Global Power Electronic DCB & AMB Substrates Supply, Demand and Key Producers, 2026-2032
1 Supply Summary
- 1.1 Power Electronic DCB & AMB Substrates Introduction
- 1.2 World Power Electronic DCB & AMB Substrates Supply & Forecast
- 1.2.1 World Power Electronic DCB & AMB Substrates Production Value (2021 & 2025 & 2032)
- 1.2.2 World Power Electronic DCB & AMB Substrates Production (2021-2032)
- 1.2.3 World Power Electronic DCB & AMB Substrates Pricing Trends (2021-2032)
- 1.3 World Power Electronic DCB & AMB Substrates Production by Region (Based on Production Site)
- 1.3.1 World Power Electronic DCB & AMB Substrates Production Value by Region (2021-2032)
- 1.3.2 World Power Electronic DCB & AMB Substrates Production by Region (2021-2032)
- 1.3.3 World Power Electronic DCB & AMB Substrates Average Price by Region (2021-2032)
- 1.3.4 Europe Power Electronic DCB & AMB Substrates Production (2021-2032)
- 1.3.5 Japan Power Electronic DCB & AMB Substrates Production (2021-2032)
- 1.3.6 China Power Electronic DCB & AMB Substrates Production (2021-2032)
- 1.3.7 Southeast Asia Power Electronic DCB & AMB Substrates Production (2021-2032)
- 1.3.8 South Korea Power Electronic DCB & AMB Substrates Production (2021-2032)
- 1.4 Market Drivers, Restraints and Trends
- 1.4.1 Power Electronic DCB & AMB Substrates Market Drivers
- 1.4.2 Factors Affecting Demand
- 1.4.3 Power Electronic DCB & AMB Substrates Major Market Trends
2 Demand Summary
- 2.1 World Power Electronic DCB & AMB Substrates Demand (2021-2032)
- 2.2 World Power Electronic DCB & AMB Substrates Consumption by Region
- 2.2.1 World Power Electronic DCB & AMB Substrates Consumption by Region (2021-2026)
- 2.2.2 World Power Electronic DCB & AMB Substrates Consumption Forecast by Region (2027-2032)
- 2.3 United States Power Electronic DCB & AMB Substrates Consumption (2021-2032)
- 2.4 China Power Electronic DCB & AMB Substrates Consumption (2021-2032)
- 2.5 Europe Power Electronic DCB & AMB Substrates Consumption (2021-2032)
- 2.6 Japan Power Electronic DCB & AMB Substrates Consumption (2021-2032)
- 2.7 South Korea Power Electronic DCB & AMB Substrates Consumption (2021-2032)
- 2.8 ASEAN Power Electronic DCB & AMB Substrates Consumption (2021-2032)
- 2.9 India Power Electronic DCB & AMB Substrates Consumption (2021-2032)
3 World Manufacturers Competitive Analysis
- 3.1 World Power Electronic DCB & AMB Substrates Production Value by Manufacturer (2021-2026)
- 3.2 World Power Electronic DCB & AMB Substrates Production by Manufacturer (2021-2026)
- 3.3 World Power Electronic DCB & AMB Substrates Average Price by Manufacturer (2021-2026)
- 3.4 Power Electronic DCB & AMB Substrates Company Evaluation Quadrant
- 3.5 Industry Rank and Concentration Rate (CR)
- 3.5.1 Global Power Electronic DCB & AMB Substrates Industry Rank of Major Manufacturers
- 3.5.2 Global Concentration Ratios (CR4) for Power Electronic DCB & AMB Substrates in 2025
- 3.5.3 Global Concentration Ratios (CR8) for Power Electronic DCB & AMB Substrates in 2025
- 3.6 Power Electronic DCB & AMB Substrates Market: Overall Company Footprint Analysis
- 3.6.1 Power Electronic DCB & AMB Substrates Market: Region Footprint
- 3.6.2 Power Electronic DCB & AMB Substrates Market: Company Product Type Footprint
- 3.6.3 Power Electronic DCB & AMB Substrates Market: Company Product Application Footprint
- 3.7 Competitive Environment
- 3.7.1 Historical Structure of the Industry
- 3.7.2 Barriers of Market Entry
- 3.7.3 Factors of Competition
- 3.8 New Entrant and Capacity Expansion Plans
- 3.9 Mergers, Acquisition, Agreements, and Collaborations
4 United States VS China VS Rest of the World
- 4.1 United States VS China: Power Electronic DCB & AMB Substrates Production Value Comparison
- 4.1.1 United States VS China: Power Electronic DCB & AMB Substrates Production Value Comparison (2021 & 2025 & 2032)
- 4.1.2 United States VS China: Power Electronic DCB & AMB Substrates Production Value Market Share Comparison (2021 & 2025 & 2032)
- 4.2 United States VS China: Power Electronic DCB & AMB Substrates Production Comparison
- 4.2.1 United States VS China: Power Electronic DCB & AMB Substrates Production Comparison (2021 & 2025 & 2032)
- 4.2.2 United States VS China: Power Electronic DCB & AMB Substrates Production Market Share Comparison (2021 & 2025 & 2032)
- 4.3 United States VS China: Power Electronic DCB & AMB Substrates Consumption Comparison
- 4.3.1 United States VS China: Power Electronic DCB & AMB Substrates Consumption Comparison (2021 & 2025 & 2032)
- 4.3.2 United States VS China: Power Electronic DCB & AMB Substrates Consumption Market Share Comparison (2021 & 2025 & 2032)
- 4.4 United States Based Power Electronic DCB & AMB Substrates Manufacturers and Market Share, 2021-2026
- 4.4.1 United States Based Power Electronic DCB & AMB Substrates Manufacturers, Headquarters and Production Site (States, Country)
- 4.4.2 United States Based Manufacturers Power Electronic DCB & AMB Substrates Production Value (2021-2026)
- 4.4.3 United States Based Manufacturers Power Electronic DCB & AMB Substrates Production (2021-2026)
- 4.5 China Based Power Electronic DCB & AMB Substrates Manufacturers and Market Share
- 4.5.1 China Based Power Electronic DCB & AMB Substrates Manufacturers, Headquarters and Production Site (Province, Country)
- 4.5.2 China Based Manufacturers Power Electronic DCB & AMB Substrates Production Value (2021-2026)
- 4.5.3 China Based Manufacturers Power Electronic DCB & AMB Substrates Production (2021-2026)
- 4.6 Rest of World Based Power Electronic DCB & AMB Substrates Manufacturers and Market Share, 2021-2026
- 4.6.1 Rest of World Based Power Electronic DCB & AMB Substrates Manufacturers, Headquarters and Production Site (State, Country)
- 4.6.2 Rest of World Based Manufacturers Power Electronic DCB & AMB Substrates Production Value (2021-2026)
- 4.6.3 Rest of World Based Manufacturers Power Electronic DCB & AMB Substrates Production (2021-2026)
5 Market Analysis by Type
- 5.1 World Power Electronic DCB & AMB Substrates Market Size Overview by Type: 2021 VS 2025 VS 2032
- 5.2 Segment Introduction by Type
- 5.2.1 DBC Ceramic Substrates
- 5.2.2 AMB Ceramic Substrate
- 5.3 Market Segment by Type
- 5.3.1 World Power Electronic DCB & AMB Substrates Production by Type (2021-2032)
- 5.3.2 World Power Electronic DCB & AMB Substrates Production Value by Type (2021-2032)
- 5.3.3 World Power Electronic DCB & AMB Substrates Average Price by Type (2021-2032)
6 Market Analysis by Application
- 6.1 World Power Electronic DCB & AMB Substrates Market Size Overview by Application: 2021 VS 2025 VS 2032
- 6.2 Segment Introduction by Application
- 6.2.1 Automotive & EV/HEV
- 6.2.2 PV and Wind Power
- 6.2.3 Industrial Drives
- 6.2.4 Rail Transport
- 6.2.5 Consumer & White Goods
- 6.2.6 Military & Avionics
- 6.2.7 Thermoelectric Module (TEM)
- 6.2.8 Others
- 6.3 Market Segment by Application
- 6.3.1 World Power Electronic DCB & AMB Substrates Production by Application (2021-2032)
- 6.3.2 World Power Electronic DCB & AMB Substrates Production Value by Application (2021-2032)
- 6.3.3 World Power Electronic DCB & AMB Substrates Average Price by Application (2021-2032)
7 Company Profiles
- 7.1 Rogers Corporation
- 7.1.1 Rogers Corporation Details
- 7.1.2 Rogers Corporation Major Business
- 7.1.3 Rogers Corporation Power Electronic DCB & AMB Substrates Product and Services
- 7.1.4 Rogers Corporation Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.1.5 Rogers Corporation Recent Developments/Updates
- 7.1.6 Rogers Corporation Competitive Strengths & Weaknesses
- 7.2 Heraeus Electronics
- 7.2.1 Heraeus Electronics Details
- 7.2.2 Heraeus Electronics Major Business
- 7.2.3 Heraeus Electronics Power Electronic DCB & AMB Substrates Product and Services
- 7.2.4 Heraeus Electronics Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.2.5 Heraeus Electronics Recent Developments/Updates
- 7.2.6 Heraeus Electronics Competitive Strengths & Weaknesses
- 7.3 Kyocera
- 7.3.1 Kyocera Details
- 7.3.2 Kyocera Major Business
- 7.3.3 Kyocera Power Electronic DCB & AMB Substrates Product and Services
- 7.3.4 Kyocera Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.3.5 Kyocera Recent Developments/Updates
- 7.3.6 Kyocera Competitive Strengths & Weaknesses
- 7.4 NGK Electronics Devices
- 7.4.1 NGK Electronics Devices Details
- 7.4.2 NGK Electronics Devices Major Business
- 7.4.3 NGK Electronics Devices Power Electronic DCB & AMB Substrates Product and Services
- 7.4.4 NGK Electronics Devices Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.4.5 NGK Electronics Devices Recent Developments/Updates
- 7.4.6 NGK Electronics Devices Competitive Strengths & Weaknesses
- 7.5 Toshiba Materials
- 7.5.1 Toshiba Materials Details
- 7.5.2 Toshiba Materials Major Business
- 7.5.3 Toshiba Materials Power Electronic DCB & AMB Substrates Product and Services
- 7.5.4 Toshiba Materials Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.5.5 Toshiba Materials Recent Developments/Updates
- 7.5.6 Toshiba Materials Competitive Strengths & Weaknesses
- 7.6 Denka
- 7.6.1 Denka Details
- 7.6.2 Denka Major Business
- 7.6.3 Denka Power Electronic DCB & AMB Substrates Product and Services
- 7.6.4 Denka Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.6.5 Denka Recent Developments/Updates
- 7.6.6 Denka Competitive Strengths & Weaknesses
- 7.7 DOWA METALTECH
- 7.7.1 DOWA METALTECH Details
- 7.7.2 DOWA METALTECH Major Business
- 7.7.3 DOWA METALTECH Power Electronic DCB & AMB Substrates Product and Services
- 7.7.4 DOWA METALTECH Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.7.5 DOWA METALTECH Recent Developments/Updates
- 7.7.6 DOWA METALTECH Competitive Strengths & Weaknesses
- 7.8 KCC
- 7.8.1 KCC Details
- 7.8.2 KCC Major Business
- 7.8.3 KCC Power Electronic DCB & AMB Substrates Product and Services
- 7.8.4 KCC Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.8.5 KCC Recent Developments/Updates
- 7.8.6 KCC Competitive Strengths & Weaknesses
- 7.9 Proterial
- 7.9.1 Proterial Details
- 7.9.2 Proterial Major Business
- 7.9.3 Proterial Power Electronic DCB & AMB Substrates Product and Services
- 7.9.4 Proterial Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.9.5 Proterial Recent Developments/Updates
- 7.9.6 Proterial Competitive Strengths & Weaknesses
- 7.10 Mitsubishi Materials
- 7.10.1 Mitsubishi Materials Details
- 7.10.2 Mitsubishi Materials Major Business
- 7.10.3 Mitsubishi Materials Power Electronic DCB & AMB Substrates Product and Services
- 7.10.4 Mitsubishi Materials Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.10.5 Mitsubishi Materials Recent Developments/Updates
- 7.10.6 Mitsubishi Materials Competitive Strengths & Weaknesses
- 7.11 Jiangsu Fulehua Semiconductor Technology
- 7.11.1 Jiangsu Fulehua Semiconductor Technology Details
- 7.11.2 Jiangsu Fulehua Semiconductor Technology Major Business
- 7.11.3 Jiangsu Fulehua Semiconductor Technology Power Electronic DCB & AMB Substrates Product and Services
- 7.11.4 Jiangsu Fulehua Semiconductor Technology Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.11.5 Jiangsu Fulehua Semiconductor Technology Recent Developments/Updates
- 7.11.6 Jiangsu Fulehua Semiconductor Technology Competitive Strengths & Weaknesses
- 7.12 BYD
- 7.12.1 BYD Details
- 7.12.2 BYD Major Business
- 7.12.3 BYD Power Electronic DCB & AMB Substrates Product and Services
- 7.12.4 BYD Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.12.5 BYD Recent Developments/Updates
- 7.12.6 BYD Competitive Strengths & Weaknesses
- 7.13 Bomin Electronics
- 7.13.1 Bomin Electronics Details
- 7.13.2 Bomin Electronics Major Business
- 7.13.3 Bomin Electronics Power Electronic DCB & AMB Substrates Product and Services
- 7.13.4 Bomin Electronics Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.13.5 Bomin Electronics Recent Developments/Updates
- 7.13.6 Bomin Electronics Competitive Strengths & Weaknesses
- 7.14 Zhejiang TC Ceramic Electronic
- 7.14.1 Zhejiang TC Ceramic Electronic Details
- 7.14.2 Zhejiang TC Ceramic Electronic Major Business
- 7.14.3 Zhejiang TC Ceramic Electronic Power Electronic DCB & AMB Substrates Product and Services
- 7.14.4 Zhejiang TC Ceramic Electronic Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.14.5 Zhejiang TC Ceramic Electronic Recent Developments/Updates
- 7.14.6 Zhejiang TC Ceramic Electronic Competitive Strengths & Weaknesses
- 7.15 Shengda Tech
- 7.15.1 Shengda Tech Details
- 7.15.2 Shengda Tech Major Business
- 7.15.3 Shengda Tech Power Electronic DCB & AMB Substrates Product and Services
- 7.15.4 Shengda Tech Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.15.5 Shengda Tech Recent Developments/Updates
- 7.15.6 Shengda Tech Competitive Strengths & Weaknesses
- 7.16 Beijing Moshi Technology
- 7.16.1 Beijing Moshi Technology Details
- 7.16.2 Beijing Moshi Technology Major Business
- 7.16.3 Beijing Moshi Technology Power Electronic DCB & AMB Substrates Product and Services
- 7.16.4 Beijing Moshi Technology Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.16.5 Beijing Moshi Technology Recent Developments/Updates
- 7.16.6 Beijing Moshi Technology Competitive Strengths & Weaknesses
- 7.17 Nantong Winspower
- 7.17.1 Nantong Winspower Details
- 7.17.2 Nantong Winspower Major Business
- 7.17.3 Nantong Winspower Power Electronic DCB & AMB Substrates Product and Services
- 7.17.4 Nantong Winspower Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.17.5 Nantong Winspower Recent Developments/Updates
- 7.17.6 Nantong Winspower Competitive Strengths & Weaknesses
- 7.18 Wuxi Tianyang Electronics
- 7.18.1 Wuxi Tianyang Electronics Details
- 7.18.2 Wuxi Tianyang Electronics Major Business
- 7.18.3 Wuxi Tianyang Electronics Power Electronic DCB & AMB Substrates Product and Services
- 7.18.4 Wuxi Tianyang Electronics Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.18.5 Wuxi Tianyang Electronics Recent Developments/Updates
- 7.18.6 Wuxi Tianyang Electronics Competitive Strengths & Weaknesses
- 7.19 Fengpeng Electronics (Zhuhai)
- 7.19.1 Fengpeng Electronics (Zhuhai) Details
- 7.19.2 Fengpeng Electronics (Zhuhai) Major Business
- 7.19.3 Fengpeng Electronics (Zhuhai) Power Electronic DCB & AMB Substrates Product and Services
- 7.19.4 Fengpeng Electronics (Zhuhai) Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.19.5 Fengpeng Electronics (Zhuhai) Recent Developments/Updates
- 7.19.6 Fengpeng Electronics (Zhuhai) Competitive Strengths & Weaknesses
- 7.20 Guangzhou Xianyi Electronic Technology
- 7.20.1 Guangzhou Xianyi Electronic Technology Details
- 7.20.2 Guangzhou Xianyi Electronic Technology Major Business
- 7.20.3 Guangzhou Xianyi Electronic Technology Power Electronic DCB & AMB Substrates Product and Services
- 7.20.4 Guangzhou Xianyi Electronic Technology Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.20.5 Guangzhou Xianyi Electronic Technology Recent Developments/Updates
- 7.20.6 Guangzhou Xianyi Electronic Technology Competitive Strengths & Weaknesses
- 7.21 Fujian Huaqing Electronic Material Technology
- 7.21.1 Fujian Huaqing Electronic Material Technology Details
- 7.21.2 Fujian Huaqing Electronic Material Technology Major Business
- 7.21.3 Fujian Huaqing Electronic Material Technology Power Electronic DCB & AMB Substrates Product and Services
- 7.21.4 Fujian Huaqing Electronic Material Technology Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.21.5 Fujian Huaqing Electronic Material Technology Recent Developments/Updates
- 7.21.6 Fujian Huaqing Electronic Material Technology Competitive Strengths & Weaknesses
- 7.22 Konfoong Materials International
- 7.22.1 Konfoong Materials International Details
- 7.22.2 Konfoong Materials International Major Business
- 7.22.3 Konfoong Materials International Power Electronic DCB & AMB Substrates Product and Services
- 7.22.4 Konfoong Materials International Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.22.5 Konfoong Materials International Recent Developments/Updates
- 7.22.6 Konfoong Materials International Competitive Strengths & Weaknesses
- 7.23 Chengdu Wanshida Ceramic Industry
- 7.23.1 Chengdu Wanshida Ceramic Industry Details
- 7.23.2 Chengdu Wanshida Ceramic Industry Major Business
- 7.23.3 Chengdu Wanshida Ceramic Industry Power Electronic DCB & AMB Substrates Product and Services
- 7.23.4 Chengdu Wanshida Ceramic Industry Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.23.5 Chengdu Wanshida Ceramic Industry Recent Developments/Updates
- 7.23.6 Chengdu Wanshida Ceramic Industry Competitive Strengths & Weaknesses
- 7.24 Littelfuse IXYS
- 7.24.1 Littelfuse IXYS Details
- 7.24.2 Littelfuse IXYS Major Business
- 7.24.3 Littelfuse IXYS Power Electronic DCB & AMB Substrates Product and Services
- 7.24.4 Littelfuse IXYS Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.24.5 Littelfuse IXYS Recent Developments/Updates
- 7.24.6 Littelfuse IXYS Competitive Strengths & Weaknesses
- 7.25 Zhejiang Jingci Semiconductor
- 7.25.1 Zhejiang Jingci Semiconductor Details
- 7.25.2 Zhejiang Jingci Semiconductor Major Business
- 7.25.3 Zhejiang Jingci Semiconductor Power Electronic DCB & AMB Substrates Product and Services
- 7.25.4 Zhejiang Jingci Semiconductor Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.25.5 Zhejiang Jingci Semiconductor Recent Developments/Updates
- 7.25.6 Zhejiang Jingci Semiconductor Competitive Strengths & Weaknesses
- 7.26 Taotao Technology
- 7.26.1 Taotao Technology Details
- 7.26.2 Taotao Technology Major Business
- 7.26.3 Taotao Technology Power Electronic DCB & AMB Substrates Product and Services
- 7.26.4 Taotao Technology Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.26.5 Taotao Technology Recent Developments/Updates
- 7.26.6 Taotao Technology Competitive Strengths & Weaknesses
- 7.27 FJ Composite
- 7.27.1 FJ Composite Details
- 7.27.2 FJ Composite Major Business
- 7.27.3 FJ Composite Power Electronic DCB & AMB Substrates Product and Services
- 7.27.4 FJ Composite Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.27.5 FJ Composite Recent Developments/Updates
- 7.27.6 FJ Composite Competitive Strengths & Weaknesses
- 7.28 Anhui Taoxinke Semiconductor
- 7.28.1 Anhui Taoxinke Semiconductor Details
- 7.28.2 Anhui Taoxinke Semiconductor Major Business
- 7.28.3 Anhui Taoxinke Semiconductor Power Electronic DCB & AMB Substrates Product and Services
- 7.28.4 Anhui Taoxinke Semiconductor Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.28.5 Anhui Taoxinke Semiconductor Recent Developments/Updates
- 7.28.6 Anhui Taoxinke Semiconductor Competitive Strengths & Weaknesses
- 7.29 Guangde Dongfeng Semiconductor
- 7.29.1 Guangde Dongfeng Semiconductor Details
- 7.29.2 Guangde Dongfeng Semiconductor Major Business
- 7.29.3 Guangde Dongfeng Semiconductor Power Electronic DCB & AMB Substrates Product and Services
- 7.29.4 Guangde Dongfeng Semiconductor Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.29.5 Guangde Dongfeng Semiconductor Recent Developments/Updates
- 7.29.6 Guangde Dongfeng Semiconductor Competitive Strengths & Weaknesses
- 7.30 Suzhou Aicheng Technology
- 7.30.1 Suzhou Aicheng Technology Details
- 7.30.2 Suzhou Aicheng Technology Major Business
- 7.30.3 Suzhou Aicheng Technology Power Electronic DCB & AMB Substrates Product and Services
- 7.30.4 Suzhou Aicheng Technology Power Electronic DCB & AMB Substrates Production, Price, Value, Gross Margin and Market Share (2021-2026)
- 7.30.5 Suzhou Aicheng Technology Recent Developments/Updates
- 7.30.6 Suzhou Aicheng Technology Competitive Strengths & Weaknesses
8 Industry Chain Analysis
- 8.1 Power Electronic DCB & AMB Substrates Industry Chain
- 8.2 Power Electronic DCB & AMB Substrates Upstream Analysis
- 8.2.1 Power Electronic DCB & AMB Substrates Core Raw Materials
- 8.2.2 Main Manufacturers of Power Electronic DCB & AMB Substrates Core Raw Materials
- 8.3 Midstream Analysis
- 8.4 Downstream Analysis
- 8.5 Power Electronic DCB & AMB Substrates Production Mode
- 8.6 Power Electronic DCB & AMB Substrates Procurement Model
- 8.7 Power Electronic DCB & AMB Substrates Industry Sales Model and Sales Channels
- 8.7.1 Power Electronic DCB & AMB Substrates Sales Model
- 8.7.2 Power Electronic DCB & AMB Substrates Typical Distributors
9 Research Findings and Conclusion
10 Appendix
- 10.1 Methodology
- 10.2 Research Process and Data Source
The global Power Electronic DCB & AMB Substrates market size is expected to reach $ 2295 million by 2032, rising at a market growth of 11.9% CAGR during the forecast period (2026-2032).
DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. This report studies the DBC ceramic substrate, including the AlN DBC Ceramic Substrate and Al2O3 DBC Ceramic Substrate. Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.
The global DBC ceramic substrates market is dominated by few players like Rogers Corporation, Ferrotec, NGK Electronics Devices, KCC, Shengda Tech, BYD, Heraeus Electronics and Nanjing Zhongjiang New Material, etc. Global five players hold a share over 79.8 percent in 2024. In recent years, more and more Chinese players enter the DBC ceramic substrates market, driven by the rapid growth of new energy vehicles in China market. In future, the Chinese players will play more roles around the world.
The global key manufacturers of AMB Ceramic Substrate include Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials, etc. In 2023, the global top eight players had a share approximately 85% in terms of revenue.
Currently the AMB ceramic substrates are mainly produced in Japan, Germany and China, which account for 27.3%, 24.56% and 43.5% of the market share respectively in 2023. It is expected that China's production share will reach 57% in 2030. As NGK Electronics Devices and Ferrotec have started or built factories to produce AMB in Malaysia, Southeast Asia is expected to play an important role as a production base in the next few years.
This report studies the global Power Electronic DCB & AMB Substrates production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Power Electronic DCB & AMB Substrates and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Power Electronic DCB & AMB Substrates that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Power Electronic DCB & AMB Substrates total production and demand, 2021-2032, (Square Meters)
Global Power Electronic DCB & AMB Substrates total production value, 2021-2032, (USD Million)
Global Power Electronic DCB & AMB Substrates production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Square Meters), (based on production site)
Global Power Electronic DCB & AMB Substrates consumption by region & country, CAGR, 2021-2032 & (Square Meters)
U.S. VS China: Power Electronic DCB & AMB Substrates domestic production, consumption, key domestic manufacturers and share
Global Power Electronic DCB & AMB Substrates production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Square Meters)
Global Power Electronic DCB & AMB Substrates production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Square Meters)
Global Power Electronic DCB & AMB Substrates production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Square Meters)
This report profiles key players in the global Power Electronic DCB & AMB Substrates market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Rogers Corporation, Heraeus Electronics, Kyocera, NGK Electronics Devices, Toshiba Materials, Denka, DOWA METALTECH, KCC, Proterial, Mitsubishi Materials, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Power Electronic DCB & AMB Substrates market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Square Meters) and average price (US$/Sq m) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Power Electronic DCB & AMB Substrates Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Power Electronic DCB & AMB Substrates Market, Segmentation by Type:
DBC Ceramic Substrates
AMB Ceramic Substrate
Global Power Electronic DCB & AMB Substrates Market, Segmentation by Application:
Automotive & EV/HEV
PV and Wind Power
Industrial Drives
Rail Transport
Consumer & White Goods
Military & Avionics
Thermoelectric Module (TEM)
Others
Companies Profiled:
Rogers Corporation
Heraeus Electronics
Kyocera
NGK Electronics Devices
Toshiba Materials
Denka
DOWA METALTECH
KCC
Proterial
Mitsubishi Materials
Jiangsu Fulehua Semiconductor Technology
BYD
Bomin Electronics
Zhejiang TC Ceramic Electronic
Shengda Tech
Beijing Moshi Technology
Nantong Winspower
Wuxi Tianyang Electronics
Fengpeng Electronics (Zhuhai)
Guangzhou Xianyi Electronic Technology
Fujian Huaqing Electronic Material Technology
Konfoong Materials International
Chengdu Wanshida Ceramic Industry
Littelfuse IXYS
Zhejiang Jingci Semiconductor
Taotao Technology
FJ Composite
Anhui Taoxinke Semiconductor
Guangde Dongfeng Semiconductor
Suzhou Aicheng Technology
Key Questions Answered:
1. How big is the global Power Electronic DCB & AMB Substrates market?
2. What is the demand of the global Power Electronic DCB & AMB Substrates market?
3. What is the year over year growth of the global Power Electronic DCB & AMB Substrates market?
4. What is the production and production value of the global Power Electronic DCB & AMB Substrates market?
5. Who are the key producers in the global Power Electronic DCB & AMB Substrates market?
6. What are the growth factors driving the market demand?