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Global Semiconductor Packaging and Assembly Equipment Market Professional Survey Report 2019

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  • 1.1 Research Scope
  • 1.2 Market Segmentation
  • 1.3 Research Objectives
  • 1.4 Research Methodology
    • 1.4.1 Research Process
    • 1.4.2 Data Triangulation
    • 1.4.3 Research Approach
    • 1.4.4 Base Year
  • 1.5 Coronavirus Disease 2019 (Covid-19) Impact Will Have a Severe Impact on Global Growth
    • 1.5.1 Covid-19 Impact: Global GDP Growth, 2019, 2020 and 2021 Projections
    • 1.5.2 Covid-19 Impact: Commodity Prices Indices
    • 1.5.3 Covid-19 Impact: Global Major Government Policy
  • 1.6 The Covid-19 Impact on Semiconductor Packaging and Assembly Equipment Industry
  • 1.7 COVID-19 Impact: Semiconductor Packaging and Assembly Equipment Market Trends

    • 2 Global Semiconductor Packaging and Assembly Equipment Quarterly Market Size Analysis

    • 2.1 Semiconductor Packaging and Assembly Equipment Business Impact Assessment - COVID-19
      • 2.1.1 Global Semiconductor Packaging and Assembly Equipment Market Size, Pre-COVID-19 and Post- COVID-19 Comparison, 2015-2026
      • 2.1.2 Global Semiconductor Packaging and Assembly Equipment Price, Pre-COVID-19 and Post- COVID-19 Comparison, 2015-2026
    • 2.2 Global Semiconductor Packaging and Assembly Equipment Quarterly Market Size 2020-2021
    • 2.3 COVID-19-Driven Market Dynamics and Factor Analysis
      • 2.3.1 Drivers
      • 2.3.2 Restraints
      • 2.3.3 Opportunities
      • 2.3.4 Challenges

    3 Quarterly Competitive Assessment, 2020

    • 3.1 Global Semiconductor Packaging and Assembly Equipment Quarterly Market Size by Manufacturers, 2019 VS 2020
    • 3.2 Global Semiconductor Packaging and Assembly Equipment Factory Price by Manufacturers
    • 3.3 Location of Key Manufacturers Semiconductor Packaging and Assembly Equipment Manufacturing Factories and Area Served
    • 3.4 Date of Key Manufacturers Enter into Semiconductor Packaging and Assembly Equipment Market
    • 3.5 Key Manufacturers Semiconductor Packaging and Assembly Equipment Product Offered
    • 3.6 Mergers & Acquisitions, Expansion Plans

    4 Impact of Covid-19 on Semiconductor Packaging and Assembly Equipment Segments, By Type

    • 4.1 Introduction
      • 1.4.1 Die- Level Packaging and Assembly Equipment
      • 1.4.2 Wafer-Level Packaging and Assembly Equipment
    • 4.2 By Type, Global Semiconductor Packaging and Assembly Equipment Market Size, 2019-2021
      • 4.2.1 By Type, Global Semiconductor Packaging and Assembly Equipment Market Size by Type, 2020-2021
      • 4.2.2 By Type, Global Semiconductor Packaging and Assembly Equipment Price, 2020-2021

    5 Impact of Covid-19 on Semiconductor Packaging and Assembly Equipment Segments, By Application

    • 5.1 Overview
      • 5.5.1 IDM (Integrated Device Manufacturers)
      • 5.5.2 OSAT (Outsourced Semiconductor Assembly and Test Companies)
    • 5.2 By Application, Global Semiconductor Packaging and Assembly Equipment Market Size, 2019-2021
      • 5.2.1 By Application, Global Semiconductor Packaging and Assembly Equipment Market Size by Application, 2019-2021
      • 5.2.2 By Application, Global Semiconductor Packaging and Assembly Equipment Price, 2020-2021

    6 Geographic Analysis

    • 6.1 Introduction
    • 6.2 North America
      • 6.2.1 Macroeconomic Indicators of US
      • 6.2.2 US
      • 6.2.3 Canada
    • 6.3 Europe
      • 6.3.1 Macroeconomic Indicators of Europe
      • 6.3.2 Germany
      • 6.3.3 France
      • 6.3.4 UK
      • 6.3.5 Italy
    • 6.4 Asia-Pacific
      • 6.4.1 Macroeconomic Indicators of Asia-Pacific
      • 6.4.2 China
      • 6.4.3 Japan
      • 6.4.4 South Korea
      • 6.4.5 India
      • 6.4.6 ASEAN
    • 6.5 Rest of World
      • 6.5.1 Latin America
      • 6.5.2 Middle East and Africa

    7 Company Profiles

    • 7.1 Applied Materials
      • 7.1.1 Applied Materials Business Overview
      • 7.1.2 Applied Materials Semiconductor Packaging and Assembly Equipment Quarterly Production and Revenue, 2020
      • 7.1.3 Applied Materials Semiconductor Packaging and Assembly Equipment Product Introduction
      • 7.1.4 Applied Materials Response to COVID-19 and Related Developments
    • 7.2 ASMPT
      • 7.2.1 ASMPT Business Overview
      • 7.2.2 ASMPT Semiconductor Packaging and Assembly Equipment Quarterly Production and Revenue, 2020
      • 7.2.3 ASMPT Semiconductor Packaging and Assembly Equipment Product Introduction
      • 7.2.4 ASMPT Response to COVID-19 and Related Developments
    • 7.3 DISCO Corporation
      • 7.3.1 DISCO Corporation Business Overview
      • 7.3.2 DISCO Corporation Semiconductor Packaging and Assembly Equipment Quarterly Production and Revenue, 2020
      • 7.3.3 DISCO Corporation Semiconductor Packaging and Assembly Equipment Product Introduction
      • 7.3.4 DISCO Corporation Response to COVID-19 and Related Developments
    • 7.4 EV Group
      • 7.4.1 EV Group Business Overview
      • 7.4.2 EV Group Semiconductor Packaging and Assembly Equipment Quarterly Production and Revenue, 2020
      • 7.4.3 EV Group Semiconductor Packaging and Assembly Equipment Product Introduction
      • 7.4.4 EV Group Response to COVID-19 and Related Developments
    • 7.5 Kulicke and Soffa Industries
      • 7.5.1 Kulicke and Soffa Industries Business Overview
      • 7.5.2 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Quarterly Production and Revenue, 2020
      • 7.5.3 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Product Introduction
      • 7.5.4 Kulicke and Soffa Industries Response to COVID-19 and Related Developments
    • 7.6 TEL
      • 7.6.1 TEL Business Overview
      • 7.6.2 TEL Semiconductor Packaging and Assembly Equipment Quarterly Production and Revenue, 2020
      • 7.6.3 TEL Semiconductor Packaging and Assembly Equipment Product Introduction
      • 7.6.4 TEL Response to COVID-19 and Related Developments
    • 7.7 Tokyo Seimitsu
      • 7.7.1 Tokyo Seimitsu Business Overview
      • 7.7.2 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Quarterly Production and Revenue, 2020
      • 7.7.3 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Product Introduction
      • 7.7.4 Tokyo Seimitsu Response to COVID-19 and Related Developments
    • 7.8 Rudolph Technologies
      • 7.8.1 Rudolph Technologies Business Overview
      • 7.8.2 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Quarterly Production and Revenue, 2020
      • 7.8.3 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Product Introduction
      • 7.8.4 Rudolph Technologies Response to COVID-19 and Related Developments
    • 7.9 SEMES
      • 7.9.1 SEMES Business Overview
      • 7.9.2 SEMES Semiconductor Packaging and Assembly Equipment Quarterly Production and Revenue, 2020
      • 7.9.3 SEMES Semiconductor Packaging and Assembly Equipment Product Introduction
      • 7.9.4 SEMES Response to COVID-19 and Related Developments
    • 7.10 Suss Microtec
      • 7.10.1 Suss Microtec Business Overview
      • 7.10.2 Suss Microtec Semiconductor Packaging and Assembly Equipment Quarterly Production and Revenue, 2020
      • 7.10.3 Suss Microtec Semiconductor Packaging and Assembly Equipment Product Introduction
      • 7.10.4 Suss Microtec Response to COVID-19 and Related Developments
    • 7.11 Veeco/CNT
      • 7.11.1 Veeco/CNT Business Overview
      • 7.11.2 Veeco/CNT Semiconductor Packaging and Assembly Equipment Quarterly Production and Revenue, 2020
      • 7.11.3 Veeco/CNT Semiconductor Packaging and Assembly Equipment Product Introduction
      • 7.11.4 Veeco/CNT Response to COVID-19 and Related Developments
    • 7.12 Ulvac Technologies
      • 7.12.1 Ulvac Technologies Business Overview
      • 7.12.2 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Quarterly Production and Revenue, 2020
      • 7.12.3 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Product Introduction
      • 7.12.4 Ulvac Technologies Response to COVID-19 and Related Developments

    8 Supply Chain and Sales Channels Analysis

    • 8.1 Semiconductor Packaging and Assembly Equipment Supply Chain Analysis
      • 8.1.1 Semiconductor Packaging and Assembly Equipment Supply Chain Analysis
      • 8.1.2 Covid-19 Impact on Semiconductor Packaging and Assembly Equipment Supply Chain
    • 8.2 Distribution Channels Analysis
      • 8.2.1 Semiconductor Packaging and Assembly Equipment Distribution Channels
      • 8.2.2 Covid-19 Impact on Semiconductor Packaging and Assembly Equipment Distribution Channels
      • 8.2.3 Semiconductor Packaging and Assembly Equipment Distributors
    • 8.3 Semiconductor Packaging and Assembly Equipment Customers

    9 Key Findings

      10 Appendix

      • 10.1 About Us

      This report covers market size and forecasts of Semiconductor Packaging and Assembly Equipment, including the following market information:
      Global Semiconductor Packaging and Assembly Equipment Market Size, 2019-2021, and 2020 (quarterly data), (US$ Million) & (K Units)
      Global Semiconductor Packaging and Assembly Equipment Market Size by Type and by Application, 2019-2021, and 2020 (quarterly data), (US$ Million) & (K Units)
      Global Semiconductor Packaging and Assembly Equipment Market Size by Region (and Key Countries), 2019-2021, and 2020 (quarterly data), (US$ Million) & (K Units)
      Global Semiconductor Packaging and Assembly Equipment Market Size by Company, 2019- 2020 (quarterly data), (US$ Million) & (K Units)

      Key market players
      Major competitors identified in this market include Applied Materials, ASMPT, DISCO Corporation, EV Group, Kulicke and Soffa Industries, TEL, Tokyo Seimitsu, Rudolph Technologies, SEMES, Suss Microtec, Veeco/CNT, Ulvac Technologies, etc.

      Based on the Region:
      Asia-Pacific (China, Japan, South Korea, India and ASEAN)
      North America (US and Canada)
      Europe (Germany, France, UK and Italy)
      Rest of World (Latin America, Middle East & Africa)

      Based on the Type:
      Die- Level Packaging and Assembly Equipment
      Wafer-Level Packaging and Assembly Equipment

      Based on the Application:
      IDM (Integrated Device Manufacturers)
      OSAT (Outsourced Semiconductor Assembly and Test Companies)

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