

1.1 Semiconductor Packaging and Testing Equipment Introduction
1.2 World Semiconductor Packaging and Testing Equipment Supply & Forecast
- 1.2.1 World Semiconductor Packaging and Testing Equipment Production Value (2021 & 2025 & 2032)
- 1.2.2 World Semiconductor Packaging and Testing Equipment Production (2021-2032)
- 1.2.3 World Semiconductor Packaging and Testing Equipment Pricing Trends (2021-2032)
1.3 World Semiconductor Packaging and Testing Equipment Production by Region (Based on Production Site)
- 1.3.1 World Semiconductor Packaging and Testing Equipment Production Value by Region (2021-2032)
- 1.3.2 World Semiconductor Packaging and Testing Equipment Production by Region (2021-2032)
- 1.3.3 World Semiconductor Packaging and Testing Equipment Average Price by Region (2021-2032)
- 1.3.4 North America Semiconductor Packaging and Testing Equipment Production (2021-2032)
- 1.3.5 Europe Semiconductor Packaging and Testing Equipment Production (2021-2032)
- 1.3.6 China Semiconductor Packaging and Testing Equipment Production (2021-2032)
- 1.3.7 Japan Semiconductor Packaging and Testing Equipment Production (2021-2032)
- 1.3.8 South Korea Semiconductor Packaging and Testing Equipment Production (2021-2032)
1.4 Market Drivers, Restraints and Trends
- 1.4.1 Semiconductor Packaging and Testing Equipment Market Drivers
- 1.4.2 Factors Affecting Demand
- 1.4.3 Semiconductor Packaging and Testing Equipment Major Market Trends

2 Demand Summary

2.1 World Semiconductor Packaging and Testing Equipment Demand (2021-2032)
2.2 World Semiconductor Packaging and Testing Equipment Consumption by Region
- 2.2.1 World Semiconductor Packaging and Testing Equipment Consumption by Region (2021-2026)
- 2.2.2 World Semiconductor Packaging and Testing Equipment Consumption Forecast by Region (2027-2032)
2.3 United States Semiconductor Packaging and Testing Equipment Consumption (2021-2032)
2.4 China Semiconductor Packaging and Testing Equipment Consumption (2021-2032)
2.5 Europe Semiconductor Packaging and Testing Equipment Consumption (2021-2032)
2.6 Japan Semiconductor Packaging and Testing Equipment Consumption (2021-2032)
2.7 South Korea Semiconductor Packaging and Testing Equipment Consumption (2021-2032)
2.8 ASEAN Semiconductor Packaging and Testing Equipment Consumption (2021-2032)
2.9 India Semiconductor Packaging and Testing Equipment Consumption (2021-2032)

3 World Manufacturers Competitive Analysis

3.1 World Semiconductor Packaging and Testing Equipment Production Value by Manufacturer (2021-2026)
3.2 World Semiconductor Packaging and Testing Equipment Production by Manufacturer (2021-2026)
3.3 World Semiconductor Packaging and Testing Equipment Average Price by Manufacturer (2021-2026)
3.4 Semiconductor Packaging and Testing Equipment Company Evaluation Quadrant
3.5 Industry Rank and Concentration Rate (CR)
- 3.5.1 Global Semiconductor Packaging and Testing Equipment Industry Rank of Major Manufacturers
- 3.5.2 Global Concentration Ratios (CR4) for Semiconductor Packaging and Testing Equipment in 2025
- 3.5.3 Global Concentration Ratios (CR8) for Semiconductor Packaging and Testing Equipment in 2025
3.6 Semiconductor Packaging and Testing Equipment Market: Overall Company Footprint Analysis
- 3.6.1 Semiconductor Packaging and Testing Equipment Market: Region Footprint
- 3.6.2 Semiconductor Packaging and Testing Equipment Market: Company Product Type Footprint
- 3.6.3 Semiconductor Packaging and Testing Equipment Market: Company Product Application Footprint
3.7 Competitive Environment
- 3.7.1 Historical Structure of the Industry
- 3.7.2 Barriers of Market Entry
- 3.7.3 Factors of Competition
3.8 New Entrant and Capacity Expansion Plans
3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World

5 Market Analysis by Type

5.1 World Semiconductor Packaging and Testing Equipment Market Size Overview by Type: 2021 VS 2025 VS 2032
5.2 Segment Introduction by Type
- 5.2.1 Semiconductor Testing Equipment
- 5.2.2 Semiconductor Packaging Equipment
5.3 Market Segment by Type
- 5.3.1 World Semiconductor Packaging and Testing Equipment Production by Type (2021-2032)
- 5.3.2 World Semiconductor Packaging and Testing Equipment Production Value by Type (2021-2032)
- 5.3.3 World Semiconductor Packaging and Testing Equipment Average Price by Type (2021-2032)

6 Market Analysis by Application

6.1 World Semiconductor Packaging and Testing Equipment Market Size Overview by Application: 2021 VS 2025 VS 2032
6.2 Segment Introduction by Application
- 6.2.1 IDM Enterprise
- 6.2.2 Foundry
6.3 Market Segment by Application
- 6.3.1 World Semiconductor Packaging and Testing Equipment Production by Application (2021-2032)
- 6.3.2 World Semiconductor Packaging and Testing Equipment Production Value by Application (2021-2032)
- 6.3.3 World Semiconductor Packaging and Testing Equipment Average Price by Application (2021-2032)

7 Company Profiles

8 Industry Chain Analysis

8.1 Semiconductor Packaging and Testing Equipment Industry Chain
8.2 Semiconductor Packaging and Testing Equipment Upstream Analysis
- 8.2.1 Semiconductor Packaging and Testing Equipment Core Raw Materials
- 8.2.2 Main Manufacturers of Semiconductor Packaging and Testing Equipment Core Raw Materials
8.3 Midstream Analysis
8.4 Downstream Analysis
8.5 Semiconductor Packaging and Testing Equipment Production Mode
8.6 Semiconductor Packaging and Testing Equipment Procurement Model
8.7 Semiconductor Packaging and Testing Equipment Industry Sales Model and Sales Channels
- 8.7.1 Semiconductor Packaging and Testing Equipment Sales Model
- 8.7.2 Semiconductor Packaging and Testing Equipment Typical Distributors

9 Research Findings and Conclusion

10 Appendix

10.1 Methodology
10.2 Research Process and Data Source

Description

The global Semiconductor Packaging and Testing Equipment market size is expected to reach $ 23440 million by 2032, rising at a market growth of 5.9% CAGR during the forecast period (2026-2032).
Packaging is the process of laying out, fixing and connecting the chip on the substrate, and encapsulating it with a plastic insulating medium to form an electronic product. The purpose is to protect the chip from damage, ensure the heat dissipation performance of the chip, and realize the transmission of electrical energy and electrical signals to ensure the normal operation of the system. The specific processing links of semiconductor packaging mainly include grinding, wafer cutting, wire bonding, plastic sealing, electroplating, cutting/molding and other links. The packaging equipment mainly includes mounters, cutting and thinning equipment, wire machines, bonding machines, electroplating equipment, etc.
Testing is mainly a step to verify the functions and performance of semiconductor products such as chips and circuits. Its purpose is to screen out semiconductor products with structural defects and functions and performance that do not meet the requirements to ensure the normal application of the delivered products. Testing equipment mainly includes testers, probe stations and sorting machines.
Strong market demand and strong support from national policies are the main driving forces for the rapid development of the domestic semiconductor industry. Mainland China is the world's largest market for semiconductor products, mainly because it is the world's factory. The main production bases of electronic products such as televisions, computers, mobile phones, and home appliances are located in the mainland. Therefore, the mainland consumes about half of the world's semiconductor products. On the other hand, with the rise of terminal brand manufacturers in mainland China, the demand for semiconductor products from mainland own-brand manufacturers has increased significantly. The growth of domestic semiconductor and microelectronics market demand has driven the development of the semiconductor packaging industry. The semiconductor and microelectronics industry is in a continuous development cycle. The market demand for electronic information products such as computers, communications, and consumer electronics drives the development of the integrated circuit industry. The development of the semiconductor and microelectronics industry drives the development of the semiconductor packaging and testing equipment industry.
In terms of product types and technologies, semiconductor packaging equipment accounts for a high proportion, with a market size of US$7.843 billion in 2023, accounting for approximately 53.94% of total sales. In terms of product market applications, packaging and testing & wafer foundries account for a high proportion, with a market size of US$11.002 billion in 2023, accounting for approximately 75.68% of total sales
The continuous increase in downstream demand has led to the emergence of a number of new companies in the semiconductor field. In order to save costs and increase gross profit margins, these start-ups will choose to outsource their semiconductor manufacturing and packaging and testing to wafer and packaging and testing foundries. The booming packaging and testing foundry business has also led to an increasing demand for semiconductor packaging and testing equipment from wafer and packaging and testing foundries. We believe that the trend of packaging and testing outsourcing will not change in the short term, so the application of semiconductor packaging and testing equipment in this field is showing a slight growth trend.
This report studies the global Semiconductor Packaging and Testing Equipment production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Semiconductor Packaging and Testing Equipment and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Semiconductor Packaging and Testing Equipment that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Semiconductor Packaging and Testing Equipment total production and demand, 2021-2032, (Units)
Global Semiconductor Packaging and Testing Equipment total production value, 2021-2032, (USD Million)
Global Semiconductor Packaging and Testing Equipment production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)
Global Semiconductor Packaging and Testing Equipment consumption by region & country, CAGR, 2021-2032 & (Units)
U.S. VS China: Semiconductor Packaging and Testing Equipment domestic production, consumption, key domestic manufacturers and share
Global Semiconductor Packaging and Testing Equipment production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)
Global Semiconductor Packaging and Testing Equipment production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)
Global Semiconductor Packaging and Testing Equipment production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)
This report profiles key players in the global Semiconductor Packaging and Testing Equipment market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Teradyne, Advantest, ASM Pacific Technology, Disco, Tokyo Seimitsu, Besi, Tokyo Electron, Kulicke & Soffa Industries, Cohu, Semes, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Semiconductor Packaging and Testing Equipment market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (K US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Semiconductor Packaging and Testing Equipment Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Semiconductor Packaging and Testing Equipment Market, Segmentation by Type:
Semiconductor Testing Equipment
Semiconductor Packaging Equipment
Global Semiconductor Packaging and Testing Equipment Market, Segmentation by Application:
IDM Enterprise
Foundry
Companies Profiled:
Teradyne
Advantest
ASM Pacific Technology
Disco
Tokyo Seimitsu
Besi
Tokyo Electron
Kulicke & Soffa Industries
Cohu
Semes
Hanmi semiconductor
Yamaha Robotics Holdings
Techwing
Fasford (FUJI)
Chroma
CCTECH
Beijing Huafeng Test & Control Technology
Toray Engineering
Palomar Technologies
Shibasoku
SPEA
Hesse
Unicomp Technology
Key Questions Answered:
1. How big is the global Semiconductor Packaging and Testing Equipment market?
2. What is the demand of the global Semiconductor Packaging and Testing Equipment market?
3. What is the year over year growth of the global Semiconductor Packaging and Testing Equipment market?
4. What is the production and production value of the global Semiconductor Packaging and Testing Equipment market?
5. Who are the key producers in the global Semiconductor Packaging and Testing Equipment market?
6. What are the growth factors driving the market demand?

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