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Global Semiconductor Packaging and Assembly Equipments Market Research Report 2019

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Table of Contents

    Executive Summary

      1 Semiconductor Packaging and Assembly Equipments Market Overview

      • 1.1 Product Overview and Scope of Semiconductor Packaging and Assembly Equipments
      • 1.2 Semiconductor Packaging and Assembly Equipments Segment by Type
        • 1.2.1 Global Semiconductor Packaging and Assembly Equipments Production Growth Rate Comparison by Type (2014-2025)
        • 1.2.2 Die- Level Packaging and Assembly Equipment
        • 1.2.3 Wafer-Level Packaging and Assembly Equipment
      • 1.3 Semiconductor Packaging and Assembly Equipments Segment by Application
        • 1.3.1 Semiconductor Packaging and Assembly Equipments Consumption Comparison by Application (2014-2025)
        • 1.3.2 IDM (Integrated Device Manufacturers)
        • 1.3.3 OSAT (Outsourced Semiconductor Assembly and Test Companies)
      • 1.4 Global Semiconductor Packaging and Assembly Equipments Market by Region
        • 1.4.1 Global Semiconductor Packaging and Assembly Equipments Market Size Region
        • 1.4.2 North America Status and Prospect (2014-2025)
        • 1.4.3 Europe Status and Prospect (2014-2025)
        • 1.4.4 China Status and Prospect (2014-2025)
        • 1.4.5 Japan Status and Prospect (2014-2025)
      • 1.5 Global Semiconductor Packaging and Assembly Equipments Market Size
        • 1.5.1 Global Semiconductor Packaging and Assembly Equipments Revenue (2014-2025)
        • 1.5.2 Global Semiconductor Packaging and Assembly Equipments Production (2014-2025)

      2 Global Semiconductor Packaging and Assembly Equipments Market Competition by Manufacturers

      • 2.1 Global Semiconductor Packaging and Assembly Equipments Production Market Share by Manufacturers (2014-2019)
      • 2.2 Global Semiconductor Packaging and Assembly Equipments Revenue Share by Manufacturers (2014-2019)
      • 2.3 Global Semiconductor Packaging and Assembly Equipments Average Price by Manufacturers (2014-2019)
      • 2.4 Manufacturers Semiconductor Packaging and Assembly Equipments Production Sites, Area Served, Product Types
      • 2.5 Semiconductor Packaging and Assembly Equipments Market Competitive Situation and Trends
        • 2.5.1 Semiconductor Packaging and Assembly Equipments Market Concentration Rate
        • 2.5.2 Semiconductor Packaging and Assembly Equipments Market Share of Top 3 and Top 5 Manufacturers
        • 2.5.3 Mergers & Acquisitions, Expansion

      3 Global Semiconductor Packaging and Assembly Equipments Production Market Share by Regions

      • 3.1 Global Semiconductor Packaging and Assembly Equipments Production Market Share by Regions
      • 3.2 Global Semiconductor Packaging and Assembly Equipments Revenue Market Share by Regions (2014-2019)
      • 3.3 Global Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
      • 3.4 North America Semiconductor Packaging and Assembly Equipments Production
        • 3.4.1 North America Semiconductor Packaging and Assembly Equipments Production Growth Rate (2014-2019)
        • 3.4.2 North America Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
      • 3.5 Europe Semiconductor Packaging and Assembly Equipments Production
        • 3.5.1 Europe Semiconductor Packaging and Assembly Equipments Production Growth Rate (2014-2019)
        • 3.5.2 Europe Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
      • 3.6 China Semiconductor Packaging and Assembly Equipments Production (2014-2019)
        • 3.6.1 China Semiconductor Packaging and Assembly Equipments Production Growth Rate (2014-2019)
        • 3.6.2 China Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
      • 3.7 Japan Semiconductor Packaging and Assembly Equipments Production (2014-2019)
        • 3.7.1 Japan Semiconductor Packaging and Assembly Equipments Production Growth Rate (2014-2019)
        • 3.7.2 Japan Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)

      4 Global Semiconductor Packaging and Assembly Equipments Consumption by Regions

      • 4.1 Global Semiconductor Packaging and Assembly Equipments Consumption by Regions
      • 4.2 North America Semiconductor Packaging and Assembly Equipments Consumption (2014-2019)
      • 4.3 Europe Semiconductor Packaging and Assembly Equipments Consumption (2014-2019)
      • 4.4 China Semiconductor Packaging and Assembly Equipments Consumption (2014-2019)
      • 4.5 Japan Semiconductor Packaging and Assembly Equipments Consumption (2014-2019)

      5 Global Semiconductor Packaging and Assembly Equipments Production, Revenue, Price Trend by Type

      • 5.1 Global Semiconductor Packaging and Assembly Equipments Production Market Share by Type (2014-2019)
      • 5.2 Global Semiconductor Packaging and Assembly Equipments Revenue Market Share by Type (2014-2019)
      • 5.3 Global Semiconductor Packaging and Assembly Equipments Price by Type (2014-2019)
      • 5.4 Global Semiconductor Packaging and Assembly Equipments Production Growth by Type (2014-2019)

      6 Global Semiconductor Packaging and Assembly Equipments Market Analysis by Applications

      • 6.1 Global Semiconductor Packaging and Assembly Equipments Consumption Market Share by Application (2014-2019)
      • 6.2 Global Semiconductor Packaging and Assembly Equipments Consumption Growth Rate by Application (2014-2019)

      7 Company Profiles and Key Figures in Semiconductor Packaging and Assembly Equipments Business

      • 7.1 Applied Materials
        • 7.1.1 Applied Materials Semiconductor Packaging and Assembly Equipments Production Sites and Area Served
        • 7.1.2 Semiconductor Packaging and Assembly Equipments Product Introduction, Application and Specification
        • 7.1.3 Applied Materials Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.1.4 Main Business and Markets Served
      • 7.2 ASMPT
        • 7.2.1 ASMPT Semiconductor Packaging and Assembly Equipments Production Sites and Area Served
        • 7.2.2 Semiconductor Packaging and Assembly Equipments Product Introduction, Application and Specification
        • 7.2.3 ASMPT Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.2.4 Main Business and Markets Served
      • 7.3 DISCO Corporation
        • 7.3.1 DISCO Corporation Semiconductor Packaging and Assembly Equipments Production Sites and Area Served
        • 7.3.2 Semiconductor Packaging and Assembly Equipments Product Introduction, Application and Specification
        • 7.3.3 DISCO Corporation Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.3.4 Main Business and Markets Served
      • 7.4 EV Group
        • 7.4.1 EV Group Semiconductor Packaging and Assembly Equipments Production Sites and Area Served
        • 7.4.2 Semiconductor Packaging and Assembly Equipments Product Introduction, Application and Specification
        • 7.4.3 EV Group Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.4.4 Main Business and Markets Served
      • 7.5 Kulicke and Soffa Industries
        • 7.5.1 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipments Production Sites and Area Served
        • 7.5.2 Semiconductor Packaging and Assembly Equipments Product Introduction, Application and Specification
        • 7.5.3 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.5.4 Main Business and Markets Served
      • 7.6 TEL
        • 7.6.1 TEL Semiconductor Packaging and Assembly Equipments Production Sites and Area Served
        • 7.6.2 Semiconductor Packaging and Assembly Equipments Product Introduction, Application and Specification
        • 7.6.3 TEL Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.6.4 Main Business and Markets Served
      • 7.7 Tokyo Seimitsu
        • 7.7.1 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipments Production Sites and Area Served
        • 7.7.2 Semiconductor Packaging and Assembly Equipments Product Introduction, Application and Specification
        • 7.7.3 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.7.4 Main Business and Markets Served
      • 7.8 Rudolph Technologies
        • 7.8.1 Rudolph Technologies Semiconductor Packaging and Assembly Equipments Production Sites and Area Served
        • 7.8.2 Semiconductor Packaging and Assembly Equipments Product Introduction, Application and Specification
        • 7.8.3 Rudolph Technologies Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.8.4 Main Business and Markets Served
      • 7.9 SEMES
        • 7.9.1 SEMES Semiconductor Packaging and Assembly Equipments Production Sites and Area Served
        • 7.9.2 Semiconductor Packaging and Assembly Equipments Product Introduction, Application and Specification
        • 7.9.3 SEMES Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.9.4 Main Business and Markets Served
      • 7.10 Suss Microtec
        • 7.10.1 Suss Microtec Semiconductor Packaging and Assembly Equipments Production Sites and Area Served
        • 7.10.2 Semiconductor Packaging and Assembly Equipments Product Introduction, Application and Specification
        • 7.10.3 Suss Microtec Semiconductor Packaging and Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.10.4 Main Business and Markets Served
      • 7.11 Ultratech
      • 7.12 Ulvac Technologies

      8 Semiconductor Packaging and Assembly Equipments Manufacturing Cost Analysis

      • 8.1 Semiconductor Packaging and Assembly Equipments Key Raw Materials Analysis
        • 8.1.1 Key Raw Materials
        • 8.1.2 Price Trend of Key Raw Materials
        • 8.1.3 Key Suppliers of Raw Materials
      • 8.2 Proportion of Manufacturing Cost Structure
      • 8.3 Manufacturing Process Analysis of Semiconductor Packaging and Assembly Equipments
      • 8.4 Semiconductor Packaging and Assembly Equipments Industrial Chain Analysis

      9 Marketing Channel, Distributors and Customers

      • 9.1 Marketing Channel
        • 9.1.1 Direct Marketing
        • 9.1.2 Indirect Marketing
      • 9.2 Semiconductor Packaging and Assembly Equipments Distributors List
      • 9.3 Semiconductor Packaging and Assembly Equipments Customers

      10 Market Dynamics

      • 10.1 Market Trends
      • 10.2 Opportunities
      • 10.3 Market Drivers
      • 10.4 Challenges
      • 10.5 Influence Factors

      11 Global Semiconductor Packaging and Assembly Equipments Market Forecast

      • 11.1 Global Semiconductor Packaging and Assembly Equipments Production, Revenue Forecast
        • 11.1.1 Global Semiconductor Packaging and Assembly Equipments Production Growth Rate Forecast (2019-2025)
        • 11.1.2 Global Semiconductor Packaging and Assembly Equipments Revenue and Growth Rate Forecast (2019-2025)
        • 11.1.3 Global Semiconductor Packaging and Assembly Equipments Price and Trend Forecast (2019-2025)
      • 11.2 Global Semiconductor Packaging and Assembly Equipments Production Forecast by Regions (2019-2025)
        • 11.2.1 North America Semiconductor Packaging and Assembly Equipments Production, Revenue Forecast (2019-2025)
        • 11.2.2 Europe Semiconductor Packaging and Assembly Equipments Production, Revenue Forecast (2019-2025)
        • 11.2.3 China Semiconductor Packaging and Assembly Equipments Production, Revenue Forecast (2019-2025)
        • 11.2.4 Japan Semiconductor Packaging and Assembly Equipments Production, Revenue Forecast (2019-2025)
      • 11.3 Global Semiconductor Packaging and Assembly Equipments Consumption Forecast by Regions (2019-2025)
        • 11.3.1 North America Semiconductor Packaging and Assembly Equipments Consumption Forecast (2019-2025)
        • 11.3.2 Europe Semiconductor Packaging and Assembly Equipments Consumption Forecast (2019-2025)
        • 11.3.3 China Semiconductor Packaging and Assembly Equipments Consumption Forecast (2019-2025)
        • 11.3.4 Japan Semiconductor Packaging and Assembly Equipments Consumption Forecast (2019-2025)
      • 11.4 Global Semiconductor Packaging and Assembly Equipments Production, Revenue and Price Forecast by Type (2019-2025)
      • 11.5 Global Semiconductor Packaging and Assembly Equipments Consumption Forecast by Application (2019-2025)

      12 Research Findings and Conclusion

        13 Methodology and Data Source

        • 13.1 Methodology/Research Approach
          • 13.1.1 Research Programs/Design
          • 13.1.2 Market Size Estimation
          • 13.1.3 Market Breakdown and Data Triangulation
        • 13.2 Data Source
          • 13.2.1 Secondary Sources
          • 13.2.2 Primary Sources
        • 13.3 Author List

        For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation.
        The die-level packaging and assembly equipment segment to be the major revenue contributing segment in this market during the forecasted period.
        The APAC region to continue dominating this market during the forecast period. This region currently accounts for more than 65% of the total revenue share. The presence of leading semiconductor foundries in this region, such as Taiwan Semiconductor Manufacturing, United Microelectronics, Samsung, and Semiconductor Manufacturing International, is expected to impel market growth during the forecast period.

        The global Semiconductor Packaging and Assembly Equipments market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
        This report focuses on Semiconductor Packaging and Assembly Equipments volume and value at global level, regional level and company level. From a global perspective, this report represents overall Semiconductor Packaging and Assembly Equipments market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
        At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

        The following manufacturers are covered:
        Applied Materials
        ASMPT
        DISCO Corporation
        EV Group
        Kulicke and Soffa Industries
        TEL
        Tokyo Seimitsu
        Rudolph Technologies
        SEMES
        Suss Microtec
        Ultratech
        Ulvac Technologies

        Segment by Regions
        North America
        Europe
        China
        Japan

        Segment by Type
        Die- Level Packaging and Assembly Equipment
        Wafer-Level Packaging and Assembly Equipment

        Segment by Application
        IDM (Integrated Device Manufacturers)
        OSAT (Outsourced Semiconductor Assembly and Test Companies)

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