New Packages and Materials for Power Devices Market Report – Research, Industry Analysis Reports and Market Demands

Global New Packages and Materials for Power Devices Market Growth 2019-2024

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Table of Content

2019-2024 Global New Packages and Materials for Power Devices Consumption Market Report

1 Scope of the Report

2 Executive Summary

2.1 World Market Overview
- 2.1.1 Global New Packages and Materials for Power Devices Consumption 2014-2024
- 2.1.2 New Packages and Materials for Power Devices Consumption CAGR by Region
2.2 New Packages and Materials for Power Devices Segment by Type
- 2.2.1 Wire Bonding Packaging
- 2.2.2 Gallium Nitrid (GaN)
- 2.2.3 Chip-scale Packaging
- 2.2.4 Gallium Arsenide
- 2.2.5 Silicon Carbide
- 2.2.6 Others
2.3 New Packages and Materials for Power Devices Consumption by Type
- 2.3.1 Global New Packages and Materials for Power Devices Consumption Market Share by Type (2014-2019)
- 2.3.2 Global New Packages and Materials for Power Devices Revenue and Market Share by Type (2014-2019)
- 2.3.3 Global New Packages and Materials for Power Devices Sale Price by Type (2014-2019)
2.4 New Packages and Materials for Power Devices Segment by Application
- 2.4.1 Telecommunications and Computing
- 2.4.2 Industrial
- 2.4.3 Electronics
- 2.4.4 Automotive
- 2.4.5 Others
2.5 New Packages and Materials for Power Devices Consumption by Application
- 2.5.1 Global New Packages and Materials for Power Devices Consumption Market Share by Application (2014-2019)
- 2.5.2 Global New Packages and Materials for Power Devices Value and Market Share by Application (2014-2019)
- 2.5.3 Global New Packages and Materials for Power Devices Sale Price by Application (2014-2019)

3 Global New Packages and Materials for Power Devices by Players

3.1 Global New Packages and Materials for Power Devices Sales Market Share by Players
- 3.1.1 Global New Packages and Materials for Power Devices Sales by Players (2017-2019)
- 3.1.2 Global New Packages and Materials for Power Devices Sales Market Share by Players (2017-2019)
3.2 Global New Packages and Materials for Power Devices Revenue Market Share by Players
- 3.2.1 Global New Packages and Materials for Power Devices Revenue by Players (2017-2019)
- 3.2.2 Global New Packages and Materials for Power Devices Revenue Market Share by Players (2017-2019)
3.3 Global New Packages and Materials for Power Devices Sale Price by Players
3.4 Global New Packages and Materials for Power Devices Manufacturing Base Distribution, Sales Area, Product Types by Players
- 3.4.1 Global New Packages and Materials for Power Devices Manufacturing Base Distribution and Sales Area by Players
- 3.4.2 Players New Packages and Materials for Power Devices Products Offered
3.5 Market Concentration Rate Analysis
- 3.5.1 Competition Landscape Analysis
- 3.5.2 Concentration Ratio (CR3, CR5 and CR10) (2017-2019)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion

4 New Packages and Materials for Power Devices by Regions

4.1 New Packages and Materials for Power Devices by Regions
- 4.1.1 Global New Packages and Materials for Power Devices Consumption by Regions
- 4.1.2 Global New Packages and Materials for Power Devices Value by Regions
4.2 Americas New Packages and Materials for Power Devices Consumption Growth
4.3 APAC New Packages and Materials for Power Devices Consumption Growth
4.4 Europe New Packages and Materials for Power Devices Consumption Growth
4.5 Middle East & Africa New Packages and Materials for Power Devices Consumption Growth

5 Americas

5.1 Americas New Packages and Materials for Power Devices Consumption by Countries
- 5.1.1 Americas New Packages and Materials for Power Devices Consumption by Countries (2014-2019)
- 5.1.2 Americas New Packages and Materials for Power Devices Value by Countries (2014-2019)
5.2 Americas New Packages and Materials for Power Devices Consumption by Type
5.3 Americas New Packages and Materials for Power Devices Consumption by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Key Economic Indicators of Few Americas Countries

6 APAC

6.1 APAC New Packages and Materials for Power Devices Consumption by Countries
- 6.1.1 APAC New Packages and Materials for Power Devices Consumption by Countries (2014-2019)
- 6.1.2 APAC New Packages and Materials for Power Devices Value by Countries (2014-2019)
6.2 APAC New Packages and Materials for Power Devices Consumption by Type
6.3 APAC New Packages and Materials for Power Devices Consumption by Application
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 Key Economic Indicators of Few APAC Countries

7 Europe

7.1 Europe New Packages and Materials for Power Devices by Countries
- 7.1.1 Europe New Packages and Materials for Power Devices Consumption by Countries (2014-2019)
- 7.1.2 Europe New Packages and Materials for Power Devices Value by Countries (2014-2019)
7.2 Europe New Packages and Materials for Power Devices Consumption by Type
7.3 Europe New Packages and Materials for Power Devices Consumption by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
7.9 Spain
7.10 Key Economic Indicators of Few Europe Countries

8 Middle East & Africa

8.1 Middle East & Africa New Packages and Materials for Power Devices by Countries
- 8.1.1 Middle East & Africa New Packages and Materials for Power Devices Consumption by Countries (2014-2019)
- 8.1.2 Middle East & Africa New Packages and Materials for Power Devices Value by Countries (2014-2019)
8.2 Middle East & Africa New Packages and Materials for Power Devices Consumption by Type
8.3 Middle East & Africa New Packages and Materials for Power Devices Consumption by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries

9 Market Drivers, Challenges and Trends

9.1 Market Drivers and Impact
- 9.1.1 Growing Demand from Key Regions
- 9.1.2 Growing Demand from Key Applications and Potential Industries
9.2 Market Challenges and Impact
9.3 Market Trends

10 Marketing, Distributors and Customer

10.1 Sales Channel
- 10.1.1 Direct Channels
- 10.1.2 Indirect Channels
10.2 New Packages and Materials for Power Devices Distributors
10.3 New Packages and Materials for Power Devices Customer

11 Global New Packages and Materials for Power Devices Market Forecast

11.1 Global New Packages and Materials for Power Devices Consumption Forecast (2019-2024)
11.2 Global New Packages and Materials for Power Devices Forecast by Regions
- 11.2.1 Global New Packages and Materials for Power Devices Forecast by Regions (2019-2024)
- 11.2.2 Global New Packages and Materials for Power Devices Value Forecast by Regions (2019-2024)
- 11.2.3 Americas Consumption Forecast
- 11.2.4 APAC Consumption Forecast
- 11.2.5 Europe Consumption Forecast
- 11.2.6 Middle East & Africa Consumption Forecast
11.3 Americas Forecast by Countries
- 11.3.1 United States Market Forecast
- 11.3.2 Canada Market Forecast
- 11.3.3 Mexico Market Forecast
- 11.3.4 Brazil Market Forecast
11.4 APAC Forecast by Countries
- 11.4.1 China Market Forecast
- 11.4.2 Japan Market Forecast
- 11.4.3 Korea Market Forecast
- 11.4.4 Southeast Asia Market Forecast
- 11.4.5 India Market Forecast
- 11.4.6 Australia Market Forecast
11.5 Europe Forecast by Countries
- 11.5.1 Germany Market Forecast
- 11.5.2 France Market Forecast
- 11.5.3 UK Market Forecast
- 11.5.4 Italy Market Forecast
- 11.5.5 Russia Market Forecast
- 11.5.6 Spain Market Forecast
11.6 Middle East & Africa Forecast by Countries
- 11.6.1 Egypt Market Forecast
- 11.6.2 South Africa Market Forecast
- 11.6.3 Israel Market Forecast
- 11.6.4 Turkey Market Forecast
- 11.6.5 GCC Countries Market Forecast
11.7 Global New Packages and Materials for Power Devices Forecast by Type
11.8 Global New Packages and Materials for Power Devices Forecast by Application

12 Key Players Analysis

13 Research Findings and Conclusion

Description

SIC (silicon carbide) and GaN (gallium nitride) have emerged as the preferred material for making packages for high-intensity semiconductors and power devices. Such materials can support high temperature power circuits and withstand high voltage.
At the same time the power semiconductor market is undergoing a period of change. Driven by the need for increased power density and system efficiency, wide band gap (WBG) materials such as SiC and gallium nitride (GaN) are being adopted in many applications. These WBG devices require new packages, materials, and assembly methods.

According to this study, over the next five years the New Packages and Materials for Power Devices market will register a xx% CAGR in terms of revenue, the global market size will reach US$ xx million by 2024, from US$ xx million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in New Packages and Materials for Power Devices business, shared in Chapter 3.

This report presents a comprehensive overview, market shares, and growth opportunities of New Packages and Materials for Power Devices market by product type, application, key manufacturers and key regions and countries.

This study considers the New Packages and Materials for Power Devices value and volume generated from the sales of the following segments:

Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
Wire Bonding Packaging
Gallium Nitrid (GaN)
Chip-scale Packaging
Gallium Arsenide
Silicon Carbide
Others
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Telecommunications and Computing
Industrial
Electronics
Automotive
Others

This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
Littelfuse
Remtec, Inc.
MITSUBISHI ELECTRIC CORPORATION
Amkor Technology
Orient Semiconductor Electronics Ltd.
Infineon Technologies AG
SEMIKRON
ROHM SEMICONDUCTOR
STMicroelectronics
NXP Semiconductor
Exagan
ON Semiconductor
Efficient Power Conversion Corporation

In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.

Research objectives
To study and analyze the global New Packages and Materials for Power Devices consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of New Packages and Materials for Power Devices market by identifying its various subsegments.
Focuses on the key global New Packages and Materials for Power Devices manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the New Packages and Materials for Power Devices with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of New Packages and Materials for Power Devices submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.