Table of Contents

1 Market Overview

• 1.1 Objectives of Research
  • 1.1.1 Definition
  • 1.1.2 Specifications
• 1.2 Market Segment
  • 1.2.1 by Type
    • 1.2.1.1 Single-Sided Boards
    • 1.2.1.2 Double-Sided Boards
    • 1.2.1.3 Multilayer Circuit Board
  • 1.2.2 by Application
    • 1.2.2.1 Electronic Industry
    • 1.2.2.2 Intelligent Control Equipment
  • 1.2.3 by Regions

2 Industry Chain

• 2.1 Industry Chain Structure
• 2.2 Upstream
• 2.3 Market
  • 2.3.1 SWOT
  • 2.3.2 Dynamics

3 Environmental Analysis

• 3.1 Policy
• 3.2 Economic
• 3.3 Technology
• 3.4 Market Entry

4 Market Segmentation by Type

• 4.1 Market Size
  • 4.1.1 Single-Sided Boards Market, 2013-2018
  • 4.1.2 Double-Sided Boards Market, 2013-2018
  • 4.1.3 Multilayer Circuit Board Market, 2013-2018
• 4.2 Market Forecast
  • 4.2.1 Single-Sided Boards Market Forecast, 2019-2024
  • 4.2.2 Double-Sided Boards Market Forecast, 2019-2024
  • 4.2.3 Multilayer Circuit Board Market Forecast, 2019-2024

5 Market Segmentation by Application

• 5.1 Market Size
  • 5.1.1 Electronic Industry Market, 2013-2018
  • 5.1.2 Intelligent Control Equipment Market, 2013-2018
• 5.2 Market Forecast
  • 5.2.1 Electronic Industry Market Forecast, 2019-2024
  • 5.2.2 Intelligent Control Equipment Market Forecast, 2019-2024

6 Market Segmentation by Region

• 6.1 Market Size
  • 6.1.1 Asia-Pacific
    • 6.1.1.1 Asia-Pacific Market, 2012-2018
    • 6.1.1.2 Asia-Pacific Market by Type
    • 6.1.1.3 Asia-Pacific Market by Application
  • 6.1.2 North America
    • 6.1.2.1 North America Market, 2012-2018
    • 6.1.2.2 North America Market by Type
    • 6.1.2.3 North America Market by Application
  • 6.1.3 Europe
    • 6.1.3.1 Europe Market, 2012-2018
    • 6.1.3.2 Europe Market by Type
    • 6.1.3.3 Europe Market by Application
  • 6.1.4 South America
    • 6.1.4.1 South America Market, 2012-2018
    • 6.1.4.2 South America Market by Type
    • 6.1.4.3 South America Market by Application
  • 6.1.5 Middle East & Africa
    • 6.1.5.1 Middle East & Africa Market, 2012-2018
    • 6.1.5.2 Middle East & Africa Market by Type
    • 6.1.5.3 Middle East & Africa Market by Application
• 6.2 Market Forecast
  • 6.2.1 Asia-Pacific Market Forecast, 2019-2024
  • 6.2.2 North America Market Forecast, 2019-2024
  • 6.2.3 Europe Market Forecast, 2019-2024
  • 6.2.4 South America Market Forecast, 2019-2024
  • 6.2.5 Middle East & Africa Market Forecast, 2019-2024

7 Market Competitive

• 7.1 Global Market by Vendors
• 7.2 Market Concentration
• 7.3 Price & Factors
• 7.4 Marketing Channel

8 Major Vendors

• 8.1 Mektec(Japan)
• 8.2 IBIDEN(Japan)
• 8.3 Samsung Electro-Mechanics(Korea)
• 8.4 AT&S(Austria)
• 8.5 TTM(US)
• 8.6 Unimicron(Taiwan, China)
• 8.7 Zhen Ding Tech(Taiwan, China)
• 8.8 Sumitomo Electric Industries(Japan)
• 8.9 MFS(Singapore)
• 8.10 YoungPoong(Korea)
• 8.11 CMK(Japan)
• 8.12 Founder(China)
• 8.13 SCC(China)
• 8.14 CCTC(China)
• 8.15 Nippon Mektron(Japan)
• 8.16 Foxconn(Taiwan, China)
• 8.17 Tripod(Taiwan, China)
• 8.18 Sumitomo Denko(Japan)
• 8.19 Daeduck Group(Korea)
• 8.20 HannStar Board (GBM) (Taiwan, China)
• 8.21 Viasystems(US)
• 8.22 Nanya PCB(Taiwan, China)
• 8.23 Kingboard PCB Group(China Hong Kong)
• 8.24 Shinko Electric Ind(Japan)
• 8.25 Mflex(US)
• 8.26 Compeq Mfg(Taiwan, China)
• 8.27 Meiko Electronics(Japan)

9 Conclusion

Summary
The global Printed Circuit Board(PCB) market will reach xxx Million USD in 2019 with CAGR xx% 2019-2024. The objective of report is to define, segment, and project the market on the basis of product type, application, and region, and to describe the content about the factors influencing market dynamics, policy, economic, technology and market entry etc.
Based on products type, the report describes major products type share of regional market. Products mentioned as follows:
Single-Sided Boards
Double-Sided Boards
Multilayer Circuit Board
Leading vendors in the market are included based on profile, business performance etc. Vendors mentioned as follows:
Mektec(Japan)
IBIDEN(Japan)
Samsung Electro-Mechanics(Korea)
AT&S(Austria)
TTM(US)
Unimicron(Taiwan, China)
Zhen Ding Tech(Taiwan, China)
Sumitomo Electric Industries(Japan)
MFS(Singapore)
YoungPoong(Korea)
CMK(Japan)
Founder(China)
SCC(China)
CCTC(China)
Nippon Mektron(Japan)
Foxconn(Taiwan, China)
Tripod(Taiwan, China)
Sumitomo Denko(Japan)
Daeduck Group(Korea)
HannStar Board (GBM) (Taiwan, China)
Viasystems(US)
Nanya PCB(Taiwan, China)
Kingboard PCB Group(China Hong Kong)
Shinko Electric Ind(Japan)
Mflex(US)
Compeq Mfg(Taiwan, China)
Meiko Electronics(Japan)
Based on Application, the report describes major application share of regional market. Application mentioned as follows:
Electronic Industry
Intelligent Control Equipment
Based on region, the report describes major regions market by products and application. Regions mentioned as follows:
Asia-Pacific
North America
Europe
South America
Middle East & Africa