Table of Content

1 Market Overview

• 1.1 Market Segment Overview
  • 1.1.1 Product Definition
  • 1.1.2 Market by Type
    • 1.1.2.1 Layer 4-6
    • 1.1.2.2 Layer 8-10
    • 1.1.2.3 Layer 10+
  • 1.1.3 Market by Application
    • 1.1.3.1 Smart Packaging
    • 1.1.3.2 Smart Cards
    • 1.1.3.3 Consumer Electronics
    • 1.1.3.4 Medical Devices
    • 1.1.3.5 Wearable Devices
    • 1.1.3.6 Entertainment
    • 1.1.3.7 Wireless Communication
    • 1.1.3.8 Others
• 1.2 Global and China Market Size
  • 1.2.1 Global Overview
  • 1.2.2 China Overview

2 Global and China Market by Company

• 2.1 Global
  • 2.1.1 Global Sales by Company
  • 2.1.2 Global Price by Company
• 2.2 China
  • 2.2.1 China Sales by Company
  • 2.2.2 China Price by Company

3 Global and China Market by Type

• 3.1 Global
  • 3.1.1 Global Sales by Type
  • 3.1.2 Global Price by Type
• 3.2 China
  • 3.2.1 China Sales by Type
  • 3.2.2 China Price by Type

4 Global and China Market by Application

• 4.1 Global
  • 4.1.1 Global Sales by Application
  • 4.1.2 Global Price by Application
• 4.2 China
  • 4.2.1 China Sales by Application
  • 4.2.2 China Price by Application

5 China Trade

• 5.1 Export
• 5.2 Import

6 Key Manufacturers

• 6.1 Nippon Mektron
  • 6.1.1 Company Information
  • 6.1.2 Product Specifications
  • 6.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
• 6.2 ZD Tech
• 6.3 TTM Technologies
• 6.4 Unimicron
• 6.5 Sumitomo Denko
• 6.6 Compeq
• 6.7 Tripod
• 6.8 Samsung E-M
• 6.9 Young Poong Group
• 6.10 HannStar
• 6.11 Ibiden
• 6.12 Nanya PCB
• 6.13 KBC PCB Group
• 6.14 Daeduck Group
• 6.15 AT&S
• 6.16 Fujikura
• 6.17 Meiko
• 6.18 Multek
• 6.19 Kinsus
• 6.20 Chin Poon
• 6.21 T.P.T.
• 6.22 Shinko Denski
• 6.23 Wus Group
• 6.24 Simmtech
• 6.25 Mflex
• 6.26 LG Innotek
• 6.27 Gold Circuit
• 6.28 Shennan Circuit
• 6.29 Kinwong
• 6.30 Founder Tech

7 Industry Upstream

• 7.1 Industry Chain
• 7.2 Raw Materials

8 Market Environment

• 8.1 SWOT
• 8.2 Porter's Five Forces

9 Conclusion

Summary

Market Segment as follows:
By Type
Layer 4-6
Layer 8-10
Layer 10+
By Application
Smart Packaging
Smart Cards
Consumer Electronics
Medical Devices
Wearable Devices
Entertainment
Wireless Communication
Others
By Company
Nippon Mektron
ZD Tech
TTM Technologies
Unimicron
Sumitomo Denko
Compeq
Tripod
Samsung E-M
Young Poong Group
HannStar
Ibiden
Nanya PCB
KBC PCB Group
Daeduck Group
AT&S
Fujikura
Meiko
Multek
Kinsus
Chin Poon
T.P.T.
Shinko Denski
Wus Group
Simmtech
Mflex
LG Innotek
Gold Circuit
Shennan Circuit
Kinwong
Founder Tech
The main contents of the report including:
Section 1:
Product definition, type and application, global and China market overview;
Section 2:
Global and China Market competition by company;
Section 3:
Global and China sales revenue, volume and price by type;
Section 4:
Global and China sales revenue, volume and price by application;
Section 5:
China export and import;
Section 6:
Company information, business overview, sales data and product specifications;
Section 7:
Industry chain and raw materials;
Section 8:
SWOT and Porter's Five Forces;
Section 9:
Conclusion.