Table of Content

1 Market Overview

• 1.1 Market Segment Overview
  • 1.1.1 Product Definition
  • 1.1.2 Market by Type
    • 1.1.2.1 Flex
    • 1.1.2.2 Mirovia (HDI)
    • 1.1.2.3 Rigid-flex
    • 1.1.2.4 Substrates
  • 1.1.3 Market by Application
    • 1.1.3.1 Aerospace and Defense
    • 1.1.3.2 Automotive
    • 1.1.3.3 Cellular Phone
    • 1.1.3.4 Computing, Storage, and Peripherals
    • 1.1.3.5 Medical, Industrial, and Instrumentation
    • 1.1.3.6 Networking and Communications
    • 1.1.3.7 Others
• 1.2 Global and China Market Size
  • 1.2.1 Global Overview
  • 1.2.2 China Overview

2 Global and China Market by Company

• 2.1 Global
  • 2.1.1 Global Sales by Company
  • 2.1.2 Global Price by Company
• 2.2 China
  • 2.2.1 China Sales by Company
  • 2.2.2 China Price by Company

3 Global and China Market by Type

• 3.1 Global
  • 3.1.1 Global Sales by Type
  • 3.1.2 Global Price by Type
• 3.2 China
  • 3.2.1 China Sales by Type
  • 3.2.2 China Price by Type

4 Global and China Market by Application

• 4.1 Global
  • 4.1.1 Global Sales by Application
  • 4.1.2 Global Price by Application
• 4.2 China
  • 4.2.1 China Sales by Application
  • 4.2.2 China Price by Application

5 China Trade

• 5.1 Export
• 5.2 Import

6 Key Manufacturers

• 6.1 Nippon Mektron
  • 6.1.1 Company Information
  • 6.1.2 Product Specifications
  • 6.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
• 6.2 Zhen Ding Technology
• 6.3 Unimicron
• 6.4 Young Poong Group
• 6.5 Samsung Electro-Mechanics
• 6.6 Ibiden Group
• 6.7 Tripod Technology Corporation
• 6.8 TTM Technologies
• 6.9 Sumitomo Electric SEI
• 6.10 Daeduck Group
• 6.11 Nan Ya PCB Corporation
• 6.12 Compeq
• 6.13 Viasystems
• 6.14 HannStar Board (GBM)
• 6.15 LG Innotek
• 6.16 AT&S
• 6.17 Meiko
• 6.18 Kinsus
• 6.19 TPT
• 6.20 Fujikura
• 6.21 Chin Poon
• 6.22 Career
• 6.23 Flexium

7 Industry Upstream

• 7.1 Industry Chain
• 7.2 Raw Materials

8 Market Environment

• 8.1 SWOT
• 8.2 Porter's Five Forces

9 Conclusion

Summary

Market Segment as follows:
By Type
Flex
Mirovia (HDI)
Rigid-flex
Substrates
By Application
Aerospace and Defense
Automotive
Cellular Phone
Computing, Storage, and Peripherals
Medical, Industrial, and Instrumentation
Networking and Communications
Others
By Company
Nippon Mektron
Zhen Ding Technology
Unimicron
Young Poong Group
Samsung Electro-Mechanics
Ibiden Group
Tripod Technology Corporation
TTM Technologies
Sumitomo Electric SEI
Daeduck Group
Nan Ya PCB Corporation
Compeq
Viasystems
HannStar Board (GBM)
LG Innotek
AT&S
Meiko
Kinsus
TPT
Fujikura
Chin Poon
Career
Flexium
The main contents of the report including:
Section 1:
Product definition, type and application, global and China market overview;
Section 2:
Global and China Market competition by company;
Section 3:
Global and China sales revenue, volume and price by type;
Section 4:
Global and China sales revenue, volume and price by application;
Section 5:
China export and import;
Section 6:
Company information, business overview, sales data and product specifications;
Section 7:
Industry chain and raw materials;
Section 8:
SWOT and Porter's Five Forces;
Section 9:
Conclusion.