Summary

Multilayer printed-wiring boards are made from the same base material with copper foil on the top & bottom and one or more“inner layer”cores. The number of “layers” corresponds to the number of copper foil layers.

The global Multilayer Printed-wiring Board market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including:

Global market size and forecast

Regional market size, production data and export & import

Key manufacturers profile, products & services, sales data of business

Global market size by Major Application

Global market size by Major Type

Key manufacturers are included based on company profile, sales data and product specifications etc.:

Nippon Mektron

Zhen Ding Technology

Unimicron

Young Poong Group

Samsung Electro-Mechanics

Ibiden

Tripod

TTM Technologies

Sumitomo Electric SEI

Daeduck Group

Nanya PCB

Compeq

HannStar Board

LG Innotek

AT&S

Meiko

Chin-Poon

Shennan

WUS

Major applications as follows:

Consumer electronics

Communications

Computer related industry

Automotive industry

Others

Major Type as follows:

Layer 4~6

Layer 8~10

Layer 10+

Regional market size, production data and export & import:

Asia-Pacific

North America

Europe

South America

Middle East & Africa

Table of Contents
1 Global Market Overview
1.1 Scope of Statistics
1.1.1 Scope of Products
1.1.2 Scope of Manufacturers
1.1.3 Scope of Application
1.1.4 Scope of Type
1.1.5 Scope of Regions/Countries
1.2 Global Market Size
2 Regional Market
2.1 Regional Production
2.2 Regional Demand
2.3 Regional Trade
3 Key Manufacturers
3.1 Nippon Mektron
3.1.1 Company Information
3.1.2 Product & Services
3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.1.4 Recent Development
3.2 Zhen Ding Technology
3.2.1 Company Information
3.2.2 Product & Services
3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.2.4 Recent Development
3.3 Unimicron
3.3.1 Company Information
3.3.2 Product & Services
3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.3.4 Recent Development
3.4 Young Poong Group
3.4.1 Company Information
3.4.2 Product & Services
3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.4.4 Recent Development
3.5 Samsung Electro-Mechanics
3.5.1 Company Information
3.5.2 Product & Services
3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.5.4 Recent Development
3.6 Ibiden
3.6.1 Company Information
3.6.2 Product & Services
3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.6.4 Recent Development
3.7 Tripod
3.7.1 Company Information
3.7.2 Product & Services
3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.7.4 Recent Development
3.8 TTM Technologies
3.8.1 Company Information
3.8.2 Product & Services
3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.8.4 Recent Development
3.9 Sumitomo Electric SEI
3.9.1 Company Information
3.9.2 Product & Services
3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.9.4 Recent Development
3.10 Daeduck Group
3.10.1 Company Information
3.10.2 Product & Services
3.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.10.4 Recent Development
3.11 Nanya PCB
3.11.1 Company Information
3.11.2 Product & Services
3.11.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.11.4 Recent Development
3.12 Compeq
3.12.1 Company Information
3.12.2 Product & Services
3.12.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.12.4 Recent Development
3.13 HannStar Board
3.13.1 Company Information
3.13.2 Product & Services
3.13.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.13.4 Recent Development
3.14 LG Innotek
3.14.1 Company Information
3.14.2 Product & Services
3.14.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.14.4 Recent Development
3.15 AT&S
3.15.1 Company Information
3.15.2 Product & Services
3.15.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.15.4 Recent Development
3.16 Meiko
3.16.1 Company Information
3.16.2 Product & Services
3.16.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.16.4 Recent Development
3.17 Chin-Poon
3.17.1 Company Information
3.17.2 Product & Services
3.17.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.17.4 Recent Development
3.18 Shennan
3.18.1 Company Information
3.18.2 Product & Services
3.18.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.19 WUS
3.19.1 Company Information
3.19.2 Product & Services
3.19.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
4 Major Application
4.1 Consumer electronics
4.1.1 Overview
4.1.2 Consumer electronics Market Size and Forecast
4.2 Communications
4.2.1 Overview
4.2.2 Communications Market Size and Forecast
4.3 Computer related industry
4.3.1 Overview
4.3.2 Computer related industry Market Size and Forecast
4.4 Automotive industry
4.4.1 Overview
4.4.2 Automotive industry Market Size and Forecast
4.5 Others
4.5.1 Overview
4.5.2 Others Market Size and Forecast
5 Market by Type
5.By Layer 4~6
5.1 Layer 4~6
5.1.1 Overview
5.1.2 Layer 4~6 Market Size and Forecast
5.2 Layer 8~10
5.2.1 Overview
5.2.2 Layer 8~10 Market Size and Forecast
5.3 Layer 10+
5.3.1 Overview
5.3.2 Layer 10+ Market Size and Forecast
6 Price Overview
6.1 Price by Manufacturers
6.2 Price by Application
6.3 Price by Type
7 Conclusion