Semiconductor Molding Systems Market Report – Research, Industry Analysis Reports and Market Demands

Global Semiconductor Molding Systems Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032

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Table of Content

1 Market Overview

1.1 Product Overview and Scope
1.2 Market Estimation Caveats and Base Year
1.3 Market Analysis by Type
- 1.3.1 Overview: Global Semiconductor Molding Systems Consumption Value by Type: 2021 Versus 2025 Versus 2032
- 1.3.2 Fully Automatic Molding System
- 1.3.3 Semi-automatic Molding System
- 1.3.4 Manual Molding System
1.4 Market Analysis by Application
- 1.4.1 Overview: Global Semiconductor Molding Systems Consumption Value by Application: 2021 Versus 2025 Versus 2032
- 1.4.2 Advanced Packaging
- 1.4.3 Traditional Packaging
1.5 Global Semiconductor Molding Systems Market Size & Forecast
- 1.5.1 Global Semiconductor Molding Systems Consumption Value (2021 & 2025 & 2032)
- 1.5.2 Global Semiconductor Molding Systems Sales Quantity (2021-2032)
- 1.5.3 Global Semiconductor Molding Systems Average Price (2021-2032)

2 Manufacturers Profiles

3 Competitive Environment: Semiconductor Molding Systems by Manufacturer

3.1 Global Semiconductor Molding Systems Sales Quantity by Manufacturer (2021-2026)
3.2 Global Semiconductor Molding Systems Revenue by Manufacturer (2021-2026)
3.3 Global Semiconductor Molding Systems Average Price by Manufacturer (2021-2026)
3.4 Market Share Analysis (2025)
- 3.4.1 Producer Shipments of Semiconductor Molding Systems by Manufacturer Revenue ($MM) and Market Share (%): 2025
- 3.4.2 Top 3 Semiconductor Molding Systems Manufacturer Market Share in 2025
- 3.4.3 Top 6 Semiconductor Molding Systems Manufacturer Market Share in 2025
3.5 Semiconductor Molding Systems Market: Overall Company Footprint Analysis
- 3.5.1 Semiconductor Molding Systems Market: Region Footprint
- 3.5.2 Semiconductor Molding Systems Market: Company Product Type Footprint
- 3.5.3 Semiconductor Molding Systems Market: Company Product Application Footprint
3.6 New Market Entrants and Barriers to Market Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

4.1 Global Semiconductor Molding Systems Market Size by Region
- 4.1.1 Global Semiconductor Molding Systems Sales Quantity by Region (2021-2032)
- 4.1.2 Global Semiconductor Molding Systems Consumption Value by Region (2021-2032)
- 4.1.3 Global Semiconductor Molding Systems Average Price by Region (2021-2032)
4.2 North America Semiconductor Molding Systems Consumption Value (2021-2032)
4.3 Europe Semiconductor Molding Systems Consumption Value (2021-2032)
4.4 Asia-Pacific Semiconductor Molding Systems Consumption Value (2021-2032)
4.5 South America Semiconductor Molding Systems Consumption Value (2021-2032)
4.6 Middle East & Africa Semiconductor Molding Systems Consumption Value (2021-2032)

5 Market Segment by Type

5.1 Global Semiconductor Molding Systems Sales Quantity by Type (2021-2032)
5.2 Global Semiconductor Molding Systems Consumption Value by Type (2021-2032)
5.3 Global Semiconductor Molding Systems Average Price by Type (2021-2032)

6 Market Segment by Application

6.1 Global Semiconductor Molding Systems Sales Quantity by Application (2021-2032)
6.2 Global Semiconductor Molding Systems Consumption Value by Application (2021-2032)
6.3 Global Semiconductor Molding Systems Average Price by Application (2021-2032)

7 North America

7.1 North America Semiconductor Molding Systems Sales Quantity by Type (2021-2032)
7.2 North America Semiconductor Molding Systems Sales Quantity by Application (2021-2032)
7.3 North America Semiconductor Molding Systems Market Size by Country
- 7.3.1 North America Semiconductor Molding Systems Sales Quantity by Country (2021-2032)
- 7.3.2 North America Semiconductor Molding Systems Consumption Value by Country (2021-2032)
- 7.3.3 United States Market Size and Forecast (2021-2032)
- 7.3.4 Canada Market Size and Forecast (2021-2032)
- 7.3.5 Mexico Market Size and Forecast (2021-2032)

8 Europe

8.1 Europe Semiconductor Molding Systems Sales Quantity by Type (2021-2032)
8.2 Europe Semiconductor Molding Systems Sales Quantity by Application (2021-2032)
8.3 Europe Semiconductor Molding Systems Market Size by Country
- 8.3.1 Europe Semiconductor Molding Systems Sales Quantity by Country (2021-2032)
- 8.3.2 Europe Semiconductor Molding Systems Consumption Value by Country (2021-2032)
- 8.3.3 Germany Market Size and Forecast (2021-2032)
- 8.3.4 France Market Size and Forecast (2021-2032)
- 8.3.5 United Kingdom Market Size and Forecast (2021-2032)
- 8.3.6 Russia Market Size and Forecast (2021-2032)
- 8.3.7 Italy Market Size and Forecast (2021-2032)

9 Asia-Pacific

9.1 Asia-Pacific Semiconductor Molding Systems Sales Quantity by Type (2021-2032)
9.2 Asia-Pacific Semiconductor Molding Systems Sales Quantity by Application (2021-2032)
9.3 Asia-Pacific Semiconductor Molding Systems Market Size by Region
- 9.3.1 Asia-Pacific Semiconductor Molding Systems Sales Quantity by Region (2021-2032)
- 9.3.2 Asia-Pacific Semiconductor Molding Systems Consumption Value by Region (2021-2032)
- 9.3.3 China Market Size and Forecast (2021-2032)
- 9.3.4 Japan Market Size and Forecast (2021-2032)
- 9.3.5 South Korea Market Size and Forecast (2021-2032)
- 9.3.6 India Market Size and Forecast (2021-2032)
- 9.3.7 Southeast Asia Market Size and Forecast (2021-2032)
- 9.3.8 Australia Market Size and Forecast (2021-2032)

10 South America

10.1 South America Semiconductor Molding Systems Sales Quantity by Type (2021-2032)
10.2 South America Semiconductor Molding Systems Sales Quantity by Application (2021-2032)
10.3 South America Semiconductor Molding Systems Market Size by Country
- 10.3.1 South America Semiconductor Molding Systems Sales Quantity by Country (2021-2032)
- 10.3.2 South America Semiconductor Molding Systems Consumption Value by Country (2021-2032)
- 10.3.3 Brazil Market Size and Forecast (2021-2032)
- 10.3.4 Argentina Market Size and Forecast (2021-2032)

11 Middle East & Africa

11.1 Middle East & Africa Semiconductor Molding Systems Sales Quantity by Type (2021-2032)
11.2 Middle East & Africa Semiconductor Molding Systems Sales Quantity by Application (2021-2032)
11.3 Middle East & Africa Semiconductor Molding Systems Market Size by Country
- 11.3.1 Middle East & Africa Semiconductor Molding Systems Sales Quantity by Country (2021-2032)
- 11.3.2 Middle East & Africa Semiconductor Molding Systems Consumption Value by Country (2021-2032)
- 11.3.3 Turkey Market Size and Forecast (2021-2032)
- 11.3.4 Egypt Market Size and Forecast (2021-2032)
- 11.3.5 Saudi Arabia Market Size and Forecast (2021-2032)
- 11.3.6 South Africa Market Size and Forecast (2021-2032)

12 Market Dynamics

12.1 Semiconductor Molding Systems Market Drivers
12.2 Semiconductor Molding Systems Market Restraints
12.3 Semiconductor Molding Systems Trends Analysis
12.4 Porters Five Forces Analysis
- 12.4.1 Threat of New Entrants
- 12.4.2 Bargaining Power of Suppliers
- 12.4.3 Bargaining Power of Buyers
- 12.4.4 Threat of Substitutes
- 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

13.1 Raw Material of Semiconductor Molding Systems and Key Manufacturers
13.2 Manufacturing Costs Percentage of Semiconductor Molding Systems
13.3 Semiconductor Molding Systems Production Process
13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

14.1 Sales Channel
- 14.1.1 Direct to End-User
- 14.1.2 Distributors
14.2 Semiconductor Molding Systems Typical Distributors
14.3 Semiconductor Molding Systems Typical Customers

15 Research Findings and Conclusion

16 Appendix

16.1 Methodology
16.2 Research Process and Data Source

Description

According to our (Global Info Research) latest study, the global Semiconductor Molding Systems market size was valued at US$ 458 million in 2025 and is forecast to a readjusted size of US$ 705 million by 2032 with a CAGR of 6.4% during review period.
The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and testing. Packaging refers to cutting, wire bonding, molding, trim & forming the wafer after production and processing, so that the integrated circuit can achieve electrical and signal connections with external devices while providing physical and chemical protection for the integrated circuit. Molding refers to a plastic molding process in which packaging materials such as epoxy resin mixture are injected into the mold cavity at a certain temperature and pressure, and the devices that need to be protected, such as chips, are wrapped in the plastic, and then solidified into a whole body.
The roles of Molding products in semiconductor packaging are as follows:
1. Protective effect. Exposed semiconductor chips will not fail under strict environmental control, but the daily environment does not have the required environmental control conditions at all, so the chips need to be protected by packaging.
2. Supporting effect. The support has two functions. One is to support the chip, which is to fix the chip to facilitate circuit connection. The other is to form a certain shape to support the entire device after the packaging is completed, making the entire device less likely to be damaged.
3. Connection function. The function of the connection is to connect the electrodes of the chip to the external circuit, the pin is used to connect the external circuit, and the gold wire connects the pin to the circuit of the chip. The carrier stage is used to carry the chip, the epoxy resin adhesive is used to stick the chip on the carrier stage, the pins are used to support the entire device, and the plastic package plays a role in fixing and protecting it.
4. Ensure reliability. Any packaging needs to have a certain degree of reliability, which is the most important metric in the entire packaging process.
Semiconductor packaging equipment plays a vital role in the semiconductor manufacturing process, especially in the plastic encapsulation process, which ensures that the chip is protected, the electrical connection with the external circuit board is stable, and the mechanical stability is enhanced.
Plastic encapsulation refers to the process of injecting encapsulation materials (such as epoxy resin mixtures) into the mold cavity at a certain temperature and pressure, wrapping the chip and other devices that need to be protected in the plastic encapsulation material, and then curing them into a whole.
The degree of automation of semiconductor plastic encapsulation machines determines the cost of the entire encapsulation process, such as labor costs, packaging raw material costs, etc. The price difference between different products is very large, mainly depending on the number of presses. The more presses, the more expensive the price. In various regions of the world, the production areas of semiconductor plastic encapsulation systems are mainly distributed in Japan and China, with Japan occupying most of the market share. There is still a certain gap between Chinese plastic encapsulation machines and international leading companies (such as TOWA) in terms of product performance and packaging technology. However, as Chinese companies have made continuous breakthroughs in product development technology in recent years, some companies have also occupied a certain market share in the advanced packaging market, such as HIIG Trinity (Anhui) Technology.
This report is a detailed and comprehensive analysis for global Semiconductor Molding Systems market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor Molding Systems market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2021-2032
Global Semiconductor Molding Systems market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2021-2032
Global Semiconductor Molding Systems market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2021-2032
Global Semiconductor Molding Systems market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor Molding Systems
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor Molding Systems market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Towa, Besi, ASMPT, I-PEX Inc, HIIG Trinity (Anhui) Technology, Shanghai Xinsheng, Mtex Matsumura, Asahi Engineering, Nextool Technology Co., Ltd., APIC YAMADA, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Semiconductor Molding Systems market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fully Automatic Molding System
Semi-automatic Molding System
Manual Molding System
Market segment by Application
Advanced Packaging
Traditional Packaging
Major players covered
Towa
Besi
ASMPT
I-PEX Inc
HIIG Trinity (Anhui) Technology
Shanghai Xinsheng
Mtex Matsumura
Asahi Engineering
Nextool Technology Co., Ltd.
APIC YAMADA
Suzhou Bopai Semiconductor (Boschman)
Suzhou Saiken Intelligent Technology
Jiangsu Guoxin Intelligent Equipment Co., Ltd
Dongguan Huayue Semiconductor Technology
GALLANT Micro Machining Co., Ltd.
M-Fine Technology (Shanghai) Co., Ltd
Wuxi G-chp Semicondutor Technology
Guangdong Taijin Semiconductor Technology Co., Ltd
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor Molding Systems product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Semiconductor Molding Systems, with price, sales quantity, revenue, and global market share of Semiconductor Molding Systems from 2021 to 2026.
Chapter 3, the Semiconductor Molding Systems competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor Molding Systems breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and Semiconductor Molding Systems market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Molding Systems.
Chapter 14 and 15, to describe Semiconductor Molding Systems sales channel, distributors, customers, research findings and conclusion.

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