Table of Content

1 Market Overview

• 1.1 Market Segment Overview
  • 1.1.1 Product Definition
  • 1.1.2 Market by Type
    • 1.1.2.1 PCM
    • 1.1.2.2 ReRAM
    • 1.1.2.3 MRAM
    • 1.1.2.4 FeRAM
  • 1.1.3 Market by Application
    • 1.1.3.1 Consumer Electronics
    • 1.1.3.2 Enterprise storage
    • 1.1.3.3 Automotive and transportation
    • 1.1.3.4 Military and aerospace
    • 1.1.3.5 Telecommunications
    • 1.1.3.6 Others
• 1.2 Global and China Market Size
  • 1.2.1 Global Overview
  • 1.2.2 China Overview

2 Global and China Market by Company

• 2.1 Global
  • 2.1.1 Global Sales by Company
  • 2.1.2 Global Price by Company
• 2.2 China
  • 2.2.1 China Sales by Company
  • 2.2.2 China Price by Company

3 Global and China Market by Type

• 3.1 Global
  • 3.1.1 Global Sales by Type
  • 3.1.2 Global Price by Type
• 3.2 China
  • 3.2.1 China Sales by Type
  • 3.2.2 China Price by Type

4 Global and China Market by Application

• 4.1 Global
  • 4.1.1 Global Sales by Application
  • 4.1.2 Global Price by Application
• 4.2 China
  • 4.2.1 China Sales by Application
  • 4.2.2 China Price by Application

5 China Trade

• 5.1 Export
• 5.2 Import

6 Key Manufacturers

• 6.1 Intel
  • 6.1.1 Company Information
  • 6.1.2 Product Specifications
  • 6.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
• 6.2 Micron Technology
• 6.3 Panasonic
• 6.4 Cypress Semiconductor
• 6.5 Fujitsu
• 6.6 Everspin
• 6.7 ROHM Semiconductor
• 6.8 Adesto Technologies
• 6.9 Crossbar

7 Industry Upstream

• 7.1 Industry Chain
• 7.2 Raw Materials

8 Market Environment

• 8.1 SWOT
• 8.2 Porter's Five Forces

9 Conclusion

Summary
The Next Generation Memory is cost effective and provides faster memory solutions whereas older memory technologies have limitations because of their outdated architecture and higher power consumption. The Next Generation Memory provides high data transmission speed and high storage capacity. And Next Generation Memory likely will first supplement existing memory technology to help overcome the latter’s scaling deficiencies.
Market Segment as follows:
By Type
PCM
ReRAM
MRAM
FeRAM
By Application
Consumer Electronics
Enterprise storage
Automotive and transportation
Military and aerospace
Telecommunications
Others
By Company
Intel
Micron Technology
Panasonic
Cypress Semiconductor
Fujitsu
Everspin
ROHM Semiconductor
Adesto Technologies
Crossbar
The main contents of the report including:
Section 1:
Product definition, type and application, global and China market overview;
Section 2:
Global and China Market competition by company;
Section 3:
Global and China sales revenue, volume and price by type;
Section 4:
Global and China sales revenue, volume and price by application;
Section 5:
China export and import;
Section 6:
Company information, business overview, sales data and product specifications;
Section 7:
Industry chain and raw materials;
Section 8:
SWOT and Porter's Five Forces;
Section 9:
Conclusion.