Copyright Reports & Markets. All rights reserved.

Global (United States, European Union and China) Semiconductor Equipment Packaging and Test Market Research Report 2019-2025

Request for Sample of this report
Buy now

Table of Contents

    1 Report Overview

    • 1.1 Research Scope
    • 1.2 Major Manufacturers Covered in This Report
    • 1.3 Market Segment by Type
      • 1.3.1 Global Semiconductor Equipment Packaging and Test Market Size Growth Rate by Type (2019-2025)
      • 1.3.2 Semiconductor Equipment Packaging
      • 1.3.3 Semiconductor Equipment Test
    • 1.4 Market Segment by Application
      • 1.4.1 Global Semiconductor Equipment Packaging and Test Market Share by Application (2019-2025)
      • 1.4.2 Integrated Device Manufacturer (IDMs)
      • 1.4.3 Outsourced Semiconductor Assembly and Test (OSAT)
    • 1.5 Study Objectives
    • 1.6 Years Considered

    2 Global Growth Trends

    • 2.1 Production and Capacity Analysis
      • 2.1.1 Global Semiconductor Equipment Packaging and Test Production Value 2014-2025
      • 2.1.2 Global Semiconductor Equipment Packaging and Test Production 2014-2025
      • 2.1.3 Global Semiconductor Equipment Packaging and Test Capacity 2014-2025
      • 2.1.4 Global Semiconductor Equipment Packaging and Test Marketing Pricing and Trends
    • 2.2 Key Producers Growth Rate (CAGR) 2019-2025
      • 2.2.1 Global Semiconductor Equipment Packaging and Test Market Size CAGR of Key Regions
      • 2.2.2 Global Semiconductor Equipment Packaging and Test Market Share of Key Regions
    • 2.3 Industry Trends
      • 2.3.1 Market Top Trends
      • 2.3.2 Market Drivers

    3 Market Share by Manufacturers

    • 3.1 Capacity and Production by Manufacturers
      • 3.1.1 Global Semiconductor Equipment Packaging and Test Capacity by Manufacturers
      • 3.1.2 Global Semiconductor Equipment Packaging and Test Production by Manufacturers
    • 3.2 Revenue by Manufacturers
      • 3.2.1 Semiconductor Equipment Packaging and Test Revenue by Manufacturers (2014-2019)
      • 3.2.2 Semiconductor Equipment Packaging and Test Revenue Share by Manufacturers (2014-2019)
      • 3.2.3 Global Semiconductor Equipment Packaging and Test Market Concentration Ratio (CR5 and HHI)
    • 3.3 Semiconductor Equipment Packaging and Test Price by Manufacturers
    • 3.4 Key Manufacturers Semiconductor Equipment Packaging and Test Plants/Factories Distribution and Area Served
    • 3.5 Date of Key Manufacturers Enter into Semiconductor Equipment Packaging and Test Market
    • 3.6 Key Manufacturers Semiconductor Equipment Packaging and Test Product Offered
    • 3.7 Mergers & Acquisitions, Expansion Plans

    4 Market Size by Type

    • 4.1 Production and Production Value for Each Type
      • 4.1.1 Semiconductor Equipment Packaging Production and Production Value (2014-2019)
      • 4.1.2 Semiconductor Equipment Test Production and Production Value (2014-2019)
    • 4.2 Global Semiconductor Equipment Packaging and Test Production Market Share by Type
    • 4.3 Global Semiconductor Equipment Packaging and Test Production Value Market Share by Type
    • 4.4 Semiconductor Equipment Packaging and Test Ex-factory Price by Type

    5 Market Size by Application

    • 5.1 Overview
    • 5.2 Global Semiconductor Equipment Packaging and Test Consumption by Application

    6 Production by Regions

    • 6.1 Global Semiconductor Equipment Packaging and Test Production (History Data) by Regions 2014-2019
    • 6.2 Global Semiconductor Equipment Packaging and Test Production Value (History Data) by Regions
    • 6.3 United States
      • 6.3.1 United States Semiconductor Equipment Packaging and Test Production Growth Rate 2014-2019
      • 6.3.2 United States Semiconductor Equipment Packaging and Test Production Value Growth Rate 2014-2019
      • 6.3.3 Key Players in United States
      • 6.3.4 United States Semiconductor Equipment Packaging and Test Import & Export
    • 6.4 European Union
      • 6.4.1 European Union Semiconductor Equipment Packaging and Test Production Growth Rate 2014-2019
      • 6.4.2 European Union Semiconductor Equipment Packaging and Test Production Value Growth Rate 2014-2019
      • 6.4.3 Key Players in European Union
      • 6.4.4 European Union Semiconductor Equipment Packaging and Test Import & Export
    • 6.5 China
      • 6.5.1 China Semiconductor Equipment Packaging and Test Production Growth Rate 2014-2019
      • 6.5.2 China Semiconductor Equipment Packaging and Test Production Value Growth Rate 2014-2019
      • 6.5.3 Key Players in China
      • 6.5.4 China Semiconductor Equipment Packaging and Test Import & Export
    • 6.6 Rest of World
      • 6.6.1 Japan
      • 6.6.2 Korea
      • 6.6.3 India
      • 6.6.4 Southeast Asia

    7 Semiconductor Equipment Packaging and Test Consumption by Regions

    • 7.1 Global Semiconductor Equipment Packaging and Test Consumption (History Data) by Regions
    • 7.2 United States
      • 7.2.1 United States Semiconductor Equipment Packaging and Test Consumption by Type
      • 7.2.2 United States Semiconductor Equipment Packaging and Test Consumption by Application
    • 7.3 European Union
      • 7.3.1 European Union Semiconductor Equipment Packaging and Test Consumption by Type
      • 7.3.2 European Union Semiconductor Equipment Packaging and Test Consumption by Application
    • 7.4 China
      • 7.4.1 China Semiconductor Equipment Packaging and Test Consumption by Type
      • 7.4.2 China Semiconductor Equipment Packaging and Test Consumption by Application
    • 7.5 Rest of World
      • 7.5.1 Rest of World Semiconductor Equipment Packaging and Test Consumption by Type
      • 7.5.2 Rest of World Semiconductor Equipment Packaging and Test Consumption by Application
      • 7.5.1 Japan
      • 7.5.2 Korea
      • 7.5.3 India
      • 7.5.4 Southeast Asia

    8 Company Profiles

    • 8.1 Amkor Technology
      • 8.1.1 Amkor Technology Company Details
      • 8.1.2 Company Description and Business Overview
      • 8.1.3 Production and Revenue of Semiconductor Equipment Packaging and Test
      • 8.1.4 Semiconductor Equipment Packaging and Test Product Introduction
      • 8.1.5 Amkor Technology Recent Development
    • 8.2 ASE
      • 8.2.1 ASE Company Details
      • 8.2.2 Company Description and Business Overview
      • 8.2.3 Production and Revenue of Semiconductor Equipment Packaging and Test
      • 8.2.4 Semiconductor Equipment Packaging and Test Product Introduction
      • 8.2.5 ASE Recent Development
    • 8.3 Powertech Technology
      • 8.3.1 Powertech Technology Company Details
      • 8.3.2 Company Description and Business Overview
      • 8.3.3 Production and Revenue of Semiconductor Equipment Packaging and Test
      • 8.3.4 Semiconductor Equipment Packaging and Test Product Introduction
      • 8.3.5 Powertech Technology Recent Development
    • 8.4 Siliconware Precision Industries (SPIL)
      • 8.4.1 Siliconware Precision Industries (SPIL) Company Details
      • 8.4.2 Company Description and Business Overview
      • 8.4.3 Production and Revenue of Semiconductor Equipment Packaging and Test
      • 8.4.4 Semiconductor Equipment Packaging and Test Product Introduction
      • 8.4.5 Siliconware Precision Industries (SPIL) Recent Development
    • 8.5 STATS ChipPAC
      • 8.5.1 STATS ChipPAC Company Details
      • 8.5.2 Company Description and Business Overview
      • 8.5.3 Production and Revenue of Semiconductor Equipment Packaging and Test
      • 8.5.4 Semiconductor Equipment Packaging and Test Product Introduction
      • 8.5.5 STATS ChipPAC Recent Development
    • 8.6 UTAC
      • 8.6.1 UTAC Company Details
      • 8.6.2 Company Description and Business Overview
      • 8.6.3 Production and Revenue of Semiconductor Equipment Packaging and Test
      • 8.6.4 Semiconductor Equipment Packaging and Test Product Introduction
      • 8.6.5 UTAC Recent Development
    • 8.7 ChipMos
      • 8.7.1 ChipMos Company Details
      • 8.7.2 Company Description and Business Overview
      • 8.7.3 Production and Revenue of Semiconductor Equipment Packaging and Test
      • 8.7.4 Semiconductor Equipment Packaging and Test Product Introduction
      • 8.7.5 ChipMos Recent Development
    • 8.8 Greatek
      • 8.8.1 Greatek Company Details
      • 8.8.2 Company Description and Business Overview
      • 8.8.3 Production and Revenue of Semiconductor Equipment Packaging and Test
      • 8.8.4 Semiconductor Equipment Packaging and Test Product Introduction
      • 8.8.5 Greatek Recent Development
    • 8.9 Huahong
      • 8.9.1 Huahong Company Details
      • 8.9.2 Company Description and Business Overview
      • 8.9.3 Production and Revenue of Semiconductor Equipment Packaging and Test
      • 8.9.4 Semiconductor Equipment Packaging and Test Product Introduction
      • 8.9.5 Huahong Recent Development
    • 8.10 JCET
      • 8.10.1 JCET Company Details
      • 8.10.2 Company Description and Business Overview
      • 8.10.3 Production and Revenue of Semiconductor Equipment Packaging and Test
      • 8.10.4 Semiconductor Equipment Packaging and Test Product Introduction
      • 8.10.5 JCET Recent Development
    • 8.11 KYEC
    • 8.12 Lingsen Precision
    • 8.13 Nepes
    • 8.14 SMIC
    • 8.15 Tianshui Huatian

    9 Market Forecast

    • 9.1 Global Market Size Forecast
      • 9.1.1 Global Semiconductor Equipment Packaging and Test Capacity, Production Forecast 2019-2025
      • 9.1.2 Global Semiconductor Equipment Packaging and Test Production Value Forecast 2019-2025
    • 9.2 Market Forecast by Regions
      • 9.2.1 Global Semiconductor Equipment Packaging and Test Production and Value Forecast by Regions 2019-2025
      • 9.2.2 Global Semiconductor Equipment Packaging and Test Consumption Forecast by Regions 2019-2025
    • 9.3 United States
      • 9.3.1 Production and Value Forecast in United States
      • 9.3.2 Consumption Forecast in United States
    • 9.4 European Union
      • 9.4.1 Production and Value Forecast in European Union
      • 9.4.2 Consumption Forecast in European Union
    • 9.5 China
      • 9.5.1 Production and Value Forecast in China
      • 9.5.2 Consumption Forecast in China
    • 9.6 Rest of World
      • 9.6.1 Japan
      • 9.6.2 Korea
      • 9.6.3 India
      • 9.6.4 Southeast Asia
    • 9.7 Forecast by Type
      • 9.7.1 Global Semiconductor Equipment Packaging and Test Production Forecast by Type
      • 9.7.2 Global Semiconductor Equipment Packaging and Test Production Value Forecast by Type
    • 9.8 Consumption Forecast by Application

    10 Value Chain and Sales Channels Analysis

    • 10.1 Value Chain Analysis
    • 10.2 Sales Channels Analysis
      • 10.2.1 Semiconductor Equipment Packaging and Test Sales Channels
      • 10.2.2 Semiconductor Equipment Packaging and Test Distributors
    • 10.3 Semiconductor Equipment Packaging and Test Customers

    11 Opportunities & Challenges, Threat and Affecting Factors

    • 11.1 Market Opportunities
    • 11.2 Market Challenges
    • 11.3 Porter's Five Forces Analysis

    12 Key Findings

      13 Appendix

      • 13.1 Research Methodology
        • 13.1.1 Methodology/Research Approach
          • 13.1.1.1 Research Programs/Design
          • 13.1.1.2 Market Size Estimation
          • 13.1.1.3 Market Breakdown and Data Triangulation
        • 13.1.2 Data Source
          • 13.1.2.1 Secondary Sources
          • 13.1.2.2 Primary Sources
      • 13.2 Author Details

      The rapid expansion of semiconductor chip application is one of the primary factors contributing to the growth of the semiconductor packaging and test market in China. The use of semiconductor chips has expanded broadly with rising demands from various industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics.
      In 2019, the market size of Semiconductor Equipment Packaging and Test is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
      In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Semiconductor Equipment Packaging and Test.

      This report studies the global market size of Semiconductor Equipment Packaging and Test, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
      This study presents the Semiconductor Equipment Packaging and Test production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
      For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

      In global market, the following companies are covered:
      Amkor Technology
      ASE
      Powertech Technology
      Siliconware Precision Industries (SPIL)
      STATS ChipPAC
      UTAC
      ChipMos
      Greatek
      Huahong
      JCET
      KYEC
      Lingsen Precision
      Nepes
      SMIC
      Tianshui Huatian

      Market Segment by Product Type
      Semiconductor Equipment Packaging
      Semiconductor Equipment Test

      Market Segment by Application
      Integrated Device Manufacturer (IDMs)
      Outsourced Semiconductor Assembly and Test (OSAT)

      Key Regions split in this report: breakdown data for each region.
      United States
      China
      European Union
      Rest of World (Japan, Korea, India and Southeast Asia)

      The study objectives are:
      To analyze and research the Semiconductor Equipment Packaging and Test status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
      To present the key Semiconductor Equipment Packaging and Test manufacturers, presenting the sales, revenue, market share, and recent development for key players.
      To split the breakdown data by regions, type, companies and applications
      To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
      To identify significant trends, drivers, influence factors in global and regions
      To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

      In this study, the years considered to estimate the market size of Semiconductor Equipment Packaging and Test are as follows:
      History Year: 2014-2018
      Base Year: 2018
      Estimated Year: 2019
      Forecast Year 2019 to 2025

      Buy now