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Global Plating for Microelectronics Market Data Survey Report 2013-2025

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Table of Contents

    1 Global Market Overview

    • 1.1 Scope of Statistics
      • 1.1.1 Scope of Products
      • 1.1.2 Scope of Manufacturers
      • 1.1.3 Scope of Application
      • 1.1.4 Scope of Type
      • 1.1.5 Scope of Regions/Countries
    • 1.2 Global Market Size

    2 Regional Market

    • 2.1 Regional Production
    • 2.2 Regional Demand
    • 2.3 Regional Trade

    3 Key Manufacturers

    • 3.1 DOW
      • 3.1.1 Company Information
      • 3.1.2 Product & Services
      • 3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.1.4 Recent Development
    • 3.2 Mitsubishi Materials Corporation
      • 3.2.1 Company Information
      • 3.2.2 Product & Services
      • 3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.2.4 Recent Development
    • 3.3 Heraeus
      • 3.3.1 Company Information
      • 3.3.2 Product & Services
      • 3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.3.4 Recent Development
    • 3.4 XiLong Scientific
      • 3.4.1 Company Information
      • 3.4.2 Product & Services
      • 3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.4.4 Recent Development
    • 3.5 Atotech
      • 3.5.1 Company Information
      • 3.5.2 Product & Services
      • 3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.5.4 Recent Development
    • 3.6 Yamato Denki
      • 3.6.1 Company Information
      • 3.6.2 Product & Services
      • 3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.6.4 Recent Development
    • 3.7 Meltex
      • 3.7.1 Company Information
      • 3.7.2 Product & Services
      • 3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.7.4 Recent Development
    • 3.8 Ishihara Chemical
      • 3.8.1 Company Information
      • 3.8.2 Product & Services
      • 3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.8.4 Recent Development
    • 3.9 Raschig GmbH
      • 3.9.1 Company Information
      • 3.9.2 Product & Services
      • 3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.9.4 Recent Development
    • 3.10 Japan Pure Chemical
      • 3.10.1 Company Information
      • 3.10.2 Product & Services
      • 3.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.10.4 Recent Development
    • 3.11 Coatech
      • 3.11.1 Company Information
      • 3.11.2 Product & Services
      • 3.11.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.11.4 Recent Development
    • 3.12 MAGNETO special anodes
      • 3.12.1 Company Information
      • 3.12.2 Product & Services
      • 3.12.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.12.4 Recent Development
    • 3.13 Vopelius Chemie AG
      • 3.13.1 Company Information
      • 3.13.2 Product & Services
      • 3.13.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.13.4 Recent Development
    • 3.14 Moses Lake Industries
      • 3.14.1 Company Information
      • 3.14.2 Product & Services
      • 3.14.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    • 3.15 JCU International
      • 3.15.1 Company Information
      • 3.15.2 Product & Services
      • 3.15.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)

    4 Major Application

    • 4.1 Gold
      • 4.1.1 Overview
      • 4.1.2 Gold Market Size and Forecast
    • 4.2 Zinc
      • 4.2.1 Overview
      • 4.2.2 Zinc Market Size and Forecast
    • 4.3 Nickel
      • 4.3.1 Overview
      • 4.3.2 Nickel Market Size and Forecast
    • 4.4 Bronze
      • 4.4.1 Overview
      • 4.4.2 Bronze Market Size and Forecast
    • 4.5 Tin
      • 4.5.1 Overview
      • 4.5.2 Tin Market Size and Forecast
    • 4.6 Copper
      • 4.6.1 Overview
      • 4.6.2 Copper Market Size and Forecast
    • 4.7 Others
      • 4.7.1 Overview
      • 4.7.2 Others Market Size and Forecast

    5 Market by Type

      5.By Electroplating

      • 5.1 Electroplating
        • 5.1.1 Overview
        • 5.1.2 Electroplating Market Size and Forecast
      • 5.2 Electroless
        • 5.2.1 Overview
        • 5.2.2 Electroless Market Size and Forecast
      • 5.3 Immersion
        • 5.3.1 Overview
        • 5.3.2 Immersion Market Size and Forecast

      6 Price Overview

      • 6.1 Price by Manufacturers
      • 6.2 Price by Application
      • 6.3 Price by Type

      7 Conclusion

      Summary
      The global Plating for Microelectronics market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including:
      Global market size and forecast
      Regional market size, production data and export & import
      Key manufacturers profile, products & services, sales data of business
      Global market size by Major Application
      Global market size by Major Type
      Key manufacturers are included based on company profile, sales data and product specifications etc.:
      DOW
      Mitsubishi Materials Corporation
      Heraeus
      XiLong Scientific
      Atotech
      Yamato Denki
      Meltex
      Ishihara Chemical
      Raschig GmbH
      Japan Pure Chemical
      Coatech
      MAGNETO special anodes
      Vopelius Chemie AG
      Moses Lake Industries
      JCU International
      Major applications as follows:
      Gold
      Zinc
      Nickel
      Bronze
      Tin
      Copper
      Others
      Major Type as follows:
      Electroplating
      Electroless
      Immersion
      Regional market size, production data and export & import:
      Asia-Pacific
      North America
      Europe
      South America
      Middle East & Africa

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