Summary

A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. Components – capacitors, resistors or active devices – are generally soldered on the PCB. PCBA refer to Printed Circuit Board Assembly. In assembly the bare board is populated (or "stuffed") with electronic components to form a functional printed circuit assembly (PCA), which called a "printed circuit board assembly" (PCBA)

The global PCB & PCBA market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including:

Global market size and forecast

Regional market size, production data and export & import

Key manufacturers profile, products & services, sales data of business

Global market size by Major Application

Global market size by Major Type

Key manufacturers are included based on company profile, sales data and product specifications etc.:

Nippon Mektron

Unimicron

SEMCO

Young Poong Group

Ibiden

ZDT

Tripod

TTM

SEI

Daeduck Group

HannStar Board (GBM)

Viasystems

Nanya PCB

CMK Corporation

Shinko Electric Ind

Compeq

AT&S

Kingboard

Ellington

Junda Electronic

CCTC

Redboard

Wuzhou Group

Kinwong

Aoshikang

Shennan Circuits

Major applications as follows:

Consumer electronics

Computer

Communications

Industrial/Medical

Automotive

Military/Aerospace

Others

Major Type as follows:

Rigid 1-2Sided

Standard Multilayer

HDI/Microvia/Build-Up

IC Substrate

Flexible Circuits

Rigid Flex

Others

Regional market size, production data and export & import:

Asia-Pacific

North America

Europe

South America

Middle East & Africa

Table of Contents
1 Global Market Overview
1.1 Scope of Statistics
1.1.1 Scope of Products
1.1.2 Scope of Manufacturers
1.1.3 Scope of Application
1.1.4 Scope of Type
1.1.5 Scope of Regions/Countries
1.2 Global Market Size
2 Regional Market
2.1 Regional Production
2.2 Regional Demand
2.3 Regional Trade
3 Key Manufacturers
3.1 Nippon Mektron
3.1.1 Company Information
3.1.2 Product & Services
3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.1.4 Recent Development
3.2 Unimicron
3.2.1 Company Information
3.2.2 Product & Services
3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.2.4 Recent Development
3.3 SEMCO
3.3.1 Company Information
3.3.2 Product & Services
3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.3.4 Recent Development
3.4 Young Poong Group
3.4.1 Company Information
3.4.2 Product & Services
3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.4.4 Recent Development
3.5 Ibiden
3.5.1 Company Information
3.5.2 Product & Services
3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.5.4 Recent Development
3.6 ZDT
3.6.1 Company Information
3.6.2 Product & Services
3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.6.4 Recent Development
3.7 Tripod
3.7.1 Company Information
3.7.2 Product & Services
3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.7.4 Recent Development
3.8 TTM
3.8.1 Company Information
3.8.2 Product & Services
3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.8.4 Recent Development
3.9 SEI
3.9.1 Company Information
3.9.2 Product & Services
3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.9.4 Recent Development
3.10 Daeduck Group
3.10.1 Company Information
3.10.2 Product & Services
3.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.10.4 Recent Development
3.11 HannStar Board (GBM)
3.11.1 Company Information
3.11.2 Product & Services
3.11.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.11.4 Recent Development
3.12 Viasystems
3.12.1 Company Information
3.12.2 Product & Services
3.12.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.12.4 Recent Development
3.13 Nanya PCB
3.13.1 Company Information
3.13.2 Product & Services
3.13.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.13.4 Recent Development
3.14 CMK Corporation
3.14.1 Company Information
3.14.2 Product & Services
3.14.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.14.4 Recent Development
3.15 Shinko Electric Ind
3.15.1 Company Information
3.15.2 Product & Services
3.15.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.15.4 Recent Development
3.16 Compeq
3.16.1 Company Information
3.16.2 Product & Services
3.16.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.16.4 Recent Development
3.17 AT&S
3.17.1 Company Information
3.17.2 Product & Services
3.17.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.17.4 Recent Development
3.18 Kingboard
3.18.1 Company Information
3.18.2 Product & Services
3.18.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.18.4 Recent Development
3.19 Ellington
3.19.1 Company Information
3.19.2 Product & Services
3.19.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.19.4 Recent Development
3.20 Junda Electronic
3.20.1 Company Information
3.20.2 Product & Services
3.20.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.20.4 Recent Development
3.21 CCTC
3.21.1 Company Information
3.21.2 Product & Services
3.21.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.21.4 Recent Development
3.22 Redboard
3.22.1 Company Information
3.22.2 Product & Services
3.22.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.22.4 Recent Development
3.23 Wuzhou Group
3.23.1 Company Information
3.23.2 Product & Services
3.23.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.23.4 Recent Development
3.24 Kinwong
3.24.1 Company Information
3.24.2 Product & Services
3.24.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.24.4 Recent Development
3.25 Aoshikang
3.25.1 Company Information
3.25.2 Product & Services
3.25.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.26 Shennan Circuits
3.26.1 Company Information
3.26.2 Product & Services
3.26.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
4 Major Application
4.1 Consumer electronics
4.1.1 Overview
4.1.2 Consumer electronics Market Size and Forecast
4.2 Computer
4.2.1 Overview
4.2.2 Computer Market Size and Forecast
4.3 Communications
4.3.1 Overview
4.3.2 Communications Market Size and Forecast
4.4 Industrial/Medical
4.4.1 Overview
4.4.2 Industrial/Medical Market Size and Forecast
4.5 Automotive
4.5.1 Overview
4.5.2 Automotive Market Size and Forecast
4.6 Military/Aerospace
4.6.1 Overview
4.6.2 Military/Aerospace Market Size and Forecast
4.7 Others
4.7.1 Overview
4.7.2 Others Market Size and Forecast
5 Market by Type
5.By Rigid 1-2Sided
5.1 Rigid 1-2Sided
5.1.1 Overview
5.1.2 Rigid 1-2Sided Market Size and Forecast
5.2 Standard Multilayer
5.2.1 Overview
5.2.2 Standard Multilayer Market Size and Forecast
5.3 HDI/Microvia/Build-Up
5.3.1 Overview
5.3.2 HDI/Microvia/Build-Up Market Size and Forecast
5.4 IC Substrate
5.4.1 Overview
5.4.2 IC Substrate Market Size and Forecast
5.5 Flexible Circuits
5.5.1 Overview
5.5.2 Flexible Circuits Market Size and Forecast
5.6 Rigid Flex
5.6.1 Overview
5.6.2 Rigid Flex Market Size and Forecast
5.7 Others
5.7.1 Overview
5.7.2 Others Market Size and Forecast
6 Price Overview
6.1 Price by Manufacturers
6.2 Price by Application
6.3 Price by Type
7 Conclusion