Copyright Reports & Markets. All rights reserved.

Global Power Module Packaging Market Research Report 2012-2024

Request for Sample of this report
Buy now

Table of Contents

    1 Market Overview

    • 1.1 Objectives of Research
      • 1.1.1 Definition
      • 1.1.2 Specifications
    • 1.2 Market Segment
      • 1.2.1 by Type
        • 1.2.1.1 GaN Module
        • 1.2.1.2 FET Module
        • 1.2.1.3 IGBT Module
        • 1.2.1.4 SiC Module
      • 1.2.2 by Application
        • 1.2.2.1 Wind Turbines
        • 1.2.2.2 Rail Tractions
        • 1.2.2.3 Motors
        • 1.2.2.4 Electric Vehicles
        • 1.2.2.5 Photovoltaic Equipments
        • 1.2.2.6 Others
      • 1.2.3 by Regions

    2 Industry Chain

    • 2.1 Industry Chain Structure
    • 2.2 Upstream
    • 2.3 Market
      • 2.3.1 SWOT
      • 2.3.2 Dynamics

    3 Environmental Analysis

    • 3.1 Policy
    • 3.2 Economic
    • 3.3 Technology
    • 3.4 Market Entry

    4 Market Segmentation by Type

    • 4.1 Market Size
      • 4.1.1 GaN Module Market, 2013-2018
      • 4.1.2 FET Module Market, 2013-2018
      • 4.1.3 IGBT Module Market, 2013-2018
      • 4.1.4 SiC Module Market, 2013-2018
    • 4.2 Market Forecast
      • 4.2.1 GaN Module Market Forecast, 2019-2024
      • 4.2.2 FET Module Market Forecast, 2019-2024
      • 4.2.3 IGBT Module Market Forecast, 2019-2024
      • 4.2.4 SiC Module Market Forecast, 2019-2024

    5 Market Segmentation by Application

    • 5.1 Market Size
      • 5.1.1 Wind Turbines Market, 2013-2018
      • 5.1.2 Rail Tractions Market, 2013-2018
      • 5.1.3 Motors Market, 2013-2018
      • 5.1.4 Electric Vehicles Market, 2013-2018
      • 5.1.5 Photovoltaic Equipments Market, 2013-2018
      • 5.1.6 Others Market, 2013-2018
    • 5.2 Market Forecast
      • 5.2.1 Wind Turbines Market Forecast, 2019-2024
      • 5.2.2 Rail Tractions Market Forecast, 2019-2024
      • 5.2.3 Motors Market Forecast, 2019-2024
      • 5.2.4 Electric Vehicles Market Forecast, 2019-2024
      • 5.2.5 Photovoltaic Equipments Market Forecast, 2019-2024
      • 5.2.6 Others Market Forecast, 2019-2024

    6 Market Segmentation by Region

    • 6.1 Market Size
      • 6.1.1 Asia-Pacific
        • 6.1.1.1 Asia-Pacific Market, 2012-2018
        • 6.1.1.2 Asia-Pacific Market by Type
        • 6.1.1.3 Asia-Pacific Market by Application
      • 6.1.2 North America
        • 6.1.2.1 North America Market, 2012-2018
        • 6.1.2.2 North America Market by Type
        • 6.1.2.3 North America Market by Application
      • 6.1.3 Europe
        • 6.1.3.1 Europe Market, 2012-2018
        • 6.1.3.2 Europe Market by Type
        • 6.1.3.3 Europe Market by Application
      • 6.1.4 South America
        • 6.1.4.1 South America Market, 2012-2018
        • 6.1.4.2 South America Market by Type
        • 6.1.4.3 South America Market by Application
      • 6.1.5 Middle East & Africa
        • 6.1.5.1 Middle East & Africa Market, 2012-2018
        • 6.1.5.2 Middle East & Africa Market by Type
        • 6.1.5.3 Middle East & Africa Market by Application
    • 6.2 Market Forecast
      • 6.2.1 Asia-Pacific Market Forecast, 2019-2024
      • 6.2.2 North America Market Forecast, 2019-2024
      • 6.2.3 Europe Market Forecast, 2019-2024
      • 6.2.4 South America Market Forecast, 2019-2024
      • 6.2.5 Middle East & Africa Market Forecast, 2019-2024

    7 Market Competitive

    • 7.1 Global Market by Vendors
    • 7.2 Market Concentration
    • 7.3 Price & Factors
    • 7.4 Marketing Channel

    8 Major Vendors

    • 8.1 IXYS Corporation
    • 8.2 Star Automations
    • 8.3 DyDac Controls
    • 8.4 SEMIKRON
    • 8.5 Mitsubishi Electric Corporation
    • 8.6 Texas Instruments Incorporated
    • 8.7 Sanken Electric Co., Ltd.
    • 8.8 Fuji Electric Co. Ltd.
    • 8.9 Infineon Technologies AG
    • 8.10 SanRex Corporation

    9 Conclusion

    Summary
    The global Power Module Packaging market will reach xxx Million USD in 2019 with CAGR xx% 2019-2024. The objective of report is to define, segment, and project the market on the basis of product type, application, and region, and to describe the content about the factors influencing market dynamics, policy, economic, technology and market entry etc.
    Based on products type, the report describes major products type share of regional market. Products mentioned as follows:
    GaN Module
    FET Module
    IGBT Module
    SiC Module
    Leading vendors in the market are included based on profile, business performance etc. Vendors mentioned as follows:
    IXYS Corporation
    Star Automations
    DyDac Controls
    SEMIKRON
    Mitsubishi Electric Corporation
    Texas Instruments Incorporated
    Sanken Electric Co., Ltd.
    Fuji Electric Co. Ltd.
    Infineon Technologies AG
    SanRex Corporation
    Based on Application, the report describes major application share of regional market. Application mentioned as follows:
    Wind Turbines
    Rail Tractions
    Motors
    Electric Vehicles
    Photovoltaic Equipments
    Others
    Based on region, the report describes major regions market by products and application. Regions mentioned as follows:
    Asia-Pacific
    North America
    Europe
    South America
    Middle East & Africa

    Buy now