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Global Semiconductor Packaging and Assembly Equipment Market Research Report 2019

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Table of Contents

    Global Semiconductor Packaging and Assembly Equipment Market Research Report 2018

      1 Semiconductor Packaging and Assembly Equipment Market Overview

      • 1.1 Product Overview and Scope of Semiconductor Packaging and Assembly Equipment
      • 1.2 Semiconductor Packaging and Assembly Equipment Segment by Type (Product Category)
        • 1.2.1 Global Semiconductor Packaging and Assembly Equipment Production and CAGR (%) Comparison by Type (Product Category)(2013-2025)
        • 1.2.2 Global Semiconductor Packaging and Assembly Equipment Production Market Share by Type (Product Category) in 2017
        • 1.2.3 Die-level packaging and assembly equipment
        • 1.2.3 Wafer-level packaging and assembly equipment
      • 1.3 Global Semiconductor Packaging and Assembly Equipment Segment by Application
        • 1.3.1 Semiconductor Packaging and Assembly Equipment Consumption (Sales) Comparison by Application (2013-2025)
        • 1.3.2 Consumer Electronics
        • 1.3.3 Automobile
        • 1.3.4 Medical Care
        • 1.3.5 Others
      • 1.4 Global Semiconductor Packaging and Assembly Equipment Market by Region (2013-2025)
        • 1.4.1 Global Semiconductor Packaging and Assembly Equipment Market Size (Value) and CAGR (%) Comparison by Region (2013-2025)
        • 1.4.2 North America Status and Prospect (2013-2025)
        • 1.4.3 Europe Status and Prospect (2013-2025)
        • 1.4.4 China Status and Prospect (2013-2025)
        • 1.4.5 Japan Status and Prospect (2013-2025)
        • 1.4.6 Southeast Asia Status and Prospect (2013-2025)
        • 1.4.7 India Status and Prospect (2013-2025)
      • 1.5 Global Market Size (Value) of Semiconductor Packaging and Assembly Equipment (2013-2025)
        • 1.5.1 Global Semiconductor Packaging and Assembly Equipment Revenue Status and Outlook (2013-2025)
        • 1.5.2 Global Semiconductor Packaging and Assembly Equipment Capacity, Production Status and Outlook (2013-2025)

      2 Global Semiconductor Packaging and Assembly Equipment Market Competition by Manufacturers

      • 2.1 Global Semiconductor Packaging and Assembly Equipment Capacity, Production and Share by Manufacturers (2013-2018)
        • 2.1.1 Global Semiconductor Packaging and Assembly Equipment Capacity and Share by Manufacturers (2013-2018)
        • 2.1.2 Global Semiconductor Packaging and Assembly Equipment Production and Share by Manufacturers (2013-2018)
      • 2.2 Global Semiconductor Packaging and Assembly Equipment Revenue and Share by Manufacturers (2013-2018)
      • 2.3 Global Semiconductor Packaging and Assembly Equipment Average Price by Manufacturers (2013-2018)
      • 2.4 Manufacturers Semiconductor Packaging and Assembly Equipment Manufacturing Base Distribution, Sales Area and Product Type
      • 2.5 Semiconductor Packaging and Assembly Equipment Market Competitive Situation and Trends
        • 2.5.1 Semiconductor Packaging and Assembly Equipment Market Concentration Rate
        • 2.5.2 Semiconductor Packaging and Assembly Equipment Market Share of Top 3 and Top 5 Manufacturers
        • 2.5.3 Mergers & Acquisitions, Expansion

      3 Global Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue (Value) by Region (2013-2018)

      • 3.1 Global Semiconductor Packaging and Assembly Equipment Capacity and Market Share by Region (2013-2018)
      • 3.2 Global Semiconductor Packaging and Assembly Equipment Production and Market Share by Region (2013-2018)
      • 3.3 Global Semiconductor Packaging and Assembly Equipment Revenue (Value) and Market Share by Region (2013-2018)
      • 3.4 Global Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 3.5 North America Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 3.6 Europe Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 3.7 China Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 3.8 Japan Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 3.9 Southeast Asia Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
      • 3.10 India Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)

      4 Global Semiconductor Packaging and Assembly Equipment Supply (Production), Consumption, Export, Import by Region (2013-2018)

      • 4.1 Global Semiconductor Packaging and Assembly Equipment Consumption by Region (2013-2018)
      • 4.2 North America Semiconductor Packaging and Assembly Equipment Production, Consumption, Export, Import (2013-2018)
      • 4.3 Europe Semiconductor Packaging and Assembly Equipment Production, Consumption, Export, Import (2013-2018)
      • 4.4 China Semiconductor Packaging and Assembly Equipment Production, Consumption, Export, Import (2013-2018)
      • 4.5 Japan Semiconductor Packaging and Assembly Equipment Production, Consumption, Export, Import (2013-2018)
      • 4.6 Southeast Asia Semiconductor Packaging and Assembly Equipment Production, Consumption, Export, Import (2013-2018)
      • 4.7 India Semiconductor Packaging and Assembly Equipment Production, Consumption, Export, Import (2013-2018)

      5 Global Semiconductor Packaging and Assembly Equipment Production, Revenue (Value), Price Trend by Type

      • 5.1 Global Semiconductor Packaging and Assembly Equipment Production and Market Share by Type (2013-2018)
      • 5.2 Global Semiconductor Packaging and Assembly Equipment Revenue and Market Share by Type (2013-2018)
      • 5.3 Global Semiconductor Packaging and Assembly Equipment Price by Type (2013-2018)
      • 5.4 Global Semiconductor Packaging and Assembly Equipment Production Growth by Type (2013-2018)

      6 Global Semiconductor Packaging and Assembly Equipment Market Analysis by Application

      • 6.1 Global Semiconductor Packaging and Assembly Equipment Consumption and Market Share by Application (2013-2018)
      • 6.2 Global Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Application (2013-2018)
      • 6.3 Market Drivers and Opportunities
        • 6.3.1 Potential Applications
        • 6.3.2 Emerging Markets/Countries

      7 Global Semiconductor Packaging and Assembly Equipment Manufacturers Profiles/Analysis

      • 7.1 Applied Materials
        • 7.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
        • 7.1.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
          • 7.1.2.1 Product A
          • 7.1.2.2 Product B
        • 7.1.3 Applied Materials Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
        • 7.1.4 Main Business/Business Overview
      • 7.2 ASM Pacific Technology (ASMPT)
        • 7.2.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
        • 7.2.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
          • 7.2.2.1 Product A
          • 7.2.2.2 Product B
        • 7.2.3 ASM Pacific Technology (ASMPT) Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
        • 7.2.4 Main Business/Business Overview
      • 7.3 Disco
        • 7.3.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
        • 7.3.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
          • 7.3.2.1 Product A
          • 7.3.2.2 Product B
        • 7.3.3 Disco Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
        • 7.3.4 Main Business/Business Overview
      • 7.4 EV Group (EVG)
        • 7.4.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
        • 7.4.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
          • 7.4.2.1 Product A
          • 7.4.2.2 Product B
        • 7.4.3 EV Group (EVG) Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
        • 7.4.4 Main Business/Business Overview
      • 7.5 Kulicke and Soffa Industries
        • 7.5.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
        • 7.5.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
          • 7.5.2.1 Product A
          • 7.5.2.2 Product B
        • 7.5.3 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2015-2018)
        • 7.5.4 Main Business/Business Overview
      • 7.6 Tokyo Electron Ltd. (TEL)
        • 7.6.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
        • 7.6.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
          • 7.6.2.1 Product A
          • 7.6.2.2 Product B
        • 7.6.3 Tokyo Electron Ltd. (TEL) Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
        • 7.6.4 Main Business/Business Overview
      • 7.7 Tokyo Seimitsu
        • 7.7.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
        • 7.7.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
          • 7.7.2.1 Product A
          • 7.7.2.2 Product B
        • 7.7.3 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
        • 7.7.4 Main Business/Business Overview
      • 7.8 Rudolph Technologies
        • 7.8.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
        • 7.8.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
          • 7.8.2.1 Product A
          • 7.8.2.2 Product B
        • 7.8.3 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
        • 7.8.4 Main Business/Business Overview
      • 7.9 SEMES
        • 7.9.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
        • 7.9.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
          • 7.9.2.1 Product A
          • 7.9.2.2 Product B
        • 7.9.3 SEMES Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
        • 7.9.4 Main Business/Business Overview
      • 7.8 Suss Microtec
        • 7.10.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
        • 7.10.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
          • 7.10.2.1 Product A
          • 7.10.2.2 Product B
        • 7.10.3 Suss Microtec Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
        • 7.10.4 Main Business/Business Overview

      8 Semiconductor Packaging and Assembly Equipment Manufacturing Cost Analysis

      • 8.1 Semiconductor Packaging and Assembly Equipment Key Raw Materials Analysis
        • 8.1.1 Key Raw Materials
        • 8.1.2 Price Trend of Key Raw Materials
        • 8.1.3 Key Suppliers of Raw Materials
        • 8.1.4 Market Concentration Rate of Raw Materials
      • 8.2 Proportion of Manufacturing Cost Structure
        • 8.2.1 Raw Materials
        • 8.2.2 Labor Cost
        • 8.2.3 Manufacturing Expenses
      • 8.3 Manufacturing Process Analysis of Semiconductor Packaging and Assembly Equipment

      9 Industrial Chain, Sourcing Strategy and Downstream Buyers

      • 9.1 Semiconductor Packaging and Assembly Equipment Industrial Chain Analysis
      • 9.2 Upstream Raw Materials Sourcing
      • 9.3 Raw Materials Sources of Semiconductor Packaging and Assembly Equipment Major Manufacturers in 2017
      • 9.4 Downstream Buyers

      10 Marketing Strategy Analysis, Distributors/Traders

      • 10.1 Marketing Channel
        • 10.1.1 Direct Marketing
        • 10.1.2 Indirect Marketing
        • 10.1.3 Marketing Channel Development Trend
      • 10.2 Market Positioning
        • 10.2.1 Pricing Strategy
        • 10.2.2 Brand Strategy
        • 10.2.3 Target Client
      • 10.3 Distributors/Traders List

      11 Market Effect Factors Analysis

      • 11.1 Technology Progress/Risk
        • 11.1.1 Substitutes Threat
        • 11.1.2 Technology Progress in Related Industry
      • 11.2 Consumer Needs/Customer Preference Change
      • 11.3 Economic/Political Environmental Change

      12 Global Semiconductor Packaging and Assembly Equipment Market Forecast (2018-2025)

      • 12.1 Global Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue Forecast (2018-2025)
        • 12.1.1 Global Semiconductor Packaging and Assembly Equipment Capacity, Production and Growth Rate Forecast (2018-2025)
        • 12.1.2 Global Semiconductor Packaging and Assembly Equipment Revenue and Growth Rate Forecast (2018-2025)
        • 12.1.3 Global Semiconductor Packaging and Assembly Equipment Price and Trend Forecast (2018-2025)
      • 12.2 Global Semiconductor Packaging and Assembly Equipment Production, Consumption , Import and Export Forecast by Region (2018-2025)
        • 12.2.1 North America Semiconductor Packaging and Assembly Equipment Production, Revenue, Consumption, Export and Import Forecast (2018-2025)
        • 12.2.2 Europe Semiconductor Packaging and Assembly Equipment Production, Revenue, Consumption, Export and Import Forecast (2018-2025)
        • 12.2.3 China Semiconductor Packaging and Assembly Equipment Production, Revenue, Consumption, Export and Import Forecast (2018-2025)
        • 12.2.4 Japan Semiconductor Packaging and Assembly Equipment Production, Revenue, Consumption, Export and Import Forecast (2018-2025)
        • 12.2.5 Southeast Asia Semiconductor Packaging and Assembly Equipment Production, Revenue, Consumption, Export and Import Forecast (2018-2025)
        • 12.2.6 India Semiconductor Packaging and Assembly Equipment Production, Revenue, Consumption, Export and Import Forecast (2018-2025)
      • 12.3 Global Semiconductor Packaging and Assembly Equipment Production, Revenue and Price Forecast by Type (2018-2025)
      • 12.4 Global Semiconductor Packaging and Assembly Equipment Consumption Forecast by Application (2018-2025)

      13 Research Findings and Conclusion

        14 Appendix

        • 14.1 Methodology/Research Approach
          • 14.1.1 Research Programs/Design
          • 14.1.2 Market Size Estimation
          • 14.1.3 Market Breakdown and Data Triangulation
        • 14.2 Data Source
          • 14.2.1 Secondary Sources
          • 14.2.2 Primary Sources

        This report studies the global Semiconductor Packaging and Assembly Equipment market status and forecast, categorizes the global Semiconductor Packaging and Assembly Equipment market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China, and other regions (India, Southeast Asia).

        The major manufacturers covered in this report
        Applied Materials
        ASM Pacific Technology (ASMPT)
        Disco
        EV Group (EVG)
        Kulicke and Soffa Industries
        Tokyo Electron Ltd. (TEL)
        Tokyo Seimitsu
        Rudolph Technologies
        SEMES
        Suss Microtec

        Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering
        North America
        Europe
        China
        Japan
        Southeast Asia
        India

        We can also provide the customized separate regional or country-level reports, for the following regions:
        North America
        United States
        Canada
        Mexico
        Asia-Pacific
        China
        India
        Japan
        South Korea
        Australia
        Indonesia
        Singapore
        Rest of Asia-Pacific
        Europe
        Germany
        France
        UK
        Italy
        Spain
        Russia
        Rest of Europe
        Central & South America
        Brazil
        Argentina
        Rest of South America
        Middle East & Africa
        Saudi Arabia
        Turkey
        Rest of Middle East & Africa

        On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
        Die-level packaging and assembly equipment
        Wafer-level packaging and assembly equipment
        On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including
        Consumer Electronics
        Automobile
        Medical Care
        Others

        The study objectives of this report are:
        To analyze and study the global Semiconductor Packaging and Assembly Equipment capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);
        Focuses on the key Semiconductor Packaging and Assembly Equipment manufacturers, to study the capacity, production, value, market share and development plans in future.
        Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
        To define, describe and forecast the market by type, application and region.
        To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
        To identify significant trends and factors driving or inhibiting the market growth.
        To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
        To strategically analyze each submarket with respect to individual growth trend and their contribution to the market
        To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
        To strategically profile the key players and comprehensively analyze their growth strategies.

        In this study, the years considered to estimate the market size of Semiconductor Packaging and Assembly Equipment are as follows:
        History Year: 2013-2017
        Base Year: 2017
        Estimated Year: 2018
        Forecast Year 2018 to 2025

        For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

        Key Stakeholders
        Semiconductor Packaging and Assembly Equipment Manufacturers
        Semiconductor Packaging and Assembly Equipment Distributors/Traders/Wholesalers
        Semiconductor Packaging and Assembly Equipment Subcomponent Manufacturers
        Industry Association
        Downstream Vendors

        Available Customizations
        With the given market data, QYResearch offers customizations according to the company's specific needs. The following customization options are available for the report:
        Regional and country-level analysis of the Semiconductor Packaging and Assembly Equipment market, by end-use.
        Detailed analysis and profiles of additional market players.

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