Report Detail

Electronics & Semiconductor Global Radiation-Hardened Electronic Components Market Professional Survey Report 2019

  • RnM3733423
  • |
  • 07 September, 2019
  • |
  • Global
  • |
  • 117 Pages
  • |
  • QYResearch
  • |
  • Electronics & Semiconductor

Radiation hardening is a technique of making electronics and semiconductors devices resistant to damage caused by radiation. These devices are primarily used in high altitude applications where radiation could damage functioning of electronic components.
Geographically, North America is the largest market for radiation hardened electronics market. Europe is the second largest global market followed by Asia-Pacific.

The global Radiation-Hardened Electronic Components market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Radiation-Hardened Electronic Components volume and value at global level, regional level and company level. From a global perspective, this report represents overall Radiation-Hardened Electronic Components market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Radiation-Hardened Electronic Components in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Radiation-Hardened Electronic Components manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
Honeywell International
BAE Systems
Analog Devices
Texas Instruments
Atmel
Renesas Electronics
STMicroelectronics
Microsemi
Xilinx
Cobham
VPT
Data Device Corporation (DDC)
Intersil
Maxwell Technologies

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
Silicon
Silicon Carbide
Gallium Nitride
Others

Segment by Application
Aerospace and Defense
Medical
Consumer Electronics
Industrial
Others


Table of Contents

    Executive Summary

      1 Industry Overview of Radiation-Hardened Electronic Components

      • 1.1 Definition of Radiation-Hardened Electronic Components
      • 1.2 Radiation-Hardened Electronic Components Segment by Type
        • 1.2.1 Global Radiation-Hardened Electronic Components Production Growth Rate Comparison by Types (2014-2025)
        • 1.2.2 Silicon
        • 1.2.3 Silicon Carbide
        • 1.2.4 Gallium Nitride
        • 1.2.5 Others
      • 1.3 Radiation-Hardened Electronic Components Segment by Applications
        • 1.3.1 Global Radiation-Hardened Electronic Components Consumption Comparison by Applications (2014-2025)
        • 1.3.2 Aerospace and Defense
        • 1.3.3 Medical
        • 1.3.4 Consumer Electronics
        • 1.3.5 Industrial
        • 1.3.6 Others
      • 1.4 Global Radiation-Hardened Electronic Components Overall Market
        • 1.4.1 Global Radiation-Hardened Electronic Components Revenue (2014-2025)
        • 1.4.2 Global Radiation-Hardened Electronic Components Production (2014-2025)
        • 1.4.3 North America Radiation-Hardened Electronic Components Status and Prospect (2014-2025)
        • 1.4.4 Europe Radiation-Hardened Electronic Components Status and Prospect (2014-2025)
        • 1.4.5 China Radiation-Hardened Electronic Components Status and Prospect (2014-2025)
        • 1.4.6 Japan Radiation-Hardened Electronic Components Status and Prospect (2014-2025)
        • 1.4.7 Southeast Asia Radiation-Hardened Electronic Components Status and Prospect (2014-2025)
        • 1.4.8 India Radiation-Hardened Electronic Components Status and Prospect (2014-2025)

      2 Manufacturing Cost Structure Analysis

      • 2.1 Raw Material and Suppliers
      • 2.2 Manufacturing Cost Structure Analysis of Radiation-Hardened Electronic Components
      • 2.3 Manufacturing Process Analysis of Radiation-Hardened Electronic Components
      • 2.4 Industry Chain Structure of Radiation-Hardened Electronic Components

      3 Development and Manufacturing Plants Analysis of Radiation-Hardened Electronic Components

      • 3.1 Capacity and Commercial Production Date
      • 3.2 Global Radiation-Hardened Electronic Components Manufacturing Plants Distribution
      • 3.3 Major Manufacturers Technology Source and Market Position of Radiation-Hardened Electronic Components
      • 3.4 Recent Development and Expansion Plans

      4 Key Figures of Major Manufacturers

      • 4.1 Radiation-Hardened Electronic Components Production and Capacity Analysis
      • 4.2 Radiation-Hardened Electronic Components Revenue Analysis
      • 4.3 Radiation-Hardened Electronic Components Price Analysis
      • 4.4 Market Concentration Degree

      5 Radiation-Hardened Electronic Components Regional Market Analysis

      • 5.1 Radiation-Hardened Electronic Components Production by Regions
        • 5.1.1 Global Radiation-Hardened Electronic Components Production by Regions
        • 5.1.2 Global Radiation-Hardened Electronic Components Revenue by Regions
      • 5.2 Radiation-Hardened Electronic Components Consumption by Regions
      • 5.3 North America Radiation-Hardened Electronic Components Market Analysis
        • 5.3.1 North America Radiation-Hardened Electronic Components Production
        • 5.3.2 North America Radiation-Hardened Electronic Components Revenue
        • 5.3.3 Key Manufacturers in North America
        • 5.3.4 North America Radiation-Hardened Electronic Components Import and Export
      • 5.4 Europe Radiation-Hardened Electronic Components Market Analysis
        • 5.4.1 Europe Radiation-Hardened Electronic Components Production
        • 5.4.2 Europe Radiation-Hardened Electronic Components Revenue
        • 5.4.3 Key Manufacturers in Europe
        • 5.4.4 Europe Radiation-Hardened Electronic Components Import and Export
      • 5.5 China Radiation-Hardened Electronic Components Market Analysis
        • 5.5.1 China Radiation-Hardened Electronic Components Production
        • 5.5.2 China Radiation-Hardened Electronic Components Revenue
        • 5.5.3 Key Manufacturers in China
        • 5.5.4 China Radiation-Hardened Electronic Components Import and Export
      • 5.6 Japan Radiation-Hardened Electronic Components Market Analysis
        • 5.6.1 Japan Radiation-Hardened Electronic Components Production
        • 5.6.2 Japan Radiation-Hardened Electronic Components Revenue
        • 5.6.3 Key Manufacturers in Japan
        • 5.6.4 Japan Radiation-Hardened Electronic Components Import and Export
      • 5.7 Southeast Asia Radiation-Hardened Electronic Components Market Analysis
        • 5.7.1 Southeast Asia Radiation-Hardened Electronic Components Production
        • 5.7.2 Southeast Asia Radiation-Hardened Electronic Components Revenue
        • 5.7.3 Key Manufacturers in Southeast Asia
        • 5.7.4 Southeast Asia Radiation-Hardened Electronic Components Import and Export
      • 5.8 India Radiation-Hardened Electronic Components Market Analysis
        • 5.8.1 India Radiation-Hardened Electronic Components Production
        • 5.8.2 India Radiation-Hardened Electronic Components Revenue
        • 5.8.3 Key Manufacturers in India
        • 5.8.4 India Radiation-Hardened Electronic Components Import and Export

      6 Radiation-Hardened Electronic Components Segment Market Analysis (by Type)

      • 6.1 Global Radiation-Hardened Electronic Components Production by Type
      • 6.2 Global Radiation-Hardened Electronic Components Revenue by Type
      • 6.3 Radiation-Hardened Electronic Components Price by Type

      7 Radiation-Hardened Electronic Components Segment Market Analysis (by Application)

      • 7.1 Global Radiation-Hardened Electronic Components Consumption by Application
      • 7.2 Global Radiation-Hardened Electronic Components Consumption Market Share by Application (2014-2019)

      8 Radiation-Hardened Electronic Components Major Manufacturers Analysis

      • 8.1 Honeywell International
        • 8.1.1 Honeywell International Radiation-Hardened Electronic Components Production Sites and Area Served
        • 8.1.2 Honeywell International Product Introduction, Application and Specification
        • 8.1.3 Honeywell International Radiation-Hardened Electronic Components Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.1.4 Main Business and Markets Served
      • 8.2 BAE Systems
        • 8.2.1 BAE Systems Radiation-Hardened Electronic Components Production Sites and Area Served
        • 8.2.2 BAE Systems Product Introduction, Application and Specification
        • 8.2.3 BAE Systems Radiation-Hardened Electronic Components Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.2.4 Main Business and Markets Served
      • 8.3 Analog Devices
        • 8.3.1 Analog Devices Radiation-Hardened Electronic Components Production Sites and Area Served
        • 8.3.2 Analog Devices Product Introduction, Application and Specification
        • 8.3.3 Analog Devices Radiation-Hardened Electronic Components Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.3.4 Main Business and Markets Served
      • 8.4 Texas Instruments
        • 8.4.1 Texas Instruments Radiation-Hardened Electronic Components Production Sites and Area Served
        • 8.4.2 Texas Instruments Product Introduction, Application and Specification
        • 8.4.3 Texas Instruments Radiation-Hardened Electronic Components Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.4.4 Main Business and Markets Served
      • 8.5 Atmel
        • 8.5.1 Atmel Radiation-Hardened Electronic Components Production Sites and Area Served
        • 8.5.2 Atmel Product Introduction, Application and Specification
        • 8.5.3 Atmel Radiation-Hardened Electronic Components Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.5.4 Main Business and Markets Served
      • 8.6 Renesas Electronics
        • 8.6.1 Renesas Electronics Radiation-Hardened Electronic Components Production Sites and Area Served
        • 8.6.2 Renesas Electronics Product Introduction, Application and Specification
        • 8.6.3 Renesas Electronics Radiation-Hardened Electronic Components Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.6.4 Main Business and Markets Served
      • 8.7 STMicroelectronics
        • 8.7.1 STMicroelectronics Radiation-Hardened Electronic Components Production Sites and Area Served
        • 8.7.2 STMicroelectronics Product Introduction, Application and Specification
        • 8.7.3 STMicroelectronics Radiation-Hardened Electronic Components Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.7.4 Main Business and Markets Served
      • 8.8 Microsemi
        • 8.8.1 Microsemi Radiation-Hardened Electronic Components Production Sites and Area Served
        • 8.8.2 Microsemi Product Introduction, Application and Specification
        • 8.8.3 Microsemi Radiation-Hardened Electronic Components Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.8.4 Main Business and Markets Served
      • 8.9 Xilinx
        • 8.9.1 Xilinx Radiation-Hardened Electronic Components Production Sites and Area Served
        • 8.9.2 Xilinx Product Introduction, Application and Specification
        • 8.9.3 Xilinx Radiation-Hardened Electronic Components Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.9.4 Main Business and Markets Served
      • 8.10 Cobham
        • 8.10.1 Cobham Radiation-Hardened Electronic Components Production Sites and Area Served
        • 8.10.2 Cobham Product Introduction, Application and Specification
        • 8.10.3 Cobham Radiation-Hardened Electronic Components Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
        • 8.10.4 Main Business and Markets Served
      • 8.11 VPT
      • 8.12 Data Device Corporation (DDC)
      • 8.13 Intersil
      • 8.14 Maxwell Technologies

      9 Development Trend of Analysis of Radiation-Hardened Electronic Components Market

      • 9.1 Global Radiation-Hardened Electronic Components Market Trend Analysis
        • 9.1.1 Global Radiation-Hardened Electronic Components Market Size (Volume and Value) Forecast 2019-2025
      • 9.2 Radiation-Hardened Electronic Components Regional Market Trend
        • 9.2.1 North America Radiation-Hardened Electronic Components Forecast 2019-2025
        • 9.2.2 Europe Radiation-Hardened Electronic Components Forecast 2019-2025
        • 9.2.3 China Radiation-Hardened Electronic Components Forecast 2019-2025
        • 9.2.4 Japan Radiation-Hardened Electronic Components Forecast 2019-2025
        • 9.2.5 Southeast Asia Radiation-Hardened Electronic Components Forecast 2019-2025
        • 9.2.6 India Radiation-Hardened Electronic Components Forecast 2019-2025
      • 9.3 Radiation-Hardened Electronic Components Market Trend (Product Type)
      • 9.4 Radiation-Hardened Electronic Components Market Trend (Application)
      • 10.1 Marketing Channel
        • 10.1.1 Direct Marketing
        • 10.1.2 Indirect Marketing
      • 10.3 Radiation-Hardened Electronic Components Customers

      11 Market Dynamics

      • 11.1 Market Trends
      • 11.2 Opportunities
      • 11.3 Market Drivers
      • 11.4 Challenges
      • 11.5 Influence Factors

      12 Conclusion

        13 Appendix

        • 13.1 Methodology/Research Approach
          • 13.1.1 Research Programs/Design
          • 13.1.2 Market Size Estimation
          • 13.1.3 Market Breakdown and Data Triangulation
        • 13.2 Data Source
          • 13.2.1 Secondary Sources
          • 13.2.2 Primary Sources
        • 13.3 Author List

        Summary:
        Get latest Market Research Reports on Radiation-Hardened Electronic Components. Industry analysis & Market Report on Radiation-Hardened Electronic Components is a syndicated market report, published as Global Radiation-Hardened Electronic Components Market Professional Survey Report 2019. It is complete Research Study and Industry Analysis of Radiation-Hardened Electronic Components market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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